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Dimitrios Maroudas - One of the best experts on this subject based on the ideXlab platform.
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Stabilization of the surface morphology of stressed solids using thermal gradients
Applied Physics Letters, 2014Co-Authors: Dwaipayan Dasgupta, Dimitrios MaroudasAbstract:We examine the surface morphological stability of thermally conducting crystalline elastic solids in uniaxial tension under the action of a temperature gradient. We use linear stability theory and self-consistent dynamical simulations based on a surface mass transport model that accounts for surface thermomigration induced by the applied thermal gradient, surface diffusional anisotropy, and the temperature dependence of surface diffusivity. We find that a properly directed thermal gradient of magnitude higher than a critical value can stabilize the planar surface morphology. Under conditions typical of Metallic Thin-Film interconnects, the required critical thermal gradient is on the order of 100 K/cm.
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Theoretical analysis of texture effects on the surface morphological stability of Metallic Thin Films
Applied Physics Letters, 2008Co-Authors: Vikas Tomar, M. Rauf Gungor, Dimitrios MaroudasAbstract:By using a nonlinear model of surface morphological evolution, linear stability analysis, and self-consistent dynamical simulations, we analyze the effects of surface crystallographic orientation of a Metallic Thin Film on its surface morphological response to the simultaneous action of an electric field and mechanical stress. The analysis reveals improved surface morphological stability over a range of misorientation angles between the electric-field direction and “easy surface diffusion” directions; for ⟨111⟩-oriented surfaces in fcc metals, the surface morphological response is superior to that of ⟨110⟩- and ⟨100⟩-oriented surfaces. This finding provides an interpretation for the longer electromigration lifetime of {111}-textured Metallic interconnects.
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Stress-induced deceleration of electromigration-driven void motion in Metallic Thin Films
Journal of Applied Physics, 2007Co-Authors: M. Rauf Gungor, Dimitrios MaroudasAbstract:We report effects of biaxially applied stress on the electromigration-driven motion of morphologically stable voids in elastically deforming Metallic Thin Films based on self-consistent numerical simulations of void evolution. We find that under certain electromechanical conditions, the applied stress can cause substantial deceleration of the electromigration-driven void motion, as measured by the migration speed of morphologically stable voids translating along the Metallic Thin Film. This effect reveals a new aspect of the complex evolution of voids in Metallic Thin Films under the action of external fields: deceleration of electromigration-driven void motion and even complete inhibition of such motion may be possible through application of mechanical stress.
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Theoretical analysis of current-driven interactions between voids in Metallic Thin Films
Journal of Applied Physics, 2007Co-Authors: Jaeseol Cho, M. Rauf Gungor, Dimitrios MaroudasAbstract:We analyze the electromigration-induced interactions between voids in Metallic Thin Films using self-consistent numerical simulations of current-driven void morphological evolution. We focus on the interactions between two voids that, if isolated, they would be morphologically stable and migrate at constant speed along the Metallic Thin Film. It is demonstrated that, under certain electromigration conditions, two such different-sized voids migrating in the same direction along a Metallic Thin Film can lead to stable time-periodic states characterized by wave propagation on a void’s surface or cause failure prior to or following their coalescence. Moreover, various complex phenomena are revealed, including void breakup into two morphologically stable voids following the coalescence of the original two voids and voids attempting to pass each other. In numerous cases, it is noteworthy that the void-void interactions examined arise due to a larger void migrating faster than an originally leading smaller one i...
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Analysis of Electromigration-Induced Void Motion and Surface Oscillations in Metallic Thin-Film Interconnects
MRS Proceedings, 2005Co-Authors: Jaeseol Cho, M. Rauf Gungor, Dimitrios MaroudasAbstract:AbstractAn analysis is presented of electromigration-induced migration and oscillatory dynamics of morphologically stable void surfaces based on self-consistent numerical simulations of morphological evolution of voids in Metallic Thin Films. As the morphological stability limit is approached, the migration speed of a stable void deviates substantially from being inversely proportional to the void size, a well-known result that is rigorously valid in an infinite conductor with isotropic material properties. A non-linear shape function that includes both current crowding and diffusional anisotropy effects is used to rescale properly the void migration speed resulting in a universally valid relationship for the migration speed as a function of void size. Furthermore, in grains characterized by high symmetry of surface diffusional anisotropy, our analysis predicts the onset of stable time-periodic states for the void surface morphology that correspond to waves propagating on surfaces of voids that migrate along the Metallic Film at constant speeds.
M. Rauf Gungor - One of the best experts on this subject based on the ideXlab platform.
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Theoretical analysis of texture effects on the surface morphological stability of Metallic Thin Films
Applied Physics Letters, 2008Co-Authors: Vikas Tomar, M. Rauf Gungor, Dimitrios MaroudasAbstract:By using a nonlinear model of surface morphological evolution, linear stability analysis, and self-consistent dynamical simulations, we analyze the effects of surface crystallographic orientation of a Metallic Thin Film on its surface morphological response to the simultaneous action of an electric field and mechanical stress. The analysis reveals improved surface morphological stability over a range of misorientation angles between the electric-field direction and “easy surface diffusion” directions; for ⟨111⟩-oriented surfaces in fcc metals, the surface morphological response is superior to that of ⟨110⟩- and ⟨100⟩-oriented surfaces. This finding provides an interpretation for the longer electromigration lifetime of {111}-textured Metallic interconnects.
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Stress-induced deceleration of electromigration-driven void motion in Metallic Thin Films
Journal of Applied Physics, 2007Co-Authors: M. Rauf Gungor, Dimitrios MaroudasAbstract:We report effects of biaxially applied stress on the electromigration-driven motion of morphologically stable voids in elastically deforming Metallic Thin Films based on self-consistent numerical simulations of void evolution. We find that under certain electromechanical conditions, the applied stress can cause substantial deceleration of the electromigration-driven void motion, as measured by the migration speed of morphologically stable voids translating along the Metallic Thin Film. This effect reveals a new aspect of the complex evolution of voids in Metallic Thin Films under the action of external fields: deceleration of electromigration-driven void motion and even complete inhibition of such motion may be possible through application of mechanical stress.
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Theoretical analysis of current-driven interactions between voids in Metallic Thin Films
Journal of Applied Physics, 2007Co-Authors: Jaeseol Cho, M. Rauf Gungor, Dimitrios MaroudasAbstract:We analyze the electromigration-induced interactions between voids in Metallic Thin Films using self-consistent numerical simulations of current-driven void morphological evolution. We focus on the interactions between two voids that, if isolated, they would be morphologically stable and migrate at constant speed along the Metallic Thin Film. It is demonstrated that, under certain electromigration conditions, two such different-sized voids migrating in the same direction along a Metallic Thin Film can lead to stable time-periodic states characterized by wave propagation on a void’s surface or cause failure prior to or following their coalescence. Moreover, various complex phenomena are revealed, including void breakup into two morphologically stable voids following the coalescence of the original two voids and voids attempting to pass each other. In numerous cases, it is noteworthy that the void-void interactions examined arise due to a larger void migrating faster than an originally leading smaller one i...
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Analysis of Electromigration-Induced Void Motion and Surface Oscillations in Metallic Thin-Film Interconnects
MRS Proceedings, 2005Co-Authors: Jaeseol Cho, M. Rauf Gungor, Dimitrios MaroudasAbstract:AbstractAn analysis is presented of electromigration-induced migration and oscillatory dynamics of morphologically stable void surfaces based on self-consistent numerical simulations of morphological evolution of voids in Metallic Thin Films. As the morphological stability limit is approached, the migration speed of a stable void deviates substantially from being inversely proportional to the void size, a well-known result that is rigorously valid in an infinite conductor with isotropic material properties. A non-linear shape function that includes both current crowding and diffusional anisotropy effects is used to rescale properly the void migration speed resulting in a universally valid relationship for the migration speed as a function of void size. Furthermore, in grains characterized by high symmetry of surface diffusional anisotropy, our analysis predicts the onset of stable time-periodic states for the void surface morphology that correspond to waves propagating on surfaces of voids that migrate along the Metallic Film at constant speeds.
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Analysis of Electromigration- and Stress-Induced Dynamical Response of Voids Confined in Metallic Thin Films
MRS Proceedings, 2005Co-Authors: M. Rauf Gungor, Jaeseol Cho, Dimitrios MaroudasAbstract:AbstractA theoretical analysis based on self-consistent dynamical simulations is presented of electromigration- and stress-induced surface morphological response of voids confined in Metallic Thin Films. The analysis predicts the onset of stable time-periodic states for the void surface morphological response, which is associated with current-driven wave propagation on the void surface. This time-periodic response is demonstrated under certain electromigration conditions and detailed response diagrams are presented which map the corresponding parameter space to regions of steady, time-periodic, and unstable surface morphological response. The evolution of the electrical resistance of these Thin Films also is computed, providing an interpretation for experimentally observed time-periodic response of the electrical resistance of Metallic interconnect lines on the basis of current-driven void morphological evolution. In addition, we demonstrate significant effects on the electromigration-induced morphologically stable void migration of mechanical stress application in a Metallic Thin Film. Specifically, we find that under certain electromechanical conditions, elastic stress can cause substantial retardation of void motion, as measured by the constant speed of electromigration-induced translation of morphologically stable voids. More importantly, this effect suggests the possibility for complete inhibition of void motion under stress.
Jaeseol Cho - One of the best experts on this subject based on the ideXlab platform.
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Theoretical analysis of current-driven interactions between voids in Metallic Thin Films
Journal of Applied Physics, 2007Co-Authors: Jaeseol Cho, M. Rauf Gungor, Dimitrios MaroudasAbstract:We analyze the electromigration-induced interactions between voids in Metallic Thin Films using self-consistent numerical simulations of current-driven void morphological evolution. We focus on the interactions between two voids that, if isolated, they would be morphologically stable and migrate at constant speed along the Metallic Thin Film. It is demonstrated that, under certain electromigration conditions, two such different-sized voids migrating in the same direction along a Metallic Thin Film can lead to stable time-periodic states characterized by wave propagation on a void’s surface or cause failure prior to or following their coalescence. Moreover, various complex phenomena are revealed, including void breakup into two morphologically stable voids following the coalescence of the original two voids and voids attempting to pass each other. In numerous cases, it is noteworthy that the void-void interactions examined arise due to a larger void migrating faster than an originally leading smaller one i...
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Analysis of Electromigration-Induced Void Motion and Surface Oscillations in Metallic Thin-Film Interconnects
MRS Proceedings, 2005Co-Authors: Jaeseol Cho, M. Rauf Gungor, Dimitrios MaroudasAbstract:AbstractAn analysis is presented of electromigration-induced migration and oscillatory dynamics of morphologically stable void surfaces based on self-consistent numerical simulations of morphological evolution of voids in Metallic Thin Films. As the morphological stability limit is approached, the migration speed of a stable void deviates substantially from being inversely proportional to the void size, a well-known result that is rigorously valid in an infinite conductor with isotropic material properties. A non-linear shape function that includes both current crowding and diffusional anisotropy effects is used to rescale properly the void migration speed resulting in a universally valid relationship for the migration speed as a function of void size. Furthermore, in grains characterized by high symmetry of surface diffusional anisotropy, our analysis predicts the onset of stable time-periodic states for the void surface morphology that correspond to waves propagating on surfaces of voids that migrate along the Metallic Film at constant speeds.
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Analysis of Electromigration- and Stress-Induced Dynamical Response of Voids Confined in Metallic Thin Films
MRS Proceedings, 2005Co-Authors: M. Rauf Gungor, Jaeseol Cho, Dimitrios MaroudasAbstract:AbstractA theoretical analysis based on self-consistent dynamical simulations is presented of electromigration- and stress-induced surface morphological response of voids confined in Metallic Thin Films. The analysis predicts the onset of stable time-periodic states for the void surface morphological response, which is associated with current-driven wave propagation on the void surface. This time-periodic response is demonstrated under certain electromigration conditions and detailed response diagrams are presented which map the corresponding parameter space to regions of steady, time-periodic, and unstable surface morphological response. The evolution of the electrical resistance of these Thin Films also is computed, providing an interpretation for experimentally observed time-periodic response of the electrical resistance of Metallic interconnect lines on the basis of current-driven void morphological evolution. In addition, we demonstrate significant effects on the electromigration-induced morphologically stable void migration of mechanical stress application in a Metallic Thin Film. Specifically, we find that under certain electromechanical conditions, elastic stress can cause substantial retardation of void motion, as measured by the constant speed of electromigration-induced translation of morphologically stable voids. More importantly, this effect suggests the possibility for complete inhibition of void motion under stress.
Johan Akerman - One of the best experts on this subject based on the ideXlab platform.
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direct observation of a propagating spin wave induced by spin transfer torque
Nature Nanotechnology, 2011Co-Authors: M Madami, Stefano Bonetti, Giancarlo Consolo, S Tacchi, G Carlotti, G Gubbiotti, Fred Mancoff, Johan AkermanAbstract:A spin wave launched by a nanoscale ohmic contact into a ferromagnetic Metallic Thin Film is able to propagate for at least four micrometres.
Vikas Tomar - One of the best experts on this subject based on the ideXlab platform.
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Theoretical analysis of texture effects on the surface morphological stability of Metallic Thin Films
Applied Physics Letters, 2008Co-Authors: Vikas Tomar, M. Rauf Gungor, Dimitrios MaroudasAbstract:By using a nonlinear model of surface morphological evolution, linear stability analysis, and self-consistent dynamical simulations, we analyze the effects of surface crystallographic orientation of a Metallic Thin Film on its surface morphological response to the simultaneous action of an electric field and mechanical stress. The analysis reveals improved surface morphological stability over a range of misorientation angles between the electric-field direction and “easy surface diffusion” directions; for ⟨111⟩-oriented surfaces in fcc metals, the surface morphological response is superior to that of ⟨110⟩- and ⟨100⟩-oriented surfaces. This finding provides an interpretation for the longer electromigration lifetime of {111}-textured Metallic interconnects.