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Yang Yang - One of the best experts on this subject based on the ideXlab platform.
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a semi transparent plastic solar cell fabricated by a Lamination Process
Advanced Materials, 2008Co-Authors: Jinsong Huang, Gang Li, Yang YangAbstract:Polymer solar cells have attracted broad research interest because of their advantageous solution Processing capability and formation of low-cost, flexible, and large area electronic devices. However, the efficiency of polymer solar cells is still low compared to that of inorganic solar cells. Therefore, it is a challenge to find a polymer that has all the required properties for high efficiency devices, such as strong and broad absorption, high carrier mobility, and appropriate energy levels. One possible solution to avoid the strict material requirements is to stack two or more devices with different spectral responses, which enables more efficient utilization of solar energy. Such a solution would require a semitransparent solarcell device with high efficiency in its absorption wavelength range, while high transparency would be required in the complementary wavelength range. Semitransparent solar cells are also interesting for other appealing applications, such as energy-generating color window glasses. It is desirable that such solar cell devices can be fabricated using a low-cost strategy, such as the roll-to-roll fabrication Process. One critical issue in this fabrication Process is how to form the active-layer/cathode mechanic and electronic contacts. The Lamination Process is one very promising technique to fulfill this requirement owing to its simplicity and low cost. It has been reported to produce two-layer heterojunction solar cells; however, the method is not applicable to bulk heterojunction solar cells, nor compatible with roll-to-roll fabrication Process. In this Communication, an electronic glue-based Lamination Process combined with interface modification is presented as a one-step Process for semitransparent polymer solar-cell fabrication. The finished device is metalfree, semitransparent, flexible, self-encapsulated, and highly efficient (with a maximum external quantum efficiency of 70 % and power efficiency of 3 % under AM 1.5 global 1 sun solar illumination conditions with spectral mismatch correction). This approach represents a critical step towards the ultimate goal of low-cost polymer solar cells. The device fabrication Process is illustrated in Figure 1, and can be described by the following steps. In Step I, two transparent substrates coated with a transparent conductor such as indium tin oxide (ITO), fluorine-doped tin oxide (FTO), or a high conductivity polymer, etc., are selected. In Step II, one substrate is coated with a very thin buffer layer (Cs2CO3 ) to act as the low-work-function cathode, followed by coating of the active polymer layer. Step III involves the coating of conductive polymer glue to the other transparent substrate. We used modified conducting polymer poly(ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) as the electronic glue, which was spin-coated to form the adhesive anode. Step IV is the Lamination Process: after drying both the substrates, they are laminated together by exerting force so that the two substrates are tightly glued together. During this Lamination, a plastic rod with proper hardness rolls the plastic substrate to remove air bubbles. Both substrates are heated to a temperature of 105–120 °C during the Lamination Process, and the finished devices are then kept on the hotplate for 5–10 min for the final heat treatment. The PEDOT:PSS was purposely modified to become adhesive, so that the two separate films formed good contact at the interface, both electronically and mechanically. In this work, this adhesive and conductive PEDOT:PSS layer was obtained by doping D-sorbitol or volemitol into PEDOT:PSS, as has been successfully demonstrated in polymer light emitting diodes. However, the efficiency of such a device is too low for application. The polymer blend used in this work is regioregular poly(3-hexylthiophene):[6,6]-phenyl-C61-butyric acid methyl ester (RRP3HT:PCBM) in 1:1 w/w ratio. The 200 nm thick polymer blend film was deposited by the slow-growth method (or solvent annealing) to enhance device efficiency. Either glass or plastic can be used as the transparent substrate. Figure 1b shows a picture of an all-plastic solar cell. The device area is ca. 40 mm. With both cathode and anode being transparent, a semitransparent polymer solar cell is formed. The transparency (T%) of the device is shown in Figure 1c, together with the solar illumination spectrum. A transparency of around 70 % was obtained in the wavelength range where polymer/PCBM has no absorption, which makes this device suitable for application in stacking devices to make full use of the solar spectrum. This device fabrication method has many advantages over the regular procedure. First of all, no thermal evaporation Process is involved in the Process, and each layer is coated by a low-cost and easy solution Process. Second, in contrast to the reactive metal cathode in regular devices, the cathode in C O M M U N IC A IO N
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High-performance flexible polymer light-emitting diodes fabricated via a low-temperature plastic laminated Process
Organic Light-Emitting Materials and Devices V, 2002Co-Authors: Shunchi Chang, Yang YangAbstract:In this manuscript, we report on the successful fabrication of high performance polymer light emitting diodes (PLEDs) using a low temperature, plastic Lamination Process. Blue- and red-emitting PLEDs were fabricated by laminating different luminescent polymers and organic compounds together to form the active media. This unique approach eliminates the issue of organic solvent compatibility with the organic layers for fabricating multi-layer PLEDs. In addition, a template activated surface Process (TAS) has been successfully applied to generate an optimum interface for the low temperature Lamination Process. The atomic force microscopy analysis reveals a distinct difference in the surfaces created by the TAS and the spin-coating Process. This observation coupled with the device data confirms the importance of the activated interface in the Lamination Process.
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high performance polymer light emitting diodes fabricated by a low temperature Lamination Process
Advanced Functional Materials, 2001Co-Authors: Shunchi Chang, Yang YangAbstract:We report on the successful demonstration of high performance polymer light-emitting diodes (PLEDs) using a low temperature, plastic Lamination Process. Blue- and red-emitting PLEDs were fabricated by laminating different luminescent polymers and organic compounds together to form the active media. This unique approach eliminates the issue of organic solvent compatibility with the organic layers for fabricating multi-layer PLEDs. In addition, a template activated surface Process (TAS) has been successfully applied to generate an optimum interface for the low temperature Lamination Process. Atomic force microscopy analysis reveals a distinct difference in the surfaces created by the TAS and the spin-coating Process. This observation coupled with the device data confirms the importance of the activated interface in the Lamination Process.
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High Performance Polymer Light-Emitting Diodes Fabricated by a Low Temperature Lamination Process**
Advanced Functional Materials, 2001Co-Authors: Tzung-fang Guo, Shunchi Chang, Seungmoon Pyo, Yang YangAbstract:We report on the successful demonstration of high performance polymer light-emitting diodes (PLEDs) using a low temperature, plastic Lamination Process. Blue- and red-emitting PLEDs were fabricated by laminating different luminescent polymers and organic compounds together to form the active media. This unique approach eliminates the issue of organic solvent compatibility with the organic layers for fabricating multi-layer PLEDs. In addition, a template activated surface Process (TAS) has been successfully applied to generate an optimum interface for the low temperature Lamination Process. Atomic force microscopy analysis reveals a distinct difference in the surfaces created by the TAS and the spin-coating Process. This observation coupled with the device data confirms the importance of the activated interface in the Lamination Process.
A S Budiman - One of the best experts on this subject based on the ideXlab platform.
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probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron x ray microdiffraction
Solar Energy Materials and Solar Cells, 2017Co-Authors: Vincent Handara, Ihor Radchenko, Sasi Kumar Tippabhotla, Karthic R Narayanan, Gregoria Illya, Martin Kunz, Nobumichi Tamura, A S BudimanAbstract:Author(s): Handara, VA; Radchenko, I; Tippabhotla, SK; Narayanan, K; Illya, G; Kunz, M; Tamura, N; Budiman, AS | Abstract: © 2016 Elsevier B.V. Thin (l150 µm) silicon solar cell technology is attractive due to the significant cost reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and Lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the Lamination Process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after Lamination Process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.
Jinsong Huang - One of the best experts on this subject based on the ideXlab platform.
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a semi transparent plastic solar cell fabricated by a Lamination Process
Advanced Materials, 2008Co-Authors: Jinsong Huang, Gang Li, Yang YangAbstract:Polymer solar cells have attracted broad research interest because of their advantageous solution Processing capability and formation of low-cost, flexible, and large area electronic devices. However, the efficiency of polymer solar cells is still low compared to that of inorganic solar cells. Therefore, it is a challenge to find a polymer that has all the required properties for high efficiency devices, such as strong and broad absorption, high carrier mobility, and appropriate energy levels. One possible solution to avoid the strict material requirements is to stack two or more devices with different spectral responses, which enables more efficient utilization of solar energy. Such a solution would require a semitransparent solarcell device with high efficiency in its absorption wavelength range, while high transparency would be required in the complementary wavelength range. Semitransparent solar cells are also interesting for other appealing applications, such as energy-generating color window glasses. It is desirable that such solar cell devices can be fabricated using a low-cost strategy, such as the roll-to-roll fabrication Process. One critical issue in this fabrication Process is how to form the active-layer/cathode mechanic and electronic contacts. The Lamination Process is one very promising technique to fulfill this requirement owing to its simplicity and low cost. It has been reported to produce two-layer heterojunction solar cells; however, the method is not applicable to bulk heterojunction solar cells, nor compatible with roll-to-roll fabrication Process. In this Communication, an electronic glue-based Lamination Process combined with interface modification is presented as a one-step Process for semitransparent polymer solar-cell fabrication. The finished device is metalfree, semitransparent, flexible, self-encapsulated, and highly efficient (with a maximum external quantum efficiency of 70 % and power efficiency of 3 % under AM 1.5 global 1 sun solar illumination conditions with spectral mismatch correction). This approach represents a critical step towards the ultimate goal of low-cost polymer solar cells. The device fabrication Process is illustrated in Figure 1, and can be described by the following steps. In Step I, two transparent substrates coated with a transparent conductor such as indium tin oxide (ITO), fluorine-doped tin oxide (FTO), or a high conductivity polymer, etc., are selected. In Step II, one substrate is coated with a very thin buffer layer (Cs2CO3 ) to act as the low-work-function cathode, followed by coating of the active polymer layer. Step III involves the coating of conductive polymer glue to the other transparent substrate. We used modified conducting polymer poly(ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) as the electronic glue, which was spin-coated to form the adhesive anode. Step IV is the Lamination Process: after drying both the substrates, they are laminated together by exerting force so that the two substrates are tightly glued together. During this Lamination, a plastic rod with proper hardness rolls the plastic substrate to remove air bubbles. Both substrates are heated to a temperature of 105–120 °C during the Lamination Process, and the finished devices are then kept on the hotplate for 5–10 min for the final heat treatment. The PEDOT:PSS was purposely modified to become adhesive, so that the two separate films formed good contact at the interface, both electronically and mechanically. In this work, this adhesive and conductive PEDOT:PSS layer was obtained by doping D-sorbitol or volemitol into PEDOT:PSS, as has been successfully demonstrated in polymer light emitting diodes. However, the efficiency of such a device is too low for application. The polymer blend used in this work is regioregular poly(3-hexylthiophene):[6,6]-phenyl-C61-butyric acid methyl ester (RRP3HT:PCBM) in 1:1 w/w ratio. The 200 nm thick polymer blend film was deposited by the slow-growth method (or solvent annealing) to enhance device efficiency. Either glass or plastic can be used as the transparent substrate. Figure 1b shows a picture of an all-plastic solar cell. The device area is ca. 40 mm. With both cathode and anode being transparent, a semitransparent polymer solar cell is formed. The transparency (T%) of the device is shown in Figure 1c, together with the solar illumination spectrum. A transparency of around 70 % was obtained in the wavelength range where polymer/PCBM has no absorption, which makes this device suitable for application in stacking devices to make full use of the solar spectrum. This device fabrication method has many advantages over the regular procedure. First of all, no thermal evaporation Process is involved in the Process, and each layer is coated by a low-cost and easy solution Process. Second, in contrast to the reactive metal cathode in regular devices, the cathode in C O M M U N IC A IO N
Steve Chiu - One of the best experts on this subject based on the ideXlab platform.
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innovative fan out wafer level package using Lamination Process and adhered si wafer on the backside
Electronic Components and Technology Conference, 2012Co-Authors: David Chang, Mark Liao, Steve ChiuAbstract:The traditional wafer level packages (WLPs) are fan-in redistribution layer (RDL) lay-out design; it may not be able to meet the high pin-count handheld device requirement. So the new fan-out wafer level packages (FOWLPs) are emerged in the last few years. The fan-out WLP starts with the reconfiguration dies on carrier and embeds die by molded compound. The molded reconstituted wafer forms a compound base to apply litho and metallization Process, as in the conventional fan-in WLP back-end Processes to form the packages. In this study, a new high-performance fan-out wafer level package (sWLP) is developed. Emphasis is placed on the fabrication Process and material selection. Since FOWLP with molding Process has warpage challenge, herein we use Lamination Process with dry film to embed dies and adhere with Si wafer on the backside to achieve a ultra low warpage. Also, package level and board level performance are determined by finite element analysis. Furthermore, package and board level reliability are estimated by the standard JEDEC standard. The package warpage behavior corresponding to temperature conditions is measured by moire method. Some important results for the new package are summarized as below. • Assembly Process evaluation and improvement. • Board level drop test performance and stress/warpage simulation. • Shadow moire measurement and thermal effect study. • Reliability results of package level, including precondition, TCT, HTS and HAST. • Reliability results of board level, including drop test and TCT.
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innovative fan out wafer level package using Lamination Process and adhered si wafer on the backside
Electronic Components and Technology Conference, 2012Co-Authors: H S Hsu, David Chang, Mark Liao, Kenny Liu, Nicholas Kao, Steve ChiuAbstract:The traditional wafer level packages (WLPs) are fan-in redistribution layer (RDL) lay-out design; it may not be able to meet the high pin-count handheld device requirement. So the new fan-out wafer level packages (FOWLPs) are emerged in the last few years. The fan-out WLP starts with the reconfiguration dies on carrier and embeds die by molded compound. The molded reconstituted wafer forms a compound base to apply litho and metallization Process, as in the conventional fan-in WLP back-end Processes to form the packages. In this study, a new high-performance fan-out wafer level package (sWLP) is developed. Emphasis is placed on the fabrication Process and material selection. Since FOWLP with molding Process has warpage challenge, herein we use Lamination Process with dry film to embed dies and adhere with Si wafer on the backside to achieve a ultra low warpage. Also, package level and board level performance are determined by finite element analysis. Furthermore, package and board level reliability are estimated by the standard JEDEC standard. The package warpage behavior corresponding to temperature conditions is measured by moire method. Some important results for the new package are summarized as below. • Assembly Process evaluation and improvement. • Board level drop test performance and stress/warpage simulation. • Shadow moire measurement and thermal effect study. • Reliability results of package level, including precondition, TCT, HTS and HAST. • Reliability results of board level, including drop test and TCT.
Chunwei Chen - One of the best experts on this subject based on the ideXlab platform.
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top laminated graphene electrode in a semitransparent polymer solar cell by simultaneous thermal annealing releasing method
ACS Nano, 2011Co-Authors: Kunhua Tu, Chenchieh Yu, Shao Sian Li, Jeong Yuan Hwang, Kueihsien Chen, Lichyong Chen, Hsuenli Chen, Chunwei ChenAbstract:In this article, we demonstrate a semitransparent inverted-type polymer solar cell using a top laminated graphene electrode without damaging the underlying organic photoactive layer. The Lamination Process involves the simultaneous thermal releasing deposition of the graphene top electrode during thermal annealing of the photoactive layer. The resulting semitransparent polymer solar cell exhibits a promising power conversion efficiency of approximately 76% of that of the standard opaque device using an Ag metal electrode. The asymmetric photovoltaic performances of the semitransparent solar cell while illuminated from two respective sides were further analyzed using optical simulation and photocarrier recombination measurement. The devices consisting of the top laminated transparent graphene electrode enable the feasible roll-to-roll manufacturing of low-cost semitransparent polymer solar cells and can be utilized in new applications such as power-generated windows or multijunction or bifacial photovoltai...
