The Experts below are selected from a list of 35856 Experts worldwide ranked by ideXlab platform
Guna S Selvaduray - One of the best experts on this subject based on the ideXlab platform.
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lead free solders in Microelectronics
Materials Science & Engineering R-reports, 2000Co-Authors: Mulugeta Abtew, Guna S SelvadurayAbstract:Abstract Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable “Pb-free” solders an important issue for Microelectronics assembly. Approximately 70 Pb-free solder alloy compositions have been proposed thus far. There is a general lack of engineering information, and there is also significant disparity in the information available on these alloys. The issues involved can be divided into two broad categories: manufacturing and reliability/performance. A major factor affecting alloy selection is the melting point of the alloy, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and intermetallic compound formation. The data available in the open literature have been reviewed and are summarized in this paper. Where data were not available, such as for corrosion and oxidation resistance, chemical thermodynamics was used to develop this information. While a formal alloy selection decision analysis methodology has not been developed, less formal approaches indicate that Sn-rich alloys will be the Pb-free solder alloys of choice, with three to four alloys being identified for each of the different applications. Research on this topic continues at the present time at a vigorous pace, in view of the imminence of the issue.
Glen D Wilk - One of the best experts on this subject based on the ideXlab platform.
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high κ dielectric materials for Microelectronics
Critical Reviews in Solid State and Materials Sciences, 2003Co-Authors: Robert M Wallace, Glen D WilkAbstract:This article reviews the current status of high-κ dielectric materials for Microelectronics. In particular, recent work impacting the integration of these high-κ materials for gate dielectric and capacitor applications in advanced scaled microelectronic devices is reviewed.
Kenny C Otiaba - One of the best experts on this subject based on the ideXlab platform.
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fatigue life of lead free solder thermal interface materials at varying bond line thickness in Microelectronics
Microelectronics Reliability, 2014Co-Authors: Mathias Ekpu, R S Bhatti, Michael Okereke, Sabuj Mallik, Kenny C OtiabaAbstract:Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area. The use of lead-free solders as thermal interface materials to improve the heat conduction between a chip level device and a heat sink is becoming popular due to their promising thermal and mechanical material properties. Finite element modelling was employed in the analysis of the fatigue life of three lead-free solders (SAC105, SAC305, and SAC405) under commercial thermal cycling load (between −40 °C and 85 °C). This paper presents the results of the simulation work focusing on the effect of varying the solder thermal interface thickness (or bond line thickness) on the reliability of the microelectronic device. The results obtained were based on stress, strain, deformation, and plastic work density. The results showed that the fatigue life of the three solders increases as the solder thermal interface thickness increases. Also, the stresses, strains, and deformation were highest around the edges and vertices of the solder interface. In addition, the optimal solder material of choice based on the criteria of this research is given as SAC405. It has higher operational life span and good reliability capabilities.
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fatigue life analysis of sn96 5ag3 0cu0 5 solder thermal interface material of a chip heat sink assembly in microelectronic applications
International Symposium on Microelectronics, 2013Co-Authors: Mathias Ekpu, R S Bhatti, Michael Okereke, Kenny C OtiabaAbstract:The reliability of microelectronic devices during operation has been a major challenge in recent years. Microelectronics devices will fail if one or more components do not function properly. Therma...
Mulugeta Abtew - One of the best experts on this subject based on the ideXlab platform.
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lead free solders in Microelectronics
Materials Science & Engineering R-reports, 2000Co-Authors: Mulugeta Abtew, Guna S SelvadurayAbstract:Abstract Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable “Pb-free” solders an important issue for Microelectronics assembly. Approximately 70 Pb-free solder alloy compositions have been proposed thus far. There is a general lack of engineering information, and there is also significant disparity in the information available on these alloys. The issues involved can be divided into two broad categories: manufacturing and reliability/performance. A major factor affecting alloy selection is the melting point of the alloy, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and intermetallic compound formation. The data available in the open literature have been reviewed and are summarized in this paper. Where data were not available, such as for corrosion and oxidation resistance, chemical thermodynamics was used to develop this information. While a formal alloy selection decision analysis methodology has not been developed, less formal approaches indicate that Sn-rich alloys will be the Pb-free solder alloys of choice, with three to four alloys being identified for each of the different applications. Research on this topic continues at the present time at a vigorous pace, in view of the imminence of the issue.
M R Elizalde - One of the best experts on this subject based on the ideXlab platform.
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cross sectional nanoindentation a new technique for thin film interfacial adhesion characterization
Acta Materialia, 1999Co-Authors: J M Sanchez, S Elmansy, B Sun, Tracey Scherban, N Fang, D Pantuso, W Ford, M R ElizaldeAbstract:Abstract Interfacial adhesion is becoming a critical material property for improving the reliability of multilayer thin film structures used in Microelectronics. Cross-sectional nanoindentation (CSN) is a new mechanical test especially designed for measuring the fracture toughness of thin film interfaces. Interfacial fracture is achieved by nanoindentation in the structure cross-section. A model based on the elastic plate theory has been developed to calculate numerically the interfacial critical energy release rate (Gci) for ceramic–ceramic systems from CSN test results. The model inputs are the thin film elastic properties, thin film thickness, interfacial crack area and maximum thin film deflection during the test. Closed form analytical solutions, obtained for two limiting cases, are consistent with the numerical approach. This technique has been successfully applied to silicon nitride–silicon oxide thin films, commonly used as electrical isolators in microelectronic devices.
