The Experts below are selected from a list of 112434 Experts worldwide ranked by ideXlab platform
L. Bobb - One of the best experts on this subject based on the ideXlab platform.
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Embedded fiber-optic sensor utilizing the modal Power Distribution technique.
Optics letters, 1990Co-Authors: P. Herczfeld, L. Kawase, Mohamed Sherif, Frank Ko, L. BobbAbstract:The modal Power Distribution technique is applied to a multimode optical fiber embedded in a three-dimensional composite material for real-time characterization and monitoring of the structure. The measurements on the modal Power Distribution within these fibers, and the subsequent reDistribution induced by external perturbation, indicate that the modal Power Distribution technique is more sensitive than the intensity-modulation technique for smart-structure characterization.
Eby G. Friedman - One of the best experts on this subject based on the ideXlab platform.
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Inductive Effects in On-Chip Power Distribution Networks
Power Distribution Networks in High Speed Integrated Circuits, 2020Co-Authors: Andrey V. Mezhiba, Eby G. FriedmanAbstract:The high frequency response of a Power Distribution system is the focus of this chapter. The impedance of the Power Distribution system at high frequencies is determined by the characteristics of the on-chip Power Distribution network. The impedance of a Power system at a specific on-chip location is determined by the local resistive, inductive, and capacitive characteristics of the on-chip network. The resistive and inductive characteristics of the on-chip Power Distribution grids are characterized in Chapters 8 and 12. In this chapter, the impedance characteristics of both the on-chip Power interconnect and the decoupling capacitors are combined to evaluate the noise characteristics of a Power network. The inductance of an on-chip Power Distribution network is shown under specific conditions to be a significant design issue in high speed integrated circuits.
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On-Chip Power Distribution Networks
On-Chip Power Delivery and Management, 2016Co-Authors: Inna P.-vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selcuk Kose, Eby G. FriedmanAbstract:The impedance characteristics of a Power Distribution system are analyzed in the previous chapter based on a one-dimensional circuit model. While useful for understanding the principles of the overall operation of a Power Distribution system, a one-dimensional model is not useful in describing the Distribution of Power and ground across a circuit die. The size of an integrated circuit is usually considerably greater than the wavelength of the signals in the Power Distribution network. Furthermore, the Power consumption of on-chip circuitry (and, consequently, the current drawn from the Power Distribution network) varies across the die area. The voltage across the on-chip Power and ground Distribution networks is therefore non-uniform. It is therefore necessary to consider the two-dimensional structure of the on-chip Power Distribution network to ensure that target performance characteristics of a Power Distribution system are satisfied. The on-chip Power Distribution network should also be considered in the context of a die-package system as the properties of the die-package interface significantly affect the constraints imposed on the electrical characteristics of the on-chip Power Distribution network.
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Computer-Aided Design of Power Distribution Networks
On-Chip Power Delivery and Management, 2016Co-Authors: Inna P.-vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selcuk Kose, Eby G. FriedmanAbstract:The process of computer-aided design and analysis of on-chip Power Distribution networks is discussed in this chapter. The necessity for designing and analyzing the integrity of the Power supply arises at various stages of the integrated circuit design process, as well as during the verification phase. The design and analysis of Power Distribution networks, however, poses unique challenges and requires different approaches as compared to the design and analysis of logic circuits.
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High Performance Power Distribution Systems
Power Distribution Networks with On-Chip Decoupling Capacitors, 2010Co-Authors: Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selcuk Kose, Eby G. FriedmanAbstract:Supplying Power to high performance integrated circuits has become a challenging task. The system supplying Power to an integrated circuit greatly affects the performance, size, and cost characteristics of the overall electronic system. This system is comprised of interconnect networks with decoupling capacitors on a printed circuit board, an integrated circuit package, and a circuit die. The entire system is henceforth referred to as the Power Distribution system. The design of Power Distribution systems is described in this chapter. The focus of the discussion is the overall structure and interaction among the various parts of the system. The impedance characteristics and design of on-chip Power Distribution networks, the most complex part of the Power Distribution system, are discussed in greater detail in the following chapters.
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Power Distribution Networks in High Speed Integrated Circuits
2003Co-Authors: Andrey V. Mezhiba, Eby G. FriedmanAbstract:1. Introduction.- 1.1 Evolution of integrated circuit technology.- 1.2 Evolution of design objectives.- 1.3 The problem of Power Distribution.- 1.4 Deleterious effects of Power Distribution noise.- 1.4.1 Signal delay uncertainty.- 1.4.2 On-chip clock jitter.- 1.4.3 Noise margin degradation.- 1.4.4 Degradation of gate oxide reliability.- 1.5 Book outline.- 2. Inductive Properties of Electric Circuits.- 2.1 Definitions of inductance.- 2.1.1 Field energy definition.- 2.1.2 Magnetic flux definition.- 2.1.3 Partial inductance.- 2.1.4 Net inductance.- 2.2 Variation of inductance with frequency.- 2.2.1 Uniform current density approximation.- 2.2.2 Inductance variation mechanisms.- 2.2.3 Simple circuit model.- 2.3 Inductive behavior of circuits.- 2.4 Inductive properties of on-chip interconnect.- 2.5 Summary.- 3. Properties of On-Chip Inductive Current Loops.- 3.1 Introduction.- 3.2 Dependence of inductance on line length.- 3.3 Inductive coupling between two parallel loop segments.- 3.4 Application to circuit analysis.- 3.5 Summary.- 4. Electromigration.- 4.1 Physical mechanism of electromigration.- 4.2 Electromigration-induced mechanical stress.- 4.3 Steady state limit of electromigration damage.- 4.4 Dependence of electromigration lifetime on the line dimensions.- 4.5 Statistical Distribution of electromigration lifetime.- 4.6 Electromigration lifetime under AC current.- 4.7 Electromigration in novel interconnect technologies.- 4.8 Designing for electromigration reliability.- 4.9 Summary.- 5. High Performance Power Distribution Systems.- 5.1 Physical structure of a Power Distribution system.- 5.2 Circuit model of a Power Distribution system.- 5.3 Output impedance of a Power Distribution system.- 5.4 A Power Distribution system with a decoupling capacitor.- 5.4.1 Impedance characteristics.- 5.4.2 Limitations of a single-tier decoupling scheme.- 5.5 Hierarchical placement of decoupling capacitance.- 5.6 Resonance in Power Distribution networks.- 5.7 Full impedance compensation.- 5.8 Case study.- 5.9 Design considerations.- 5.9.1 Inductance of the decoupling capacitors.- 5.9.2 Interconnect inductance.- 5.10 Limitations of the one-dimensional circuit model.- 5.11 Summary.- 6. On-Chip Power Distribution Networks.- 6.1 Styles of on-chip Power Distribution networks.- 6.1.1 Basic structure of on-chip Power Distribution networks.- 6.1.2 Improving the impedance characteristics of on-chip Power Distribution networks.- 6.1.3 Evolution of Power Distribution networks in Alpha microprocessors.- 6.2 Allocation of on-chip decoupling capacitance.- 6.2.1 Types of on-chip decoupling capacitance.- 6.2.2 Allocation strategies.- 6.2.3 On-chip switching voltage regulator.- 6.3 Die-package interface.- 6.4 Other considerations.- 6.5 Summary.- 7. Computer-Aided Design and Analysis.- 7.1 Design flow for on-chip Power Distribution networks.- 7.2 Linear analysis of Power Distribution networks.- 7.3 Modeling Power Distribution networks.- 7.4 Characterizing the Power current requirements of on-chip circuits.- 7.5 Numerical methods for analyzing Power Distribution networks.- 7.6 Summary.- 8. Inductive Properties of On-Chip Power Distribution Grids.- 8.1 Power transmission circuit.- 8.2 Simulation setup.- 8.3 Grid types.- 8.4 Inductance versus line width.- 8.5 Dependence of inductance on grid type.- 8.5.1 Non-interdigitated versus interdigitated grids.- 8.5.2 Paired versus interdigitated grids.- 8.6 Dependence of Inductance on grid dimensions.- 8.6.1 Dependence of inductance on grid width.- 8.6.2 Dependence of inductance on grid length.- 8.6.3 Sheet inductance of Power grids.- 8.6.4 Efficient computation of grid inductance.- 8.7 Summary.- 9. Variation of Grid Inductance with Frequency.- 9.1 Analysis approach.- 9.2 Discussion of inductance variation.- 9.2.1 Circuit models.- 9.2.2 Analysis of inductance variation.- 9.3 Summary.- 10. Inductance/Area/Resistance Tradeoffs.- 10.1 Inductance vs. resistance tradeoff under a constant grid area constraint.- 10.2 Inductance vs. area tradeoff under a constant grid resistance constraint.- 10.3 Summary.- 11. Scaling Trends Of On-Chip Power Distribution Noise.- 11.1 Prior work.- 11.2 Interconnect characteristics.- 11.2.1 Global interconnect characteristics.- 11.2.2 Scaling of the grid inductance.- 11.2.3 Flip-chip packaging characteristics.- 11.2.4 Impact of on-chip capacitance.- 11.3 Model of Power supply noise.- 11.4 Power supply noise scaling.- 11.4.1 Analysis of constant metal thickness scenario.- 11.4.2 Analysis of the scaled metal thickness scenario.- 11.4.3 ITRS scaling of Power noise.- 11.5 Implications of noise scaling.- 11.6 Summary.- 12. Impedance Characteristics of Multi-Layer Grids.- 12.1 Electrical properties of multi-layer grids.- 12.1.1 Impedance characteristics of individual grid layers.- 12.1.2 Impedance characteristics of multi-layer grids.- 12.2 Case study of a two layer grid.- 12.2.1 Simulation setup.- 12.2.2 Inductive coupling between grid layers.- 12.2.3 Inductive characteristics of a two layer grid.- 12.2.4 Resistive characteristics of a two layer grid.- 12.2.5 Variation of impedance with frequency in a two layer grid.- 12.3 Design implications.- 12.4 Summary.- 13. Inductive Effects In On-Chip Power Distribution Networks.- 13.1 Scaling effects in chip-package resonance.- 13.2 Propagation of Power Distribution noise.- 13.3 Local inductive behavior.- 13.4 Summary.- 14. Conclusions.- References.- About the Authors.
P. Herczfeld - One of the best experts on this subject based on the ideXlab platform.
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Embedded fiber-optic sensor utilizing the modal Power Distribution technique.
Optics letters, 1990Co-Authors: P. Herczfeld, L. Kawase, Mohamed Sherif, Frank Ko, L. BobbAbstract:The modal Power Distribution technique is applied to a multimode optical fiber embedded in a three-dimensional composite material for real-time characterization and monitoring of the structure. The measurements on the modal Power Distribution within these fibers, and the subsequent reDistribution induced by external perturbation, indicate that the modal Power Distribution technique is more sensitive than the intensity-modulation technique for smart-structure characterization.
Hee-sang Shin - One of the best experts on this subject based on the ideXlab platform.
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Advanced Power Distribution System Configuration for Smart Grid
IEEE Transactions on Smart Grid, 2013Co-Authors: Hee-sang ShinAbstract:Power Distribution systems should meet demands such as high reliability, efficiency, and penetration of renewable energy generators (REGs) in a smart grid. In general, Power Distribution systems are radial in nature. One-way Power flow is the advantage of a radial system. However, the introduction of REGs causes bidirectional Power flow. Furthermore, there are limits to improvements in reliability and efficiency in a radial system. Therefore, the upgrading of primary feeders from a radial to a loop configuration has been considered in the Korea Smart Distribution Project. An advanced Power Distribution system (APDS), in which primary feeders operate in a loop configuration, has been explored in this paper. First, the design scheme of a conventional Power Distribution system configuration that adopts Distribution automation is introduced. Subsequently, an upgrading scheme of loop configuration using normally opened tie switches and a tie switch selection algorithm for loss minimization are described. Finally, the advantages of the upgraded configuration are reported through case studies. It is observed that the APDS configuration can integrate more REGs from the viewpoint of voltage regulation. An advanced Distribution system allowing greater use of REGs will be a major contribution to smart grid implementation.
L. Kawase - One of the best experts on this subject based on the ideXlab platform.
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Embedded fiber-optic sensor utilizing the modal Power Distribution technique.
Optics letters, 1990Co-Authors: P. Herczfeld, L. Kawase, Mohamed Sherif, Frank Ko, L. BobbAbstract:The modal Power Distribution technique is applied to a multimode optical fiber embedded in a three-dimensional composite material for real-time characterization and monitoring of the structure. The measurements on the modal Power Distribution within these fibers, and the subsequent reDistribution induced by external perturbation, indicate that the modal Power Distribution technique is more sensitive than the intensity-modulation technique for smart-structure characterization.
