The Experts below are selected from a list of 4890 Experts worldwide ranked by ideXlab platform
Chingping Wong - One of the best experts on this subject based on the ideXlab platform.
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improving Thermal conductivity of polymer composites by reducing Interfacial Thermal Resistance between boron nitride nanotubes
Composites Science and Technology, 2018Co-Authors: Xiaoliang Zeng, Jianbin Xu, Qiang Li, Jibao Lu, Chenjie Fu, Srikanth Mateti, Guoping Du, Ying Chen, Chingping WongAbstract:Abstract Developing polymer composites with high Thermal conductivity is a must to improve the Thermal-management ability for modern electronic applications, in which power densities rapidly increase. Boron nitride nanotubes are one of the most promising fillers due to their high Thermal conductivity and electrical insulator, but the overall Thermal conductivity of the obtained polymer composites is limited by high Interfacial Thermal Resistances. Here, we present an approach to reduce the Interfacial Thermal Resistance between adjacent boron nitride nanotubes through low-melting effect of nanoscale silver particles. A sharp increase in Thermal conductivity (20.9 Wm−1K−1) is observed in cellulose nanofibers (CNFs)/boron nitride nanotubes (BNNTs) composites, which is approximately 14.3 times larger than that of conventional polymers. The underlying mechanism is understood through Foygel model, and demonstrated that the Interfacial Thermal Resistances play key role in the Thermal conductivity. This strategy can become a quotable method for design and prepared of highly Thermal conductivity materials in the future.
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enhanced Thermal conductivity for ag deposited alumina sphere epoxy resin composites through manipulating Interfacial Thermal Resistance
Composites Part A-applied Science and Manufacturing, 2018Co-Authors: Qiang Li, Xiaoliang Zeng, Jianbin Xu, Chingping Wong, Jibao Lu, Jianbo WuAbstract:Abstract Polymer composites with high Thermal conductivity have a great potential application in modern electronics, due to their light-weight, easy process, low cost and stable physical and chemical properties. Nevertheless, most polymer composites commonly possess unsatisfactory Thermal conductivity, primarily because of the high Interfacial Thermal Resistance between inorganic fillers. Herein, we report a novel method through silver-deposition on the surface of the fillers to create a silver nanoparticle “bridge”, to decrease the Interfacial Thermal Resistance between fillers. The results demonstrate that the out-of-plane Thermal conductivity of the epoxy resin/sphere alumina composites is increased to 1.304 W m −1 K −1 , representing an improvement of 624% compared with pure epoxy resin. This strategy provides an insight for the design of Thermally conductive polymer composites with potential to be used in next-generation electronic packaging.
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Enhanced Thermal conductivity for Ag-deposited alumina sphere/epoxy resin composites through manipulating Interfacial Thermal Resistance
Composites Part A: Applied Science and Manufacturing, 2018Co-Authors: Linlin Ren, Xiaoliang Zeng, Rong Sun, Chingping WongAbstract:Abstract Polymer composites with high Thermal conductivity have a great potential application in modern electronics, due to their light-weight, easy process, low cost and stable physical and chemical properties. Nevertheless, most polymer composites commonly possess unsatisfactory Thermal conductivity, primarily because of the high Interfacial Thermal Resistance between inorganic fillers. Herein, we report a novel method through silver-deposition on the surface of the fillers to create a silver nanoparticle “bridge”, to decrease the Interfacial Thermal Resistance between fillers. The results demonstrate that the out-of-plane Thermal conductivity of the epoxy resin/sphere alumina composites is increased to 1.304 W m−1 K−1, representing an improvement of 624% compared with pure epoxy resin. This strategy provides an insight for the design of Thermally conductive polymer composites with potential to be used in next-generation electronic packaging.
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preparation of boron nitride nanosheet nanofibrillated cellulose nanocomposites with ultrahigh Thermal conductivity via engineering Interfacial Thermal Resistance
Advanced Materials Interfaces, 2017Co-Authors: Xiaoliang Zeng, Jiantao Hu, Yun Huang, Jianbin Xu, Chingping WongAbstract:With the rapid development of modern electronics toward miniaturization, high-degree integration, and multifunctionalization, increased heat is generated during the operation of devices, which seriously limits the performance, lifetime, and reliability of electronic devices. Polymer-based composites with high Thermal conductivity have attracted much attention in solving the heat dissipation issue. However, conventional polymer-based composites can hardly achieve a Thermal conductivity of over 10 W m−1 K−1, due to high Interfacial Thermal Resistance. Herein, engineering Interfacial Thermal Resistance in boron nitride nanosheet/nanofibrillated cellulose nanocomposites by constructing nanoscale silver “bridges” between fillers is reported, aiming at achieving a high Thermal conductivity. The highest in-plane Thermal conductivity is up to 65.7 ± 3.0 W m−1 K−1, which is one order magnitude higher than those of conventional polymer-based composites. By fitting the experimental data with theoretical models, it is quantitatively demonstrated that silver nanoparticles can help to sharply decrease the Interfacial Thermal Resistance between adjacent boron nitride nanosheets. In addition, the small amount of silver hardly affects the electrical insulation of boron nitride nanosheet/nanofibrillated cellulose nanocomposites. This strategy can potentially pave the way for the design and preparation of highly Thermally conductive materials in the future.
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Preparation of Boron Nitride Nanosheet/Nanofibrillated Cellulose Nanocomposites with Ultrahigh Thermal Conductivity via Engineering Interfacial Thermal Resistance
Advanced Materials Interfaces, 2017Co-Authors: Jiajia Sun, Xiaoliang Zeng, Yun Huang, Yimin Yao, Guiran Pan, Rong Sun, Chingping WongAbstract:With the rapid development of modern electronics toward miniaturization, high-degree integration, and multifunctionalization, increased heat is generated during the operation of devices, which seriously limits the performance, lifetime, and reliability of electronic devices. Polymer-based composites with high Thermal conductivity have attracted much attention in solving the heat dissipation issue. However, conventional polymer-based composites can hardly achieve a Thermal conductivity of over 10 W m−1 K−1, due to high Interfacial Thermal Resistance. Herein, engineering Interfacial Thermal Resistance in boron nitride nanosheet/nanofibrillated cellulose nanocomposites by constructing nanoscale silver “bridges” between fillers is reported, aiming at achieving a high Thermal conductivity. The highest in-plane Thermal conductivity is up to 65.7 ± 3.0 W m−1 K−1, which is one order magnitude higher than those of conventional polymer-based composites. By fitting the experimental data with theoretical models, it is quantitatively demonstrated that silver nanoparticles can help to sharply decrease the Interfacial Thermal Resistance between adjacent boron nitride nanosheets. In addition, the small amount of silver hardly affects the electrical insulation of boron nitride nanosheet/nanofibrillated cellulose nanocomposites. This strategy can potentially pave the way for the design and preparation of highly Thermally conductive materials in the future.
Somchai Wongwises - One of the best experts on this subject based on the ideXlab platform.
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effect of water carbon interaction strength on Interfacial Thermal Resistance and the surrounding molecular nanolayer of cnt and graphene flake
Journal of Molecular Liquids, 2019Co-Authors: Fatemeh Jabbari, Ali Rajabpour, Seyfollah Saedodin, Somchai WongwisesAbstract:Abstract Heat transfer at the liquid-solid interface, especially when the particles are at nanoscale, can dominate the Thermal properties of nanofluids. In this study we investigate the liquid-solid Interfacial Thermal Resistance (Kapitza Resistance) and particularly analyze the structure of the formed molecular nanolayer around the carbon-based nanoparticles. Employing non-equilibrium molecular dynamics simulation and Thermal relaxation method, nanofluids systems with nanoparticles with different diameters and surface wettabilities were investigated. Simulation results reveal that carbon nanotubes (CNTs) with smaller diameters more effectively attract base fluid and thus show lower reduced Kapitza Resistances. It was found that the thickness of the nanolayer around the nanoparticle is independent of the carbon/water interaction strength. As expected, it was shown that the value of Kapitza Resistance decreases when the interaction strength increases. Based on our acquired results, a correlation was proposed for the Interfacial Thermal Resistance of CNT/water and graphene/water with respect to the intensity of wettability of nanoparticles surface. The insight provided by our atomistic simulations can provide a better understanding of heat transfer in nanofluids systems wherein an accurate local description of heat transfer is crucial.
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Effect of water/carbon interaction strength on Interfacial Thermal Resistance and the surrounding molecular nanolayer of CNT and graphene flake
Journal of Molecular Liquids, 2019Co-Authors: Fatemeh Jabbari, Ali Rajabpour, Seyfollah Saedodin, Somchai WongwisesAbstract:Abstract Heat transfer at the liquid-solid interface, especially when the particles are at nanoscale, can dominate the Thermal properties of nanofluids. In this study we investigate the liquid-solid Interfacial Thermal Resistance (Kapitza Resistance) and particularly analyze the structure of the formed molecular nanolayer around the carbon-based nanoparticles. Employing non-equilibrium molecular dynamics simulation and Thermal relaxation method, nanofluids systems with nanoparticles with different diameters and surface wettabilities were investigated. Simulation results reveal that carbon nanotubes (CNTs) with smaller diameters more effectively attract base fluid and thus show lower reduced Kapitza Resistances. It was found that the thickness of the nanolayer around the nanoparticle is independent of the carbon/water interaction strength. As expected, it was shown that the value of Kapitza Resistance decreases when the interaction strength increases. Based on our acquired results, a correlation was proposed for the Interfacial Thermal Resistance of CNT/water and graphene/water with respect to the intensity of wettability of nanoparticles surface. The insight provided by our atomistic simulations can provide a better understanding of heat transfer in nanofluids systems wherein an accurate local description of heat transfer is crucial.
Zhengxing Huang - One of the best experts on this subject based on the ideXlab platform.
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Interfacial Thermal Resistance of 2d and 1d carbon hexagonal boron nitride van der waals heterostructures
Carbon, 2016Co-Authors: Zhenan Tang, Zhengxing HuangAbstract:Abstract The newly emerging graphene/hexagonal boron nitride (h-BN) van der Waals heterostructures has attracted much research interest due to its new properties and functions for practical applications in nanodevices. In this work, molecular dynamics simulations are performed to study the Interfacial Thermal Resistance (ITR) of a graphene/h-BN bilayer system as well as its one-dimensional counterpart, a concentric CNT/BNNT double-walled nanotube, based on the lumped capacity model. The calculated ITR is in an order of magnitude of 10−7–10−6 Km2/W and it monotonically decreases with temperature and interlayer/intertube coupling strength. It is believed that the ITR between graphene and h-BN is reduced through the enhancement of the coupling strength instead of the geometrical overlap of the phonon modes. Heat flux direction has no effect on the ITR of the graphene/h-BN bilayer, however, radial Thermal rectification is found in the CNT/BNNT composite, with a largest Thermal rectification factor of ∼90%. Thermal energy always prefers to transport from the outer nanotube towards the inner nanotube in the CNT/BNNT system over the opposite direction no matter the outer nanotube is CNT or BNNT because the outer nanotube has more high-frequency phonons than that of the inner nanotube in the CNT/BNNT system.
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Interfacial Thermal Resistance of 2D and 1D carbon/hexagonal boron nitride van der Waals heterostructures
Carbon, 2016Co-Authors: Zhenan Tang, Zhengxing HuangAbstract:Abstract The newly emerging graphene/hexagonal boron nitride (h-BN) van der Waals heterostructures has attracted much research interest due to its new properties and functions for practical applications in nanodevices. In this work, molecular dynamics simulations are performed to study the Interfacial Thermal Resistance (ITR) of a graphene/h-BN bilayer system as well as its one-dimensional counterpart, a concentric CNT/BNNT double-walled nanotube, based on the lumped capacity model. The calculated ITR is in an order of magnitude of 10−7–10−6 Km2/W and it monotonically decreases with temperature and interlayer/intertube coupling strength. It is believed that the ITR between graphene and h-BN is reduced through the enhancement of the coupling strength instead of the geometrical overlap of the phonon modes. Heat flux direction has no effect on the ITR of the graphene/h-BN bilayer, however, radial Thermal rectification is found in the CNT/BNNT composite, with a largest Thermal rectification factor of ∼90%. Thermal energy always prefers to transport from the outer nanotube towards the inner nanotube in the CNT/BNNT system over the opposite direction no matter the outer nanotube is CNT or BNNT because the outer nanotube has more high-frequency phonons than that of the inner nanotube in the CNT/BNNT system.
Baowen Li - One of the best experts on this subject based on the ideXlab platform.
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measuring the Thermal conductivity and Interfacial Thermal Resistance of suspended mos 2 using electron beam self heating technique
Chinese Science Bulletin, 2018Co-Authors: Adili Aiyiti, Jing Wu, Xiangfan Xu, Baowen LiAbstract:Establishment of a new technique or extension of an existing technique for Thermal and thermoelectric measurements to a more challenging system is an important task to explore the Thermal and thermoelectric properties of various materials and systems. The bottleneck lies in the challenges in measuring the Thermal contact Resistance. In this work, we applied electron beam self-heating technique to derive the intrinsic Thermal conductivity of suspended Molybdenum Disulfide (MoS2) ribbons and the Thermal contact Resistance, with which the Interfacial Thermal Resistance between few-layer MoS2 and Pt electrodes was calculated. The measured room temperature Thermal conductivity of MoS2 is around ∼30 W/(m K), while the estimated Interfacial Thermal Resistance is around ∼2 × 10−6 m2 K/W. Our experiments extend a useful branch in application of this technique for studying Thermal properties of suspended layered ribbons and have potential application in investigating the Interfacial Thermal Resistance of different two-dimensional (2D) heterojunctions.
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Interfacial Thermal Resistance and Thermal rectification between suspended and encased single layer graphene
Journal of Applied Physics, 2014Co-Authors: Gang Zhang, Wen Xu, Baowen LiAbstract:With molecular dynamics simulations, we systematically investigate Interfacial Thermal Resistance between suspended and encased single layer graphene. Combining with lattice dynamics analysis, we demonstrate that induced by substrate coupling which serves as perturbation, the long wavelength flexural phonon mode in the encased graphene is significantly suppressed when compared with that in the suspended graphene. Therefore, at the interface between suspended and encased graphene, in-plane phonon modes can transmit well, whereas low frequency flexural phonon modes are reflected, leading to this nontrivial Interfacial Thermal Resistance. The impacts of coupling strength, temperature, and size of the system on this type of Interfacial Thermal Resistance are explored. More interesting, we find that Thermal rectification can be realized in this inhomogeneous encased graphene structures with a Thermal rectification efficiency of 40% at 50 K temperature difference. Our study provides insight to better understand...
Qingwei Li - One of the best experts on this subject based on the ideXlab platform.
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Interfacial Thermal Resistance and Thermal rectification in carbon nanotube film copper systems
Nanoscale, 2017Co-Authors: Zheng Duan, Guang Zhang, Qingwei LiAbstract:Thermal rectification occurring at interfaces is an important research area, which contains deep fundamental physics and has extensive application prospects. In general, the measurement of Interfacial Thermal rectification is based on measuring Interfacial Thermal Resistance (ITR). However, ITRs measured via conventional methods cannot avoid extra Thermal Resistance asymmetry due to the contact between the sample and the thermometer. In this study, we employed a non-contact infrared Thermal imager to monitor the temperature of super-aligned carbon nanotube (CNT) films and obtain the ITRs between the CNT films and copper. The ITRs along the CNT–copper direction and the reverse direction are in the ranges of 2.2–3.6 cm2 K W−1 and 9.6–11.9 cm2 K W−1, respectively. The obvious difference in the ITRs of the two directions shows a significant Thermal rectification effect, and the rectifying coefficient ranges between 0.57 and 0.68. The remarkable rectification factor is extremely promising for the manufacture of Thermal transistors with a copper/CNT/copper structure and further Thermal logic devices. Moreover, our method could be extended to other 2-dimensional materials, such as graphene and MoS2, for further explorations.