The Experts below are selected from a list of 8748 Experts worldwide ranked by ideXlab platform
Stuart Wenham - One of the best experts on this subject based on the ideXlab platform.
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Evolution of Metal Plating for silicon solar cell Metallisation
Progress in Photovoltaics: Research and Applications, 2013Co-Authors: Alison Lennon, Yu Yao, Stuart WenhamAbstract:Increasingsilverpricesandreducingsiliconwaferthicknessesprovideincentivesforsiliconsolarcellmanufacturingtodevelop new Metallisation strategies that do not rely on screen printing and preferably reduce silver usage. Recently, Metal Plating has re-emerged as a Metallisation process that may address these future requirements. This paper reports on the evolution of Metal Plating techniques, from their use in early silicon solar cells, to current light-induced Plating processes. Unlike screen-printed Metallisation, Metal Plating typically requires an initial patterning step to create openings in a masking layer for the subsequent self-aligned Metallisation. Consequently, relevant recently-developed dielectric patterning methods are also reviewed because, in many cases, the Plating process must be adapted to the properties of the patterning method used. The potential of new light-induced Plating processes to form cost-effective copper Metallisation is supported by the recent activity in the develop- ment of Metal Plating tools for commercial silicon solar cell manufacture. Copyright © 2012 John Wiley & Sons, Ltd.
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Series Resistance Analysis of Passivated Emitter Rear Contact Cells Patterned Using Inkjet Printing
Advances in Materials Science and Engineering, 2012Co-Authors: Martha A.t. Lenio, Alison Lennon, James Howard, Fabian Jentschke, Y. Augarten, Stuart WenhamAbstract:For higher-efficiency solar cell structures, such as the Passivated Emitter Rear Contact (PERC) cells, to be fabricated in a manufacturing environment, potentially low-cost techniques such as inkjet printing and Metal Plating are desirable. A common problem that is experienced when fabricating PERC cells is low fill factors due to high series resistance. This paper identifies and attempts to quantify sources of series resistance in inkjet-patterned PERC cells that employ electroless or light-induced nickel-Plating techniques followed by copper light-induced Plating. Photoluminescence imaging is used to determine locations of series resistance losses in these inkjet-patterned and plated PERC cells.
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Effect of electroless nickel on the series resistance of high-efficiency inkjet printed passivated emitter rear contacted solar cells
Solar Energy Materials and Solar Cells, 2010Co-Authors: Martha A.t. Lenio, Alison Lennon, Anita Ho-baillie, Stuart WenhamAbstract:Many existing and emerging solar cell technologies rely on plated Metal to form the front surface contacts, and aluminium to form the rear contact. Interactions between the Metal Plating solutions and the aluminium rear can have a significant impact on cell performance. This paper describes non-uniform nickel deposition on the sintered aluminium rear surface of passivated emitter and rear contacted (PERC) cells patterned using an inkjet printing technique. Rather than being plated homogeneously over the entire rear surface as is observed on an alloyed aluminium rear, the nickel is plated only in the vicinity of the point openings in the rear surface silicon dioxide dielectric layer. Furthermore, this non-uniform nickel deposition was shown to increase the contact resistance of the rear point contacts by an order of magnitude, resulting in higher series resistance values for these fabricated PERC cells.
Alison Lennon - One of the best experts on this subject based on the ideXlab platform.
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Evolution of Metal Plating for silicon solar cell Metallisation
Progress in Photovoltaics: Research and Applications, 2013Co-Authors: Alison Lennon, Yu Yao, Stuart WenhamAbstract:Increasingsilverpricesandreducingsiliconwaferthicknessesprovideincentivesforsiliconsolarcellmanufacturingtodevelop new Metallisation strategies that do not rely on screen printing and preferably reduce silver usage. Recently, Metal Plating has re-emerged as a Metallisation process that may address these future requirements. This paper reports on the evolution of Metal Plating techniques, from their use in early silicon solar cells, to current light-induced Plating processes. Unlike screen-printed Metallisation, Metal Plating typically requires an initial patterning step to create openings in a masking layer for the subsequent self-aligned Metallisation. Consequently, relevant recently-developed dielectric patterning methods are also reviewed because, in many cases, the Plating process must be adapted to the properties of the patterning method used. The potential of new light-induced Plating processes to form cost-effective copper Metallisation is supported by the recent activity in the develop- ment of Metal Plating tools for commercial silicon solar cell manufacture. Copyright © 2012 John Wiley & Sons, Ltd.
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Series Resistance Analysis of Passivated Emitter Rear Contact Cells Patterned Using Inkjet Printing
Advances in Materials Science and Engineering, 2012Co-Authors: Martha A.t. Lenio, Alison Lennon, James Howard, Fabian Jentschke, Y. Augarten, Stuart WenhamAbstract:For higher-efficiency solar cell structures, such as the Passivated Emitter Rear Contact (PERC) cells, to be fabricated in a manufacturing environment, potentially low-cost techniques such as inkjet printing and Metal Plating are desirable. A common problem that is experienced when fabricating PERC cells is low fill factors due to high series resistance. This paper identifies and attempts to quantify sources of series resistance in inkjet-patterned PERC cells that employ electroless or light-induced nickel-Plating techniques followed by copper light-induced Plating. Photoluminescence imaging is used to determine locations of series resistance losses in these inkjet-patterned and plated PERC cells.
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Effect of electroless nickel on the series resistance of high-efficiency inkjet printed passivated emitter rear contacted solar cells
Solar Energy Materials and Solar Cells, 2010Co-Authors: Martha A.t. Lenio, Alison Lennon, Anita Ho-baillie, Stuart WenhamAbstract:Many existing and emerging solar cell technologies rely on plated Metal to form the front surface contacts, and aluminium to form the rear contact. Interactions between the Metal Plating solutions and the aluminium rear can have a significant impact on cell performance. This paper describes non-uniform nickel deposition on the sintered aluminium rear surface of passivated emitter and rear contacted (PERC) cells patterned using an inkjet printing technique. Rather than being plated homogeneously over the entire rear surface as is observed on an alloyed aluminium rear, the nickel is plated only in the vicinity of the point openings in the rear surface silicon dioxide dielectric layer. Furthermore, this non-uniform nickel deposition was shown to increase the contact resistance of the rear point contacts by an order of magnitude, resulting in higher series resistance values for these fabricated PERC cells.
Bulent Sari - One of the best experts on this subject based on the ideXlab platform.
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comparative evaluation of microbial and chemical leaching processes for heavy Metal removal from dewatered Metal Plating sludge
Journal of Hazardous Materials, 2010Co-Authors: Belgin Bayat, Bulent SariAbstract:Abstract The purpose of the study described in this paper was to evaluate the application of bioleaching technique involving Acidithiobacillus ferrooxidans to recover heavy Metals (Zn, Cu, Ni, Pb, Cd and Cr) in dewatered Metal Plating sludge (with no sulfide or sulfate compounds). The effect of some conditional parameters (i.e. pH, oxidation–reduction potential (ORP), sulfate production) and operational parameters (i.e. pulp density of the sludge and agitation time) were investigated in a 3 l completely mixed batch (CMB) reactor. The Metal recovery yields in bioleaching were also compared with chemical leaching of the sludge waste using commercial inorganic acids (sulfuric acids and ferric chloride). The leaching of heavy Metals increased with decreasing of pH and increasing of ORP and sulfate production during the bioleaching experiment. Optimum pulp density for bioleaching was observed at 2% (w/v), and leaching efficiency decreased with increasing pulp density in bioleaching experiments. Maximum Metal solubilization (97% of Zn, 96% of Cu, 93% of Ni, 84% of Pb, 67% of Cd and 34% of Cr) was achieved at pH 2, solids contents of 2% (w/v), and a reaction temperature of 25 ± 2 °C during the bioleaching process. The maximum removal efficiencies of 72% and 79% Zn, 70% and 75% Cu, 69% and 73% Ni, 57% and 70% Pb, 55% and 65% Cd, and 11% and 22% Cr were also attained with the chemical leaching using sulfuric acids and ferric chloride, respectively, at pH 2, solids contents of 2% (w/v), and a reaction temperature of 25 ± 2 °C during the acid leaching processes. The rates of Metal leaching for bioleaching and chemical leaching are well described by a kinetic equation related to time. Although bioleaching generally requires a longer period of operation compared to chemical leaching, it achieves higher removal efficiency for heavy Metals. The efficiency of leaching processes can be arranged in descending order as follows: bioleaching > ferric chloride leaching > sulfuric acid leaching. These results suggest that bioleaching may be an alternative or adjunct to conventional physicochemical treatment of dewatered Metal Plating sludge for the removal hazardous heavy Metals.
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bioleaching of dewatered Metal Plating sludge by acidithiobacillus ferrooxidans using shake flask and completely mixed batch reactor
African Journal of Biotechnology, 2010Co-Authors: Belgin Bayat, Bulent SariAbstract:The objective of the present study was to evaluate the application of bioleaching technique to recover heavy Metals (Zn, Cu, Ni, Pb, Cd and Cr) in dewatered Metal Plating sludge not containing sulphide or sulphate compounds. The effects of pH, pulp density of the sludge and agitation time were investigated in both shake flask and completely mixed batch reactor experiments. The leaching of heavy Metals increased with decrease of pH and pulp density and increase of agitation time for both bioleaching experiments. The maximum Metal leaching efficiencies of 93 and 97% Zn, 86 and 96% Cu, 85 and 93% Ni, 70 and 84% Pb, 65 and 67% Cd and 30 and 34% Cr were attained with the shake flask and the completely mixed batch reactor experiments, respectively, at a pH 2, a solid content of 2% (w/v) and a reaction temperature of 25 ± 2°C during the bioleaching process (20 days). The rates of Metal leaching for both bioleaching systems are well described by a kinetic equation related to time. Although the rates of Metal leaching were in the decreasing order: Zn > Cu > Ni > Pb > Cd > Cr for both leaching experiments, bioleaching using the completely mixed batch reactor was slightly more efficient than the shake flask due to aeration of system. These results suggest that bioleaching may be an alternative or adjunct to conventional physicochemical treatment of dewatered Metal Plating sludge for the removal of hazardous heavy Metals. Key words: Bioleaching, waste sludge, heavy Metals, Acidithiobacillus ferrooxidans
Hubert A Gasteiger - One of the best experts on this subject based on the ideXlab platform.
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quantitative and time resolved detection of lithium Plating on graphite anodes in lithium ion batteries
Materials Today, 2017Co-Authors: Johannes Wandt, Peter Jakes, Josef Granwehr, Rudigera Eichel, Hubert A GasteigerAbstract:Abstract The ability of fast and safe charging is critical for the further success of lithium ion batteries in automotive applications. In state-of-the-art lithium ion batteries, the charging rate is limited by the onset of lithium Plating on the graphite anode. Despite its high importance, so far no analytical technique has been available for directly measuring lithium Plating during battery charge. Herein, we introduce operando electron paramagnetic resonance (EPR) spectroscopy as the first technique capable of time-resolved and quantitative detection of lithium Metal Plating in lithium ion batteries. In an exemplary study, the C-rate dependence of lithium Metal Plating during low-temperature charging at −20 °C is investigated. It is possible to quantify the amount of ‘dead lithium’ and observe the chemical reintercalation of plated lithium Metal. In this way, it is possible to deconvolute the coulombic inefficiency of the lithium Plating/stripping process and quantify the contributions of both dead lithium and active lithium loss due to solid electrolyte interphase (SEI) formation. The time-resolved and quantitative information accessible with operando EPR spectroscopy will be very useful for the optimization of fast charging procedures, testing of electrolyte additives, and model validation.
Selva Camci - One of the best experts on this subject based on the ideXlab platform.
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copper chromium and nickel removal from Metal Plating wastewater by electrocoagulation
Desalination, 2011Co-Authors: Feryal Akbal, Selva CamciAbstract:Abstract Removal of copper (Cu), chromium (Cr) and nickel (Ni) from Metal Plating wastewater by electrocoagulation with iron and aluminum electrodes with monopolar configurations was investigated. The influence of electrode material, current density, wastewater pH and conductivity on removal performance was explored. The results showed that Metal removal increased with increasing current density, pH and conductivity. The efficiency of different electrode materials (iron, aluminum) was compared. The results indicated that electrocoagulation with an Fe–Al electrode pair was very efficient and was able to achieve 100% Cu, 100% Cr and 100% Ni removal at an electrocoagulation time of 20 min, a current density of 10 mA/cm2 and a pH of 3.0. Corresponding energy and electrode consumptions were determined as 10.07 kWh/m3 and 1.08 kg/m3, respectively.
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comparison of electrocoagulation and chemical coagulation for heavy Metal removal
Chemical Engineering & Technology, 2010Co-Authors: Feryal Akbal, Selva CamciAbstract:Copper (Cu), chromium (Cr), and nickel (Ni) removal from Metal Plating wastewater by electrocoagulation and chemical coagulation was investigated. Chemical coagulation was performed using either aluminum sulfate or ferric chloride, whereas electrocoagulation was done in an electrolytic cell using aluminum or iron electrodes. By chemical coagulation, Cu-, Cr-, and Ni-removal of 99.9 % was achieved with aluminum sulfate and ferric chloride dosages of 500, 1000, and 2000 mg L ―1 , respectively. Removal of Metals by electrocoagulation was affected by the electrode material, wastewater pH, current density, number of electrodes, and electrocoagulation time. Electrocoagulation with iron electrodes at a current density of 10 mA cm ―2 , electrocoagulation time of 20 min, and pH 3.0 resulted in 99.9 % Cu-, 99.9 % Cr-, and 98 % Ni-removal.