Lower Transition Temperature

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Mitsuru Ueda - One of the best experts on this subject based on the ideXlab platform.

  • 3DIC - Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack
    2009 IEEE International Conference on 3D System Integration, 2009
    Co-Authors: Tomohide Murase, Hiroyuki Aikyou, Fumikazu Mizutani, Yu Shoji, Tomoya Higashihara, Mitsuru Ueda
    Abstract:

    Novel thermotropic liquid crystalline semi-aliphatic polyimide containing polysiloxane unit has been developed. The polyimide film exhibits high thermal stability and liquid crystallinity with Lower Transition Temperature. Poly(amic acid) solution used as a precursor of the polyimide has very good surface wetting properties for a silicon wafer, resulting in homogeneous polyimide thin film formation on the wafer after thermal imidization below 200 °C. The silicon wafer coated with the polyimide thin film can be bonded to another silicon wafer, or to another polyimide film on heating at 270 °C with relatively low pressure. Moreover the bonding is repairable on heating again. It is proposed that the polyimide can be utilized as a polymer adhesive for three dimensional chip stack.

  • Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack
    2009 IEEE International Conference on 3D System Integration, 2009
    Co-Authors: Tomohide Murase, Hiroyuki Aikyou, Fumikazu Mizutani, Yu Shoji, Tomoya Higashihara, Mitsuru Ueda
    Abstract:

    Novel thermotropic liquid crystalline semi-aliphatic polyimide containing polysiloxane unit has been developed. The polyimide film exhibits high thermal stability and liquid crystallinity with Lower Transition Temperature. Poly(amic acid) solution used as a precursor of the polyimide has very good surface wetting properties for a silicon wafer, resulting in homogeneous polyimide thin film formation on the wafer after thermal imidization below 200degC. The silicon wafer coated with the polyimide thin film can be bonded to another silicon wafer, or to another polyimide film on heating at 270degC with relatively low pressure. Moreover the bonding is repairable on heating again. It is proposed that the polyimide can be utilized as a polymer adhesive for three dimensional chip stack.

Elisabeth Dumont - One of the best experts on this subject based on the ideXlab platform.

  • Unconventional strong pinning in the low-Temperature phase of U0.9725Th0.0275Be13
    Physica B: Condensed Matter, 2020
    Co-Authors: Elisabeth Dumont
    Abstract:

    We investigated low field vortex dynamics in a single crystal of U_.9725Th_.0275Be_13. We found a sharp Transition in the vortex creep rate at the Lower Transition Temperature T_c2, coincident with the second jump in the specific heat. In the high-Temperature phase, rather strong creep rates are observed. In the low Temperature phase, the rates drop to undetectabely low levels. This behaviour indicates that a very strong pinning mechanism is present in the low Temperature phase of U_.9725Th_.0275Be_13, which could be explained by the existence of domain walls, separating discreetly degenerate states of a superconductor, that can sustain fractional vortices and thus act as very strong pinning centers.Comment: 2 pages, 2 figures, accepted in PhysicaB, LT2

  • Unconventional strong pinning in the low-Temperature phase of U0.9725Th0.0275Be13
    Physica B-condensed Matter, 2000
    Co-Authors: Elisabeth Dumont, A. C. Mota, James L. Smith
    Abstract:

    Abstract We investigated low-field vortex dynamics in a single crystal of U 0.9725 Th 0.0275 Be 13 .We found a sharp Transition in the vortex creep rate at the Lower Transition Temperature T c2 , coincident with the second jump in the specific heat. In the high-Temperature phase, rather strong creep rates are observed. In the low-Temperature phase, the rates drop to undetectably low levels. This behaviour indicates that a very strong pinning mechanism is present in the low-Temperature phase of U 0.9725 Th 0.0275 Be 13 , which could be explained by the existence of domain walls, separating discreetly degenerate states of a superconductor, that can sustain fractional vortices and thus act as very strong pinning centers.

Yi Long - One of the best experts on this subject based on the ideXlab platform.

  • Temperature responsive hydrogel with ultra large solar modulation and high luminous transmission for smart window applications
    Journal of Materials Chemistry, 2014
    Co-Authors: Yang Zhou, Xiao Hu, Yi Long
    Abstract:

    The application of a thin film of poly(N-isopropylacrylmide) hydrogel to thermochromic smart windows has been investigated. As the thickness of the hydrogel increased from 26 to 200 μm and the testing Temperature increased from 20 to 60 °C, the solar modulating ability (ΔTsol) increased and the luminous transmittance (Tlum) decreased. Compared with the best reported results for the most studied inorganic VO2 thermochromic coatings, an unprecedented good combination of near-doubled average Tlum (70.7% vs. 42.8%), higher ΔTsol (25.5% vs. 22.3%) and Lower Transition Temperature (∼32 °C vs. ∼68 °C) could be achieved by hydrogels with an optimized thickness. Good durability and reversibility were established with the correct sealing of the sandwich structure.

Wood-hi Cheng - One of the best experts on this subject based on the ideXlab platform.

Tomohide Murase - One of the best experts on this subject based on the ideXlab platform.

  • 3DIC - Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack
    2009 IEEE International Conference on 3D System Integration, 2009
    Co-Authors: Tomohide Murase, Hiroyuki Aikyou, Fumikazu Mizutani, Yu Shoji, Tomoya Higashihara, Mitsuru Ueda
    Abstract:

    Novel thermotropic liquid crystalline semi-aliphatic polyimide containing polysiloxane unit has been developed. The polyimide film exhibits high thermal stability and liquid crystallinity with Lower Transition Temperature. Poly(amic acid) solution used as a precursor of the polyimide has very good surface wetting properties for a silicon wafer, resulting in homogeneous polyimide thin film formation on the wafer after thermal imidization below 200 °C. The silicon wafer coated with the polyimide thin film can be bonded to another silicon wafer, or to another polyimide film on heating at 270 °C with relatively low pressure. Moreover the bonding is repairable on heating again. It is proposed that the polyimide can be utilized as a polymer adhesive for three dimensional chip stack.

  • Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack
    2009 IEEE International Conference on 3D System Integration, 2009
    Co-Authors: Tomohide Murase, Hiroyuki Aikyou, Fumikazu Mizutani, Yu Shoji, Tomoya Higashihara, Mitsuru Ueda
    Abstract:

    Novel thermotropic liquid crystalline semi-aliphatic polyimide containing polysiloxane unit has been developed. The polyimide film exhibits high thermal stability and liquid crystallinity with Lower Transition Temperature. Poly(amic acid) solution used as a precursor of the polyimide has very good surface wetting properties for a silicon wafer, resulting in homogeneous polyimide thin film formation on the wafer after thermal imidization below 200degC. The silicon wafer coated with the polyimide thin film can be bonded to another silicon wafer, or to another polyimide film on heating at 270degC with relatively low pressure. Moreover the bonding is repairable on heating again. It is proposed that the polyimide can be utilized as a polymer adhesive for three dimensional chip stack.

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