The Experts below are selected from a list of 360 Experts worldwide ranked by ideXlab platform
Keren Bergman - One of the best experts on this subject based on the ideXlab platform.
-
Optical Interconnection networks for high performance systems
2020Co-Authors: Qixiang Cheng, Madeleine Glick, Keren BergmanAbstract:Abstract Large-scale high-performance computing (HPC) systems in the form of supercomputers and warehouse-scale data centers permeate nearly every corner of modern life from applications in scientific research, medical diagnostics and national security to film and fashion recommendations. Vast volumes of data are being processed at the same time that the relatively long term progress of Moore’s Law is slowing advances in transistor density. Data-intensive computations are putting more stress on the Interconnection network, especially those feeding massive data sets into machine learning algorithms. High bandwidth interconnects, essential for maintaining computation performance, are representing an increasing portion of the total energy and cost budgets. Photonic Interconnection networks are often cited as ways to break through the energy-bandwidth limitations of conventional electrical wires to solve bottlenecks and improve interconnect performance. In this chapter, we present an overview of the recent trends and potential solutions to this challenge.
-
design methodology for optimizing Optical Interconnection networks in high performance systems
ISC, 2015Co-Authors: Sebastien Rumley, Madeleine Glick, Simon D Hammond, Arun F Rodrigues, Keren BergmanAbstract:Modern high performance computers connect hundreds of thousands of endpoints and employ thousands of switches. This allows for a great deal of freedom in the design of the network topology. At the same time, due to the sheer numbers and complexity involved, it becomes more challenging to easily distinguish between promising and improper designs. With ever increasing line rates and advances in Optical interconnects, there is a need for renewed design methodologies that comprehensively capture the requirements and expose trade-offs expeditiously in this complex design space. We introduce a systematic approach, based on Generalized Moore Graphs, allowing one to quickly gauge the ideal level of connectivity required for a given number of end-points and traffic hypothesis, and to collect insight on the role of the switch radix in the topology cost. Based on this approach, we present a methodology for the identification of Pareto-optimal topologies. We apply our method to a practical case with 25,000 nodes and present the results.
-
low latency rack scale Optical Interconnection network for data center applications
European Conference on Optical Communication, 2013Co-Authors: Sebastien Rumley, Gouri Dongaonkar, Robert Hendry, Madeleine Glick, Keren Bergman, Raj DuttAbstract:Warehouse scale datacenters running complex applications involving many servers require low latency interconnects to avoid excessive delays to the user. The SPINet(Scalable Photonic Interconnection Network) architecture can dynamically support ultralow latencies for packetized light loads and high-bandwidth long flows under heavy traffic.
-
Optical Interconnection networks for high performance computing systems
Reports on Progress in Physics, 2012Co-Authors: Aleksandr Biberman, Keren BergmanAbstract:Enabled by silicon photonic technology, Optical Interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic Interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic Interconnection networks. Furthermore, the advantages of photonic Interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers.
-
experimental demonstration of 10 gigabit ethernet based Optical Interconnection network interface for large scale computing systems
Photomedicine and Laser Surgery, 2011Co-Authors: Wenjia Zhang, Howard Wang, Ajay S Garg, Caroline P Lai, Jintong Lin, Keren BergmanAbstract:A novel 10GE-based Optical network interface card is proposed to connect high performance processors and an Optical Interconnection network. We demonstrate end-to-end link setup, and TCP and HD video streaming utilizing 4×3.125Gb/s wavelength-striped WDM payloads.
Hyo-hoon Park - One of the best experts on this subject based on the ideXlab platform.
-
Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board
IEEE Photonics Technology Letters, 2007Co-Authors: Sung Hwan Hwang, Mu Hee Cho, Sae-kyoung Kang, Hyo-hoon Park, Tae-woo Lee, Byung Sup RhoAbstract:The demonstration of an Optical platform based on an Optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip Optical Interconnection. The Optical platform was designed for 96 Gb/s total throughput which was 2 layers times 4 channels times 4 parallel links times 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D Optical Interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90deg-bent fiber connectors, and 2-D Optical transmitter/receiver (Tx/Rx) modules. The total Optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The Optical Interconnection using an Optical platform was successfully achieved with 3-Gb/s/ch data transmission
-
passively assembled Optical Interconnection system based on an Optical printed circuit board
IEEE Photonics Technology Letters, 2006Co-Authors: Sung Hwan Hwang, Mu Hee Cho, Sae-kyoung Kang, Han Seo Cho, Kyoung-up Shin, Hyo-hoon Park, Sang Hoon Kim, Sang-won HaAbstract:We propose a passively assembled chip-to-chip Optical Interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded Optical printed-circuit board (OPCB), Optical transmitter/receiver modules, and 90/spl deg/-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An Optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.
-
Optical printed circuit board and Optical Interconnection block using Optical fiber bundle
2005Co-Authors: Mu Hee Cho, Han Seo Cho, Hyo-hoon Park, Kyung Rok KimAbstract:Disclosed is an Optical printed circuit board (PCB) having a multi-channel Optical waveguide, which comprises: an Optical waveguide having an Optical path for transmitting light beams; a groove for penetrating the Optical waveguide; and an Optical Interconnection block inserted in the groove and connected to the Optical waveguide to transmit the light beams, wherein the Optical Interconnection block includes an Optical fiber bundle bent by the angle of 90°. The Optical Interconnection block connects a plurality of multi-layered Optical waveguides to transmit light beams to the Optical waveguides. The Optical fiber bundle is installed as a medium of the multi-channel Optical waveguide in the Optical PCB.
-
high coupling efficiency Optical Interconnection using a 90 spl deg bent fiber array connector in Optical printed circuit boards
IEEE Photonics Technology Letters, 2005Co-Authors: Mu Hee Cho, Han Seo Cho, Sung Hwan Hwang, Hyo-hoon ParkAbstract:A high-coupling-efficiency Optical Interconnection has been demonstrated using a 90/spl deg/-bent fiber array connector to deflect beams between surface-emitting lasers or surface-receiving photodiodes and Optical layers embedded in a board. A 90/spl deg/-bent fiber array is mounted in a tetragonal body with a millimeter scale size to make it suitable for passive packaging in the board. The bending radius of silica fibers in the connector was controlled to have 1.5 mm resulting in bending loss of about 0.5 dB. An Optical link of 2.5-Gb/s signals with a total Interconnection loss of -1.3 dB was demonstrated using the connectors and a fiber-embedded board.
-
pcb compatible Optical Interconnection using 45 spl deg ended connection rods and via holed waveguides
Journal of Lightwave Technology, 2004Co-Authors: Byung Sup Rho, Sae-kyoung Kang, Han Seo Cho, Sang-won Ha, Hyo-hoon Park, Byoungho RheeAbstract:In this paper, a new architecture for a chip-to-chip Optical Interconnection system is demonstrated that can be applied in a waveguide-embedded Optical printed circuit board (PCB). The experiment used 45/spl deg/-ended Optical connection rods as a medium to guide light paths perpendicularly between vertical-cavity surface-emitting lasers (VCSELs), or photodiodes (PDs) and a waveguide. A polymer film of multimode waveguides with cores of 100/spl times/65 /spl mu/m was sandwiched between conventional PCBs. Via holes were made with a diameter of about 140 /spl mu/m by CO/sub 2/-laser drilling through the PCB and the waveguide. Optical connection rods were made of a multimode silica fiber ribbon segment with a core diameter of 62.5 and 100 /spl mu/m. One end of the fiber segment was cut 45/spl deg/ and the other end 90/spl deg/ by a mechanical polishing method. These fiber rods were inserted into the via holes formed in the PCB, adjusting the insertion depth to locate the 45/spl deg/ end of rods near the waveguide cores. From this Interconnection system, a total coupling efficiency of about -8 dB was achieved between VCSELs and PDs through connection rods and a 2.5 Gb/s /spl times/ 12-ch data link demonstrated through waveguides with a channel pitch of 250 /spl mu/m in the Optical PCB.
Hui Yang - One of the best experts on this subject based on the ideXlab platform.
-
sudoi software defined networking for ubiquitous data center Optical Interconnection
IEEE Communications Magazine, 2016Co-Authors: Hui Yang, Jie Zhang, Yongli Zhao, Jianrui Han, Yi Lin, Young LeeAbstract:Ubiquitous data center Optical Interconnection is a promising scenario to meet the high burstiness and high-bandwidth requirements of services in terms of the user-access-oriented Interconnection between user and data center, inter-data- center, and intra-data-center Interconnection. However, in the current mode of operation, the control of the data center and Optical network is separately deployed. Enabling even limited interworking among these separated control systems does not provide a mechanism to exchange resource information and enhance the high-level performance requirement of applications. Our previous work implemented cross-stratum optimization of Optical network and application strata resources inter-data-center, which allows the accommodation of data center services. In view of this, this study extends to the ubiquitous data center Optical Interconnection scenario. This article presents a novel SUDOI architecture aimed at extensive user access from the perspective of heterogeneous cross-stratum and multi-layer networking modes. SUDOI can enable cross-stratum optimization of application and Optical network stratum resources, and enhance multiple- layer resource integration in the ubiquitous data center Optical Interconnection. The functional modules of SUDOI architecture, including the core elements of various controllers, are described in detail. The cooperation procedure in user-access-oriented Interconnection, multiple- layer resource integration inter-data-center, and intra-data-center service modes is investigated. The feasibility and efficiency of the proposed architecture are also experimentally demonstrated on our OaaS testbed with OpenFlow-enabled Optical nodes, and compared to the CSO scheme in terms of blocking probability and resource occupation rate. Numerical results are given and analyzed based on the testbed. Some future discussion and exploration issues are presented in the conclusion.
-
performance evaluation of time aware enhanced software defined networking tesdn for elastic data center Optical Interconnection
Optics Express, 2014Co-Authors: Hui Yang, Jie Zhang, Yongli Zhao, Yuefeng Ji, Hui Li, Gang LiAbstract:Data center Interconnection with elastic Optical networks is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. We previously implemented enhanced software defined networking over elastic Optical network for data center application [Opt. Express 21, 26990 (2013)]. On the basis of it, this study extends to consider the time-aware data center service scheduling with elastic service time and service bandwidth according to the various time sensitivity requirements. A novel time-aware enhanced software defined networking (TeSDN) architecture for elastic data center Optical Interconnection has been proposed in this paper, by introducing a time-aware resources scheduling (TaRS) scheme. The TeSDN can accommodate the data center services with required QoS considering the time dimensionality, and enhance cross stratum optimization of application and elastic Optical network stratums resources based on spectrum elasticity, application elasticity and time elasticity. The overall feasibility and efficiency of the proposed architecture is experimentally verified on our OpenFlow-based testbed. The performance of TaRS scheme under heavy traffic load scenario is also quantitatively evaluated based on TeSDN architecture in terms of blocking probability and resource occupation rate.
Mu Hee Cho - One of the best experts on this subject based on the ideXlab platform.
-
Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board
IEEE Photonics Technology Letters, 2007Co-Authors: Sung Hwan Hwang, Mu Hee Cho, Sae-kyoung Kang, Hyo-hoon Park, Tae-woo Lee, Byung Sup RhoAbstract:The demonstration of an Optical platform based on an Optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip Optical Interconnection. The Optical platform was designed for 96 Gb/s total throughput which was 2 layers times 4 channels times 4 parallel links times 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D Optical Interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90deg-bent fiber connectors, and 2-D Optical transmitter/receiver (Tx/Rx) modules. The total Optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The Optical Interconnection using an Optical platform was successfully achieved with 3-Gb/s/ch data transmission
-
passively assembled Optical Interconnection system based on an Optical printed circuit board
IEEE Photonics Technology Letters, 2006Co-Authors: Sung Hwan Hwang, Mu Hee Cho, Sae-kyoung Kang, Han Seo Cho, Kyoung-up Shin, Hyo-hoon Park, Sang Hoon Kim, Sang-won HaAbstract:We propose a passively assembled chip-to-chip Optical Interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded Optical printed-circuit board (OPCB), Optical transmitter/receiver modules, and 90/spl deg/-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An Optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.
-
Optical printed circuit board and Optical Interconnection block using Optical fiber bundle
2005Co-Authors: Mu Hee Cho, Han Seo Cho, Hyo-hoon Park, Kyung Rok KimAbstract:Disclosed is an Optical printed circuit board (PCB) having a multi-channel Optical waveguide, which comprises: an Optical waveguide having an Optical path for transmitting light beams; a groove for penetrating the Optical waveguide; and an Optical Interconnection block inserted in the groove and connected to the Optical waveguide to transmit the light beams, wherein the Optical Interconnection block includes an Optical fiber bundle bent by the angle of 90°. The Optical Interconnection block connects a plurality of multi-layered Optical waveguides to transmit light beams to the Optical waveguides. The Optical fiber bundle is installed as a medium of the multi-channel Optical waveguide in the Optical PCB.
-
high coupling efficiency Optical Interconnection using a 90 spl deg bent fiber array connector in Optical printed circuit boards
IEEE Photonics Technology Letters, 2005Co-Authors: Mu Hee Cho, Han Seo Cho, Sung Hwan Hwang, Hyo-hoon ParkAbstract:A high-coupling-efficiency Optical Interconnection has been demonstrated using a 90/spl deg/-bent fiber array connector to deflect beams between surface-emitting lasers or surface-receiving photodiodes and Optical layers embedded in a board. A 90/spl deg/-bent fiber array is mounted in a tetragonal body with a millimeter scale size to make it suitable for passive packaging in the board. The bending radius of silica fibers in the connector was controlled to have 1.5 mm resulting in bending loss of about 0.5 dB. An Optical link of 2.5-Gb/s signals with a total Interconnection loss of -1.3 dB was demonstrated using the connectors and a fiber-embedded board.
Sung Hwan Hwang - One of the best experts on this subject based on the ideXlab platform.
-
Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board
IEEE Photonics Technology Letters, 2007Co-Authors: Sung Hwan Hwang, Mu Hee Cho, Sae-kyoung Kang, Hyo-hoon Park, Tae-woo Lee, Byung Sup RhoAbstract:The demonstration of an Optical platform based on an Optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip Optical Interconnection. The Optical platform was designed for 96 Gb/s total throughput which was 2 layers times 4 channels times 4 parallel links times 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D Optical Interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90deg-bent fiber connectors, and 2-D Optical transmitter/receiver (Tx/Rx) modules. The total Optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The Optical Interconnection using an Optical platform was successfully achieved with 3-Gb/s/ch data transmission
-
passively assembled Optical Interconnection system based on an Optical printed circuit board
IEEE Photonics Technology Letters, 2006Co-Authors: Sung Hwan Hwang, Mu Hee Cho, Sae-kyoung Kang, Han Seo Cho, Kyoung-up Shin, Hyo-hoon Park, Sang Hoon Kim, Sang-won HaAbstract:We propose a passively assembled chip-to-chip Optical Interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded Optical printed-circuit board (OPCB), Optical transmitter/receiver modules, and 90/spl deg/-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An Optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.
-
high coupling efficiency Optical Interconnection using a 90 spl deg bent fiber array connector in Optical printed circuit boards
IEEE Photonics Technology Letters, 2005Co-Authors: Mu Hee Cho, Han Seo Cho, Sung Hwan Hwang, Hyo-hoon ParkAbstract:A high-coupling-efficiency Optical Interconnection has been demonstrated using a 90/spl deg/-bent fiber array connector to deflect beams between surface-emitting lasers or surface-receiving photodiodes and Optical layers embedded in a board. A 90/spl deg/-bent fiber array is mounted in a tetragonal body with a millimeter scale size to make it suitable for passive packaging in the board. The bending radius of silica fibers in the connector was controlled to have 1.5 mm resulting in bending loss of about 0.5 dB. An Optical link of 2.5-Gb/s signals with a total Interconnection loss of -1.3 dB was demonstrated using the connectors and a fiber-embedded board.