The Experts below are selected from a list of 213 Experts worldwide ranked by ideXlab platform

Teng Lin - One of the best experts on this subject based on the ideXlab platform.

  • The new advance of foil Manganin gauges
    Journal of Functional Biomaterials, 2005
    Co-Authors: Teng Lin
    Abstract:

    Foil Manganin sensors were used to measure the dynamic high-pressure which were mainly encapsulated in organic material.Aimed at extending the measurement range of Manganin gauges,the Manganin sensing elements were encapsulated in inorganic material.Al2O3 thin film were deposited on both sides of Manganin fiols.Consequently,the measurement range was extended.According to the dynamic high-pressure test,the new kind of sensor measured 55.32GPa high pressure.The sensor records showed its piezoresistance coefficient of 0.0272 and its lifespan of 2.5μm.

  • Piezoresistance response of thin film Manganin sensors
    Sensors and Actuators A: Physical, 2005
    Co-Authors: Teng Lin, Yang Bang Chao, Du Xiao Song, Zhou Hong Ren
    Abstract:

    Thin film Manganin sensors aimed at high-pressure measurement are prepared by DC magnetron sputtering. The structure and morphology of the films are analyzed by XRD and SEM techniques. The piezoresistance coefficient, k, is obtained through dynamic loading experiments. It is found that heat treatment leads to better Manganin sensor piezoresistance response without manganese element volatilization. The experimental results show that annealing at higher temperature is helpful for the growth of larger size grains and decrease of defects in the thin films, this determining the improvement of k. The k of the thin films equals that of the foil-like.

Zhou Hong Ren - One of the best experts on this subject based on the ideXlab platform.

  • Piezoresistance response of thin film Manganin sensors
    Sensors and Actuators A: Physical, 2005
    Co-Authors: Teng Lin, Yang Bang Chao, Du Xiao Song, Zhou Hong Ren
    Abstract:

    Thin film Manganin sensors aimed at high-pressure measurement are prepared by DC magnetron sputtering. The structure and morphology of the films are analyzed by XRD and SEM techniques. The piezoresistance coefficient, k, is obtained through dynamic loading experiments. It is found that heat treatment leads to better Manganin sensor piezoresistance response without manganese element volatilization. The experimental results show that annealing at higher temperature is helpful for the growth of larger size grains and decrease of defects in the thin films, this determining the improvement of k. The k of the thin films equals that of the foil-like.

Gary A. Lorigan - One of the best experts on this subject based on the ideXlab platform.

  • Spin Label Spin Label Distance Measurements of Aligned Membrane Proteins
    Biophysical Journal, 2009
    Co-Authors: Harishchandra Ghimire, Johnson J. Inbaraj, Daniel J. Mayo, Monica R. Benedikt, Eric J. Hustedt, Gary A. Lorigan
    Abstract:

    Both Manganin-2 and M2δ transmembrane segment of the nicotinic acetylcholine receptor (AchR M2δ) are 23-amino acid peptides with strikingly different structural topologies. Manganin-2 is an antimicrobial peptide lying on the surface, whereas AchR M2δ forms a membrane-spanning neurotransmitter gated ion-channel. To determine the structural topology of these peptides, the spin label 2, 2, 6, 6-tetramethyl piperidine-1 oxyl-4-amino-4 carboxylic acid (TOAC) was attached at different sites in these peptides via solid phase peptide synthesis. Since the TOAC spin label is rigidly coupled to the peptide backbone, it accurately reports on position, orientation, and dynamics of the peptide backbone. Amino acids Ser-8 and Lys-14 in Manganin-2 and Ile-7 and Gln-13 in AchR M2δ were singly and doubly replaced with the TOAC spin label. These peptides were cleaved, purified by reverse phase HPLC and then inserted into aligned DMPC lipid bilayers to study the spin label-spin label dipolar interaction by continuous wave electron paramagnetic resonance (CW-EPR) spectroscopy. In aligned bilayers at higher temperatures, the anisotropic EPR spectra of the singly labeled peptides reveal unique lineshapes based upon the orientation of the peptides with respect to the membrane and the magnetic field. The EPR spectra of doubly labeled peptides in aligned bilayers contain unique information about the distance and orientation of the two labels. Thus, by using aligned CW-EPR spectroscopic techniques we can predict the structural topology of membrane proteins and measure the distance and orientation between two spin labels.

Shiv Govind Singh - One of the best experts on this subject based on the ideXlab platform.

  • optimized ultra thin Manganin alloy passivated fine pitch damascene compatible bump less cu cu bonding at sub 200 c for three dimensional integration applications
    Japanese Journal of Applied Physics, 2018
    Co-Authors: Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, Hemanth C Kumar, Satish Bonam, Shiv Govind Singh
    Abstract:

    Enhanced Cu diffusion, Cu surface passivation, and smooth surface at the bonding interface are the key essentials for high quality Cu–Cu bonding. Previously, we have demonstrated optimized 3 nm thin Manganin metal-alloy passivation from oxidation and also helps to reduce the surface roughness to about 0.8 nm which substantially led to high quality Cu–Cu bonding. In this paper, we demonstrated an ultra fine-pitch (<25 µm) Cu–Cu bonding using an optimized Manganin metal-alloy passivation. This engineered surface passivation approach led to high quality bonding at sub 200 °C temperature and 0.4 MPa. Very low specific contact resistance of 1.4 × 10−7 Ω cm2 and the defect free bonded interface is clear indication of high quality bonding for future multilayer integrations. Furthermore, electrical characterization of the bonded structure was performed under various robust conditions as per International Technology Roadmap for Semiconductors (ITRS Roadmap) in order to satisfy the stability of the bonded structure.

  • demonstration of sub 150 c cu cu thermocompression bonding for 3d ic applications utilizing an ultra thin layer of Manganin alloy as an effective surface passivation layer
    Materials Letters, 2017
    Co-Authors: Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh
    Abstract:

    Damascene process compatible Copper (Cu) surface passivation, ultra-smooth surface and enhanced Cu diffusion at the bonding interface are the key requirements for high quality, low temperature and low pressure Cu-Cu bonding for 3D integration applications. Manganin alloy deployed in this work as a passivation layer, performs dual role of protecting Cu surface from oxidation even at higher temperature ( oriented plane formation with Manganin alloy passivated Cu surface. All the aforementioned factors are key enablers in enhancing diffusion of Cu across the bonding interface. This led to high quality Cu-Cu thermocompression bonding at sub 150˚C temperature and at a nominal contact force of 5 kN. Very low specific contact resistance of 1.45 × 10-7 Ω-cm2 and excellent bond strength of 186 MPa is clear evidence of the efficacy of optimized ultra-thin Manganin alloy as a passivation layer.

William G. Proud - One of the best experts on this subject based on the ideXlab platform.

  • The Response of Dyneema to Shock-Loading
    2009
    Co-Authors: David J. Chapman, Chris Braithwaite, William G. Proud
    Abstract:

    Dyneema is a registered trademark of a self‐reinforced polyethylene (manufactured by DSM) which is showing great promise as a replacement for brittle‐fibre‐reinforced epoxies in various dynamic applications. As part of an investigation of its high‐rate mechanical properties, we have measured the response of Dyneema under the condition of uniaxial strain during shock‐loading. Data on the principal‐Hugoniot curve was obtained using in‐material Manganin stress gauges to measure both longitudinal stress and shock‐wave velocity. Off‐Hugoniot data was generated using a plate‐impact reverberation technique, where a Dyneema sample was sandwiched between two higher impedance copper anvils. Manganin stress gauges mounted at the interface between the Dyneema sample and copper anvils monitored the ring‐up of stress in the specimen. Finally, the release curve from a given principal‐Hugoniot state was measured using a reverse ballistic impact technique where free‐surface velocity was measured using VISAR.

  • Calibration of Wire-Like Manganin Gauges for Use in Planar Shock-Wave Experiments
    2009
    Co-Authors: David J. Chapman, Christopher Braithwaite, William G. Proud
    Abstract:

    Piezoresistive gauges have been used extensively for many decades as in‐material stress transducers during shock wave experiments. Manganin demonstrates a high piezoresistive response which is relatively temperature independent. As such Manganin gauges have been widely calibrated by many authors for use during shock‐wave experiments. The precise calibration has been demonstrated to depend on both the chemical composition and mechanical history of the Manganin, and on the geometry of the gauge. The research presented in this paper refers to the calibration of a commercially available Manganin gauge, Micro‐measurements J2M‐SS‐580SF‐025, generally referred to as the T‐gauge owing to its geometry. The T‐gauge has seen widespread use as a pressure transducer to measure lateral stress during plate‐impact experiments. It has been previously proposed that T‐gauges have a similar response to the grid foil‐like Manganin gauges extensively calibrated by Rosenberg et al. However, recently it has been suggested that they in fact behave in a wire‐like manner. The results presented here demonstrate that the gauges’ behaviour is wire‐like when mounted to measure longitudinal stress. A modified calibration can be applied successfully to convert the relative resistance change to the stress normal to the gauge element. These results have important ramifications for the reduction of lateral stress measurements previously made using the T‐gauge.