The Experts below are selected from a list of 2055 Experts worldwide ranked by ideXlab platform
Kuan-neng Chen - One of the best experts on this subject based on the ideXlab platform.
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Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
Nanoscale Research Letters, 2014Co-Authors: Jian-yu Shih, Yen-chi Chen, Chih-hung Chiu, Chung-lun Lo, Chi-chung Chang, Kuan-neng ChenAbstract:This paper presents one wafer level packaging Approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer Fabrication Approach.
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A novel Si-based X'tal oscillator device using 3D integration technologies
Proceedings of Technical Program - 2014 International Symposium on VLSI Technology Systems and Application (VLSI-TSA), 2014Co-Authors: Jian-yu Shih, Yen-chi Chen, Chih-hung Chiu, Chung-lun Lo, Kuan-neng ChenAbstract:A novel Si-based X'tal oscillator device (1.2 mm × 1.0 mm) is demonstrated by using 3D integration technologies. It is distinct from conventional X'tal oscillator device with ceramics and metal lid. The novel Si-based X'tal oscillator device shows no leakage path, and passes the hermetic encapsulation test and reliability investigation. In addition, the novel device shows the excellent electrical characteristics and provides the possibility to replace the conventional Fabrication Approach for the next generation products.
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Advanced crystal component package with silicon TSV interposer using 3D integration and novel SU-8 polymer sealing bonding structure
2014 9th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2014Co-Authors: Jian-yu Shih, Yen-chi Chen, Chih-hung Chiu, Chung-lun Lo, Yu-chen Hu, Chi-chung Chang, Kuan-neng ChenAbstract:In this paper, a novel crystal component package based on silicon TSV interposer substrate is demonstrated by using 3D integration technologies. It is distinct from conventional crystal component using ceramic-based substrate. This crystal component with advanced silicon-based substrate shows great manufacturability to replace traditional Fabrication Approach. In addition, the SU-8 sealing bonding structure provides the possibility to substitute for the conventional metal lid with reliability investigation. Finally, a novel silicon-based crystal component package with 3D integration is successfully fabricated through general semiconductor techniques to replace traditional manufacture.
Erik M. J. Johansson - One of the best experts on this subject based on the ideXlab platform.
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Solution processed flexible and bending durable heterojunction colloidal quantum dot solar cell.
Nanoscale, 2015Co-Authors: Xiaoliang Zhang, Jindan Zhang, Jianhua Liu, Jingquan Zhang, Erik M. J. JohanssonAbstract:A flexible hybrid heterojunction PbS colloidal quantum dot solar cell, where the photoactive layers are deposited using a solution processed Fabrication Approach under ambient condition and at room temperature is presented. The bending stability of the obtained solar cell is evaluated. The results show that the solar cell exhibits high bending stability and even under the bent state the cell also maintains a high performance, which shows the potential of the quantum dot solar cell toward a lightweight, bendable power source with many possible applications.
Jian-yu Shih - One of the best experts on this subject based on the ideXlab platform.
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Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
Nanoscale Research Letters, 2014Co-Authors: Jian-yu Shih, Yen-chi Chen, Chih-hung Chiu, Chung-lun Lo, Chi-chung Chang, Kuan-neng ChenAbstract:This paper presents one wafer level packaging Approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer Fabrication Approach.
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A novel Si-based X'tal oscillator device using 3D integration technologies
Proceedings of Technical Program - 2014 International Symposium on VLSI Technology Systems and Application (VLSI-TSA), 2014Co-Authors: Jian-yu Shih, Yen-chi Chen, Chih-hung Chiu, Chung-lun Lo, Kuan-neng ChenAbstract:A novel Si-based X'tal oscillator device (1.2 mm × 1.0 mm) is demonstrated by using 3D integration technologies. It is distinct from conventional X'tal oscillator device with ceramics and metal lid. The novel Si-based X'tal oscillator device shows no leakage path, and passes the hermetic encapsulation test and reliability investigation. In addition, the novel device shows the excellent electrical characteristics and provides the possibility to replace the conventional Fabrication Approach for the next generation products.
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Advanced crystal component package with silicon TSV interposer using 3D integration and novel SU-8 polymer sealing bonding structure
2014 9th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2014Co-Authors: Jian-yu Shih, Yen-chi Chen, Chih-hung Chiu, Chung-lun Lo, Yu-chen Hu, Chi-chung Chang, Kuan-neng ChenAbstract:In this paper, a novel crystal component package based on silicon TSV interposer substrate is demonstrated by using 3D integration technologies. It is distinct from conventional crystal component using ceramic-based substrate. This crystal component with advanced silicon-based substrate shows great manufacturability to replace traditional Fabrication Approach. In addition, the SU-8 sealing bonding structure provides the possibility to substitute for the conventional metal lid with reliability investigation. Finally, a novel silicon-based crystal component package with 3D integration is successfully fabricated through general semiconductor techniques to replace traditional manufacture.
Xiaoliang Zhang - One of the best experts on this subject based on the ideXlab platform.
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Solution processed flexible and bending durable heterojunction colloidal quantum dot solar cell.
Nanoscale, 2015Co-Authors: Xiaoliang Zhang, Jindan Zhang, Jianhua Liu, Jingquan Zhang, Erik M. J. JohanssonAbstract:A flexible hybrid heterojunction PbS colloidal quantum dot solar cell, where the photoactive layers are deposited using a solution processed Fabrication Approach under ambient condition and at room temperature is presented. The bending stability of the obtained solar cell is evaluated. The results show that the solar cell exhibits high bending stability and even under the bent state the cell also maintains a high performance, which shows the potential of the quantum dot solar cell toward a lightweight, bendable power source with many possible applications.
Nobuyuki Yajima - One of the best experts on this subject based on the ideXlab platform.
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a new design and Fabrication Approach for pressurized balloon
Advances in Space Research, 2000Co-Authors: Nobuyuki YajimaAbstract:Abstract To realize a super pressure stratospheric balloon, a lot of efforts have been made for the development of extremely strong but light films. However, the balloon design capable of a heavy payload is still based on a standard natural shape. In this type of balloon, the film expansion between load tapes is limited because the center line on the original gore pattern is obviously shorter than side lines (seal lines). This paper describes a new design and Fabrication concept that each gore forms three-dimensional expanded shape with a small circumferential radius without elongation of the film by pressure. This three-dimensional gore is realized by shortening the length of larger size gore to the original load tape length through practical Fabrication process. As a result, the film tension is reduced drastically by the effect of the small radius caused by this structural expansion. The pressurized test was carried out using a small model balloon fabricated by this method. The successful test results are also reported.
