The Experts below are selected from a list of 258 Experts worldwide ranked by ideXlab platform
Chengchih Chen - One of the best experts on this subject based on the ideXlab platform.
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A global supply chain collaboration to synergize technology achievement for Green QFN qualification
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012Co-Authors: Jeffrey Changbing Lee, Graver Chang, Chengchih Chen, Cherie Chen, Jandel LinAbstract:QFN (Quad flat no-lead) package has become a necessary IC package type covering low cost and high performance needs throughout consumer, telecommunication (wireless handset, power management, analog baseband and Bluetooth) to high end Electronics Product application due to its small form factor and excellent thermal and electrical performance compared to similar size IC package [1]. With more and more requirements, the QFN package is developed toward multi-row, thinner, large package size, high I/O around 100~400, fine pitch <;0.4mm, larger die supporting, Green compliance and so on. Compared with the FBGA, QFN can reduce IC package dimension to half due to substrate elimination, as well the entire packaging assembly cost can be reduce 25% [2, 3]. From the perspective of IC package designer and assembler, it will be more difficult to consider further the compatibility with the users like SMT assembler and PCB fabricator to well use the developing and innovative QFN package. Therefore, one new business model will be suggested to overcome the above issue [4]. In the paper, the real examples from the collaboration of supply chain on the green QFN package qualification through board level acceleration temperature cycling testing (ATC) will be taken to explain how to address the package verification from the design of package and PCB, PCB assembly, reliability test and failure analysis. The 3 key factors on the QFN package, PCB and PCBA must be incorporated for design consideration to conclude a total QFN package solution for end Product application. Furthermore, the actual benefit in the supply chain will be also discussed in terms of collaboration working model.
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A new innovative model for green QFN qualification
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Changbing Lee Jeffrey, Graver Chang, Chengchih Chen, Cherie Chen, Jandel LinAbstract:QFN (Quad flat no-lead) package has become a necessary IC package type covering low cost and high performance needs throughout consumer, telecommunication (wireless handset, power management, analog baseband and Bluetooth) to high end Electronics Product application due to its small form factor and excellent thermal and electrical performance compared to similar size IC package [1]. With more and more requirements, the QFN package is developed toward multi-row, thinner, large package size, high I/O around 100~400, fine pitch <;0.4mm, larger die supporting, Green compliance and so on. Compared with the FBGA, QFN can reduce IC package dimension to half due to substrate elimination, as well the entire packaging assembly cost can be reduce 25% [2, 3]. From the perspective of IC package designer and assembler, it will be more difficult to consider further the compatibility with the users like SMT assembler and PCB fabricator to well use the developing and innovative QFN package. Therefore, one new business model will be suggested to overcome the above issue [4]. In the paper, the real examples from the collaboration of supply chain on the green QFN package qualification through board level acceleration temperature cycling testing (ATC) will be taken to explain how to address the package verification from the design of package and PCB, PCB assembly, reliability test and failure analysis. The 3 key factors on the QFN package, PCB and PCBA must be incorporated for design consideration to conclude a total QFN package solution for end Product application. Furthermore, the actual benefit in the supply chain will be also discussed in terms of collaboration working model.
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A global supply chain collaboration to synergize technology achievement for Green QFN qualification
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012Co-Authors: Graver Chang, Cherie Chen, Chengchih ChenAbstract:QFN (Quad flat no-lead) package has become a necessary IC package type covering low cost and high performance needs throughout consumer, telecommunication (wireless handset, power management, analog baseband and Bluetooth) to high end Electronics Product application due to its small form factor and excellent thermal and electrical performance compared to similar size IC package [1]. With more and more requirements, the QFN package is developed toward multi-row, thinner, large package size, high I/O around 100~400, fine pitch
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A new innovative model for green QFN qualification
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Changbing Lee Jeffrey, Graver Chang, Cherie Chen, Chengchih ChenAbstract:QFN (Quad flat no-lead) package has become a necessary IC package type covering low cost and high performance needs throughout consumer, telecommunication (wireless handset, power management, analog baseband and Bluetooth) to high end Electronics Product application due to its small form factor and excellent thermal and electrical performance compared to similar size IC package [1]. With more and more requirements, the QFN package is developed toward multi-row, thinner, large package size, high I/O around 100~400, fine pitch
Carlos Martinez - One of the best experts on this subject based on the ideXlab platform.
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Vision-guided robotic assembly using uncalibrated vision
2011 IEEE International Conference on Mechatronics and Automation ICMA 2011, 2011Co-Authors: Biao Zhang, Gregory Rossano, Jianjun Wang, Carlos MartinezAbstract:Many consumer and industrial Electronics assemblies are predominantly repetitive manual tasks due to low startup costs and high flexibility. This allows the producer to easily scale back, increase or modify Production to respond to the rapidly changing marketplace. However with the rising wages in low-cost countries, and ergonomics and other health concerns, the Electronics industries look the automation solution again. The challenge for Electronics Product assembly automation is how to precisely aligning assembly features on small component for small part tight tolerance assemblies in quickly reconfigurable Production. Traditional automation or teach/repeat robotic automation is often prohibitive because of costly fixtures and too time consuming setup and ramp-up. This paper introduces a vision-guided robotic assembly method using uncalibrated vision. The conventional methods of vision-guided robotics in assembly automation solutions (e.g. traditional calibration and visual servoing) cannot perform the assemblies with the grasp error and visually inaccessible assembly features. The proposed vision-guided assembly system based on camera space manipulation (CSM) method, on the other hand, relies on a local calibration method to achieve the high accuracy alignment for the final assembly. Experimental verification is performed to test the accuracy of the alignment, the robustness to grasp error, and easy reconfiguration. Under one camera configuration, the 2D vision-guided assembly robot system successfully assembly the ideal test parts within sub-millimeter tolerance with no manual calibration. © 2011 IEEE.
D A Dickinson - One of the best experts on this subject based on the ideXlab platform.
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sustainability and end of life Product management a case study of Electronics collection scenarios
International Symposium on Electronics and the Environment, 2004Co-Authors: R J Caudill, D A DickinsonAbstract:The national Electronics Product stewardship initiative (NEPSI) was established by the US EPA to examine issues associated with Electronics recycling, engage in discussions to build consensus among all stakeholder groups, and recommend a strategy for developing a national Electronics recycling program. One of the outcomes of this effort was a set of guidelines describing a base level of service for collection and recycling which would apply across the country. Fundamental to the concept of base level of service is sustainability - the need to balance societal concerns for end-of-life Product management with system cost effectiveness and environmentally-sound operational strategies. the sustainability target method (STM), developed in close collaboration between Lucent Bell Labs and the Multi-lifecycle Engineering Research Center at NJIT, is used to evaluate various alternative collection scenarios. The key and unique feature of the STM is that it links the economic value of a system with its environmental impact by defining the relative indicator resource Productivity (RP) for impact and the absolute indicator eco-efficiency (EE) for sustainability, thereby providing practical sustainability criteria for evaluation.
Vishwesh Kirthivasan - One of the best experts on this subject based on the ideXlab platform.
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Application of fuzzy quality function deployment for sustainable design of consumer Electronics Products: a case study
Clean Technologies and Environmental Policy, 2017Co-Authors: Sekar Vinodh, S. Karthik Sundaram, K J Manjunatheshwara, Vishwesh KirthivasanAbstract:With a steep increase in the demand for consumer Electronics Products, the contemporary manufacturers are committed toward sustainable development of such Products. There exists a scope for developing a methodology for enabling sustainable development of consumer Electronics Products. In this context, fuzzy quality function deployment (QFD) approach has been presented in this article in order to prioritize relevant customer requirements, sustainability parameters and sustainability initiatives. Key influential parameters for sustainable development of consumer Electronics Products have been identified from the literature. In the first phase of fuzzy QFD, parameters influencing sustainable development have been prioritized in accordance with customer requirements. In the second phase, environmental design initiatives have been prioritized based on critical sustainability parameters. From phase I of fuzzy QFD, `reduction in environmental release' has been found as the most significant sustainability parameter with a crisp value of 22.83, and from phase II, environmental impact assessment is proved to be the significant design method with a crisp value of 20.40. The methodology would provide a comprehensive understanding to practitioners on the interrelationships among customer requirements, sustainability parameters and environmentally benign initiatives for development of consumer electronic Products. The generic model developed can be applied to most of the consumer Electronics Product.
Wei-lin Chen - One of the best experts on this subject based on the ideXlab platform.
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How can Electronics industries become green manufacturers in Taiwan and Japan
Clean Technologies and Environmental Policy, 2011Co-Authors: Shih Yuan Chiang, Chiu Chi Wei, Te-hsuan Chiang, Wei-lin ChenAbstract:The world's leading countries have reached a consensus concerning the need for environmental protection, and many international environmental protection rules and regulations have been implemented. Of these, the EU-legislated Restriction of the use of certain Hazardous Substances in electrical and electronic equipment (RoHS), Waste Electrical and Electronic Equipment (WEEE), and Eco-design of Energy-using Products (EuP) compel the Electronics industry to incorporate waste disposal considerations in Product design and manufacturing in order to benefit the environment. This study accordingly employed the ISO 14000 environmental management family's ISO 14031 environmental performance evaluation (EPE) standards as an assessment framework, and investigated the types of factors influencing environmental performance, and their level of importance, when the Electronics industry implements lead-free manufacturing. The study conducted a questionnaire survey of industry experts, scholars, and government officers in Taiwan and Japan-which constitute two of the world's leading Electronics Product manufacturing centers-employing the Delphi method to extract assessment indicators, and using the Analytic Hierarchy Process (AHP) method to analyze indicators' relative levels of importance. The results showed that the choice of lead-free substitute materials, soil heavy metal pollution, and compliance with environmental laws and regulations are the three important indicators of the environmental performance of lead-free manufacturing. As a consequence, when relevant industries adopt lead-free manufacturing in the future, they should first establish basic process technology, and also take their industries' process characteristics and the suitability of substitute materials into consideration. In order to maintain compliance with laws and regulations, and to reduce pollution emissions, such industries should cooperate with government in connection with waste and wastewater treatment. In addition, apart from implementing environmental policies and testing standards, government can facilitate the realization of environmental protection policies and help conserve corporate resources by providing assistance, specialized training, and incentive measures to industry. © 2010 Springer-Verlag.