The Experts below are selected from a list of 7620 Experts worldwide ranked by ideXlab platform
Gul Tosun - One of the best experts on this subject based on the ideXlab platform.
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a study on Kerf and material removal rate in wire electrical discharge machining based on taguchi method
Journal of Materials Processing Technology, 2004Co-Authors: Nihat Tosun, Can Cogun, Gul TosunAbstract:Abstract This paper presents an investigation on the effect and optimization of machining parameters on the Kerf (cutting width) and material removal rate (MRR) in wire electrical discharge machining (WEDM) operations. The experimental studies were conducted under varying pulse duration, open circuit voltage, wire speed and dielectric flushing pressure. The settings of machining parameters were determined by using Taguchi experimental design method. The level of importance of the machining parameters on the cutting Kerf and MRR is determined by using analysis of variance (ANOVA). The optimum machining parameter combination was obtained by using the analysis of signal-to-noise (S/N) ratio. The variation of Kerf and MRR with machining parameters is mathematically modeled by using regression analysis method. The optimal search for machining parameters for the objective of minimum Kerf together with maximum MRR is performed by using the established mathematical models.
Pratim Biswas - One of the best experts on this subject based on the ideXlab platform.
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Carbon elimination from silicon Kerf: Thermogravimetric analysis and mechanistic considerations
Scientific Reports, 2017Co-Authors: Miguel Vazquez-pufleau, Tandeep S. Chadha, Gregory Yablonsky, Pratim BiswasAbstract:40% of ultrapure silicon is lost as Kerf during slicing to produce wafers. Kerf is currently not being recycled due to engineering challenges and costs associated with removing its abundant impurities. Carbon left behind from the lubricant remains as one of the most difficult contaminants to remove in Kerf without significant silicon oxidation. The present work enables to better understand the mechanism of carbon elimination in Kerf which can aid the design of better processes for kef recycling and low cost photovoltaics. In this paper, we studied the kinetics of carbon elimination from silicon Kerf in two atmospheres: air and N_2, under a regime of no-diffusion-limitation. We report the apparent activation energy in both atmospheres using three methods: Kissinger, and two isoconversional approaches. In both atmospheres, a bimodal apparent activation energy is observed, suggesting a two stage process. A reaction mechanism is proposed in which (a) C-C and C-O bond cleavage reactions occur in parallel with polymer formation; (b) at higher temperatures, this polymer fully degrades in air but leaves a tarry residue in N_2 that accounts for about 12% of the initial total carbon.
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Elimination of Carbon Contamination from Silicon Kerf Using a Furnace Aerosol Reactor Methodology
Industrial & Engineering Chemistry Research, 2015Co-Authors: Miguel Vazquez-pufleau, Tandeep S. Chadha, Gregory S. Yablonsky, Henry F. Erk, Pratim BiswasAbstract:Approximately 40% of the refined silicon is lost as sawdust (Kerf) during the cutting process while producing wafers. Attempts have been made to recycle this Kerf, but abundant impurities such as carbon (∼13000 ppm) burden its recovery. Using conventional bulk heating methods to remove carbon requires long residence time and inevitably causes silicon oxidation. This makes the treated Kerf unsuitable for further processing and reuse. A novel aerosol method that is effective for selective carbon removal from silicon Kerf at low residence times is described. The design of the aerosol process is supported by thermogravimetric analysis of Kerf that provides insights into kinetics of the carbon removal process. At 900 °C in an air atmosphere carbon was removed below detection levels at a residence time of 6 s. Under the same conditions in a nitrogen atmosphere, 90% elimination of carbon was measured. Minimal oxidation of the Si sample was observed under these conditions.
Tomas Prokes - One of the best experts on this subject based on the ideXlab platform.
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Effect of Width of Kerf on Machining Accuracy and Subsurface Layer After WEDM
Journal of Materials Engineering and Performance, 2018Co-Authors: Katerina Mouralova, Jiri Kovar, Lenka Klakurková, Tomas ProkesAbstract:Wire electrical discharge machining is an unconventional machining technology that applies physical principles to material removal. The material is removed by a series of recurring current discharges between the workpiece and the tool electrode, and a ‘Kerf’ is created between the wire and the material being machined. The width of the Kerf is directly dependent not only on the diameter of the wire used, but also on the machine parameter settings and, in particular, on the set of mechanical and physical properties of the material being machined. To ensure precise machining, it is important to have the width of the Kerf as small as possible. The present study deals with the evaluation of the width of the Kerf for four different metallic materials (some of which were subsequently heat treated using several methods) with different machine parameter settings. The Kerf is investigated on metallographic cross sections using light and electron microscopy.
Nihat Tosun - One of the best experts on this subject based on the ideXlab platform.
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a study on Kerf and material removal rate in wire electrical discharge machining based on taguchi method
Journal of Materials Processing Technology, 2004Co-Authors: Nihat Tosun, Can Cogun, Gul TosunAbstract:Abstract This paper presents an investigation on the effect and optimization of machining parameters on the Kerf (cutting width) and material removal rate (MRR) in wire electrical discharge machining (WEDM) operations. The experimental studies were conducted under varying pulse duration, open circuit voltage, wire speed and dielectric flushing pressure. The settings of machining parameters were determined by using Taguchi experimental design method. The level of importance of the machining parameters on the cutting Kerf and MRR is determined by using analysis of variance (ANOVA). The optimum machining parameter combination was obtained by using the analysis of signal-to-noise (S/N) ratio. The variation of Kerf and MRR with machining parameters is mathematically modeled by using regression analysis method. The optimal search for machining parameters for the objective of minimum Kerf together with maximum MRR is performed by using the established mathematical models.
Rowan Deam - One of the best experts on this subject based on the ideXlab platform.
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a correlation for predicting the Kerf profile from abrasive water jet cutting
Experimental Thermal and Fluid Science, 2006Co-Authors: Rowan DeamAbstract:Abrasive water jet cutting can produce tapered edges on the Kerf of workpiece being cut. This can limit the potential applications of abrasive water jet cutting (AWJ), if further machining of the edges is needed to achieve the engineering tolerance required for the part. In this study, the Kerf geometry has been measured using an optical microscope. Using these measurements, a simple empirical correlation for the Kerf profile shape under different traverse speed has been developed that fits the Kerf shape well. The mechanisms underlying the formation the Kerf profile are discussed and the optimum speed for achieving the straightest cutting edge is presented.
