The Experts below are selected from a list of 2832 Experts worldwide ranked by ideXlab platform
Yair Eineli - One of the best experts on this subject based on the ideXlab platform.
-
copper corrosion mitigation by binary inhibitor compositions of Potassium Sorbate and benzotriazole
Corrosion Science, 2014Co-Authors: Danny Gelman, David Starosvetsky, Yair EineliAbstract:This work presents the combined effect of two inhibitors, Potassium Sorbate (2,4-hexadienoic acid Potassium salt) and 1,2,3-benzotriazole, on the corrosion behavior of copper in sulfate based solutions. Individual and combined characteristics of copper corrosion inhibition in sulfate solution in the presence of Potassium Sorbate (K-Sorbate) and benzotriazole (BTAH) were studied with the use of electrochemical, microscopic and spectroscopic methods. Whereas, BTAH alone protects copper from corrosion attack in sulfate solutions only in a limited potential range below 0.4 V vs. saturated calomel electrode (SCE), the presence of K-Sorbate combined with BTAH in such solutions enables the protection of the copper surface at potentials above 0.4 VSCE. The mixture of both inhibitors provides supplementary and robust corrosion protection of Cu over a wide potential range.
-
Potassium Sorbate as an inhibitor in copper chemical mechanical planarization slurry part i elucidating slurry chemistry
Electrochimica Acta, 2010Co-Authors: Magi Nagar, David Starosvetsky, Jan Vaes, Yair EineliAbstract:The integration of an advanced inhibitor, Potassium Sorbate (K[CH3(CH)4CO2]), in a copper CMP slurry based on hydrogen peroxide and glycine is reported. The first part of the study discusses the slurry chemistry by qualitatively describing the processes involved and proposes a mechanism for a hydrogen peroxide–glycine based slurry having Sorbate anion as an inhibitor. For this purpose, the specific role of each chemical constituent in the slurry was elucidated at a fundamental level by electrochemical studies, X-ray photon spectroscopy (XPS) and contact angle measurements, all linked to the CMP performance on blanket wafers. Once the polishing mechanism was resolved the influence of the inhibitor was evaluated by CMP processing of patterned wafers.
-
reprint of Potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in Potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 Potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the Potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in Potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of Potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
-
Potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in Potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 Potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the Potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in Potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of Potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
-
Potassium Sorbate a new aqueous copper corrosion inhibitor electrochemical and spectroscopic studies
Electrochimica Acta, 2007Co-Authors: Esta Abelev, David Starosvetsky, Yair EineliAbstract:This work presents the novel nature of 2,4-hexadienoic acid Potassium salt (Potassium Sorbate (KCH3CH CHCH CHCO2)) as an effective copper aqueous corrosion inhibitor. The influence of pH and Potassium Sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in Potassium Sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of Potassium Sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-Sorbate at the metal surface.
Esta Abelev - One of the best experts on this subject based on the ideXlab platform.
-
reprint of Potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in Potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 Potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the Potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in Potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of Potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
-
Potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in Potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 Potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the Potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in Potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of Potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
-
Potassium Sorbate a new aqueous copper corrosion inhibitor electrochemical and spectroscopic studies
Electrochimica Acta, 2007Co-Authors: Esta Abelev, David Starosvetsky, Yair EineliAbstract:This work presents the novel nature of 2,4-hexadienoic acid Potassium salt (Potassium Sorbate (KCH3CH CHCH CHCO2)) as an effective copper aqueous corrosion inhibitor. The influence of pH and Potassium Sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in Potassium Sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of Potassium Sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-Sorbate at the metal surface.
Lía N. Gerschenson - One of the best experts on this subject based on the ideXlab platform.
-
micro nanoparticles containing Potassium Sorbate obtained by the dialysis technique effect of starch concentration and starch ester type on the particle properties
Food Hydrocolloids, 2019Co-Authors: Lía N. Gerschenson, Paola Alzate, Silvia K FloresAbstract:Abstract Micro/nanoparticles based on native (NTS), acetate (ATS) and oleate (OTS) tapioca starch were produced by dialysis technique as new materials with capacity to support the antimicrobial Potassium Sorbate (PS). The influence of NTS concentration (0.33, 3.33 and 33.33 mg NTS/mL DMSO) on the particle size and PS content (PSC) was analyzed. Dialysis promoted the disruption of granules and the re-association of the starch producing mainly nanometric particles (
-
effect of the Potassium Sorbate and carvacrol addition on the properties and antimicrobial activity of tapioca starch hydroxypropyl methylcellulose edible films
Starch-starke, 2017Co-Authors: Paola Alzate, Lía N. Gerschenson, Silvia Karina Flores, Sofia MiramontAbstract:Tapioca starch (TS), hydroxypropyl methylcellulose (HPMC) and glycerol (GLY) based edible films with the addition of Potassium Sorbate (KS) and carvacrol (CARV) were prepared by casting technique. The effect of antimicrobial concentrations on the color, mechanical properties, solubility in water (SW), water vapor permeability (WVP) and antimicrobial effectiveness of films was analyzed and the composition was optimized by using a response surface methodology (RSM). The films were transparent and slightly yellow but with high L* values (89-91). Potassium Sorbate incorporation increased the color parameter values and presented an antagonistic interaction with CARV for b* and yellow index (YI). A higher amount of CARV drastically decreased the stress at break and increased the deformation and the SW of the films. The water vapor permeability (1.1 ± 0.1 × 10−9 g m−1 s−1 Pa−1) was not influenced by the different concentrations of antimicrobials. The film formulated with KS 0.30 g 100 g−1 and CARV 0.50 g 100 g−1 correctly satisfied the requests of mechanical strength, colorless and appropriate bioavailability of antimicrobials for Z. bailii. This optimized film showed a higher surface hydrophobicity and exerted a highly improved antimicrobial barrier against Z. bailii, L. plantarum and P. fluorescens in comparison with films containing only KS. The obtained results demonstrate the ability of films to act as an antimicrobial hurdle that can contribute to extend the shelf life of food.
-
interactions between aspartame glucose and xylitol in aqueous systems containing Potassium Sorbate
Lwt - Food Science and Technology, 2008Co-Authors: Maria Fernanda Gliemmo, Lía N. Gerschenson, A M Calvino, O Tamasi, Carmen Adriana CamposAbstract:Abstract The interaction between aspartame, glucose and xylitol in aqueous model systems of pH 3.00 and containing Potassium Sorbate was studied. Potassium Sorbate degradation diminished with the increment of aspartame level from 0.050 to 0.500 g/100 g of system. Xylitol was the humectant that minimized aspartame degradation and non-enzymatic browning development. In general, as expected, presence of aspartame, xylitol or glucose and their mixtures increased the sweetness and they also diminished the sourness of the systems. The addition of 0.050 g of aspartame/100 g of system to the system containing xylitol produced a synergistic effect on sweetness intensity. Based on that trend, it could be concluded that the use of more than one sweetener might allow diminishing the amount of each one of them to assure a specific sweet level. These results stand out the advantage of the use of xylitol as well as the importance of an appropriate choice of the additives and food ingredients to use in the formulation of modified products with lower sugar content to optimize their quality.
-
antimicrobial performance of Potassium Sorbate supported in tapioca starch edible films
European Food Research and Technology, 2007Co-Authors: Silvia Karina Flores, Ana S Haedo, Carmen Adriana Campos, Lía N. GerschensonAbstract:The release and antimicrobial activity of Potassium Sorbate (KS) supported in tapioca starch–glycerol edible films prepared by different gelatinization/drying techniques against Zygosaccharomyces bailii was studied. Antimicrobial release in liquid media of different pHs (3.0–6.0) could be approximated to a pseudo first-order kinetic model and was almost accomplished after 30 min. Filmmaking method involving slow gelatinization and drying rate resulted in the highest fraction of KS released at equilibrium. Rate constant was higher when pH of the receiving media was 4.5 and fast gelatinization/fast drying had been used. The effectiveness of the preservative released for controlling the microbial growth depended on the pH of the receiving media, being higher at pH 3.0. No effect of filmmaking method was observed. In relation to film effectiveness as a barrier to contamination, it was observed that the preservative was available to prevent an external Z. bailii contamination and also to control yeast growth in an acidified (pH 4.5) high water activity (aw = 0.980) semisolid product.
-
physical properties of tapioca starch edible films influence of filmmaking and Potassium Sorbate
Food Research International, 2007Co-Authors: Lía N. Gerschenson, Silvia Karina Flores, Lucia Fama, Ana M Rojas, Silvia GoyanesAbstract:Abstract The effect of different gelatinization and drying techniques on physical properties of tapioca starch edible films containing Sorbates were studied. Method 1 assayed involved 40 min of gelatinization (rate: 1.6 °C/min and 0.3 °C/min) and drying for a week. In this case, films showed the highest tensile stress, elastic modulus ( E ′) and crystalline degree. When method 2 was applied, film forming solutions were gelatinized using constant heating rate (1.8 °C/min) and dried for a week. This technique, showed a reduced tensile stress and E ′. Method 3 involved the same gelatinization procedure as method 2 but a faster drying was performed and a more viscous structure, increased moisture content, poorer water vapour barrier properties and less browning were attained. Solubility, in general, was not affected by technique used. The presence of Potassium Sorbate in the films affected their solubility, colour and mechanical properties. It can be concluded that gelatinization technique and drying method used to obtain edible films affected network characteristics determining changes in physical properties, potentially affecting film performance.
John D. Floros - One of the best experts on this subject based on the ideXlab platform.
-
Film Composition Effects on Diffusion of Potassium Sorbate Through Whey Protein Films
Journal of Food Science, 2003Co-Authors: M. Ozdemir, John D. FlorosAbstract:ABSTRACT: The effect of film composition on Potassium Sorbate diffusion in whey protein films was studied using mixture response surface methodology. The model developed for Potassium Sorbate diffusivity was statistically significant (P < 0.01) with no significant lack of fit. The diffusivities of Potassium Sorbate in the films at 25 °C varied between 5.4 and 9.8 × 10−11 m2/s. Amounts of protein, sorbitol, beeswax, and Potassium Sorbate in the films significantly affected Potassium Sorbate diffusion coefficients. Increasing the relative amounts of protein and beeswax in the films decreased Potassium Sorbate diffusivity, while increasing the relative amounts of sorbitol and initial Potassium Sorbate in the films increased the diffusion of Potassium Sorbate. Strong interactions were observed between protein and beeswax, and Potassium Sorbate and beeswax. Keywords: edible films, whey protein, Potassium Sorbate, diffusivity, mixture design
-
analysis and modeling of Potassium Sorbate diffusion through edible whey protein films
Journal of Food Engineering, 2001Co-Authors: M. Ozdemir, John D. FlorosAbstract:Abstract The mechanism of Potassium Sorbate release from edible whey protein films was investigated. Anomalous or non-Fickian diffusion mechanism with diffusional exponents ( n ) between 0.55 and 0.86 were found. A model describing the diffusion of Potassium Sorbate from whey protein films that swelled due to countercurrent diffusion of solvent was used to determine Potassium Sorbate and solvent diffusion coefficients. The diffusivities of Potassium Sorbate at 25°C ranged from 5.38 to 9.76×10 −11 m 2 /s, while those of the solvent from 1.29 to 7.43×10 −10 m 2 /s, depending on film composition.
-
simulating diffusion model and determining diffusivity of Potassium Sorbate through plastics to develop antimicrobial packaging films
Journal of Food Processing and Preservation, 1998Co-Authors: Jung H Han, John D. FlorosAbstract:A diffusion model was simulated by computer programming and diffusivities of Potassium Sorbate through various plastic films were determined by a lag time method. The simulation showed that partition coefficient affected the flux of total penetration but did not affect the lag time. Therefore, the lag time method is appropriate in determining diffusivity, using any value for the partition coefficient. The diffusivities of Potassium Sorbate were 1.83 × 10−8 cm2/s, 4.26 × 10−13 cm2/s, 4.65 × 10−13 cm2/s, and 5.47 × 10−13 cm2/s through low density polyethylene (LDPE), high density polyethylene, polypropylene, and polyethylene terephthalate, respectively at 25 C. Arrhenius equation shows very good fit between the diffusivity and the temperature by the linear regression analysis. D0 and Ea of Potassium Sorbate through LDPE film resulted in 1.98 × 10−6 cm2/s, and 11.83 KJ/mole K. The concentration of Potassium Sorbate was insignificant and did not contribute to the statistical model. This result verifies that the diffusion of Potassium Sorbate in LDPE film is typical case ofFickian diffusion.
-
Potassium Sorbate diffusivity in american processed and mozzarella cheeses
Journal of Food Science, 1998Co-Authors: John D. FlorosAbstract:The diffusivity of Potassium Sorbate in cheeses was determined by using diffusion models and computer programming for examining the residual surface concentration and the penetration of surface-applied Potassium Sorbate into cheese. To determine diffusivity, the concentration of Potassium Sorbate in sliced cheese was measured by penetration time and distance from surface. The diffusivity was calculated by nonlinear regression with experimental data based on Fick's law. The diffusivity of Potassium Sorbate through American processed cheese was 1.31x10 -6 cm 2 /sec and for Mozzarella cheese 6.74x10 -7 cm 2 /sec. This indicated that Mozzarella cheese would maintain surface concentration of Potassium Sorbate above the critical fungistatic level two times longer than American processed cheese.
Achim Walter Hassel - One of the best experts on this subject based on the ideXlab platform.
-
reprint of Potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in Potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 Potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the Potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in Potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of Potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
-
Potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in Potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 Potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the Potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in Potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of Potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.