Ring Oscillator

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Alyssa B Apsel - One of the best experts on this subject based on the ideXlab platform.

  • A low-power, process-and-temperature-compensated Ring Oscillator with addition-based current source
    IEEE Transactions on Circuits and Systems I: Regular Papers, 2011
    Co-Authors: Xuan Zhang, Alyssa B Apsel
    Abstract:

    The design of a 1.8 GHz 3-stage current-starved Ring Oscillator with a process- and temperature- compensated current source is presented. Without post-fabrication calibration or off-chip components, the proposed low variation circuit is able to achieve a 65.1% reduction in the normalized standard deviation of its center frequency at room temperature and 85 ppm/ $^{\circ}$ C temperature stability with no penalty in the oscillation frequency, the phase noise or the start-up time. Analysis on the impact of transistor scaling indicates that the same circuit topology can be applied to improve variability as feature size scales beyond the current deep submicron technology. Measurements taken on 167 test chips from two different lots fabricated in a standard 90 nm CMOS process show a 3x improvement in frequency variation compared to the baseline case of a conventional current-starved Ring Oscillator. The power and area for the proposed circuitry is 87 $\mu$W and 0.013 mm$^{2}$ compared to 54 $\mu$ W and 0.01 mm $^{2}$ in the baseline case.

  • ISCAS - A process compensated 3-GHz Ring Oscillator
    2009 IEEE International Symposium on Circuits and Systems, 2009
    Co-Authors: Xuan Zhang, Alyssa B Apsel
    Abstract:

    In this paper, we present a high speed Ring Oscillator compensated for process, as well as temperature variation. No post-fabrication efforts or external clock reference is required to implement our process compensation scheme. By adding a novel control loop to the Ring Oscillator and leveraging a low process variation current source, we are able to reduce the typical variation from 10.2% to 2.7% for a 3-GHz three stage inverter chain Ring Oscillator. The compensation scheme developed in the paper is not limited to applications in Ring Oscillators, but can be used in all types of VCO designs.

Christian Plessl - One of the best experts on this subject based on the ideXlab platform.

Xuan Zhang - One of the best experts on this subject based on the ideXlab platform.

  • A low-power, process-and-temperature-compensated Ring Oscillator with addition-based current source
    IEEE Transactions on Circuits and Systems I: Regular Papers, 2011
    Co-Authors: Xuan Zhang, Alyssa B Apsel
    Abstract:

    The design of a 1.8 GHz 3-stage current-starved Ring Oscillator with a process- and temperature- compensated current source is presented. Without post-fabrication calibration or off-chip components, the proposed low variation circuit is able to achieve a 65.1% reduction in the normalized standard deviation of its center frequency at room temperature and 85 ppm/ $^{\circ}$ C temperature stability with no penalty in the oscillation frequency, the phase noise or the start-up time. Analysis on the impact of transistor scaling indicates that the same circuit topology can be applied to improve variability as feature size scales beyond the current deep submicron technology. Measurements taken on 167 test chips from two different lots fabricated in a standard 90 nm CMOS process show a 3x improvement in frequency variation compared to the baseline case of a conventional current-starved Ring Oscillator. The power and area for the proposed circuitry is 87 $\mu$W and 0.013 mm$^{2}$ compared to 54 $\mu$ W and 0.01 mm $^{2}$ in the baseline case.

  • ISCAS - A process compensated 3-GHz Ring Oscillator
    2009 IEEE International Symposium on Circuits and Systems, 2009
    Co-Authors: Xuan Zhang, Alyssa B Apsel
    Abstract:

    In this paper, we present a high speed Ring Oscillator compensated for process, as well as temperature variation. No post-fabrication efforts or external clock reference is required to implement our process compensation scheme. By adding a novel control loop to the Ring Oscillator and leveraging a low process variation current source, we are able to reduce the typical variation from 10.2% to 2.7% for a 3-GHz three stage inverter chain Ring Oscillator. The compensation scheme developed in the paper is not limited to applications in Ring Oscillators, but can be used in all types of VCO designs.

Chien Yin - One of the best experts on this subject based on the ideXlab platform.

  • temperature aware cooperative Ring Oscillator puf
    Hardware-Oriented Security and Trust, 2009
    Co-Authors: Chien Yin
    Abstract:

    Physical unclonable functions leverage the manufacture variations duRing silicon fabrication process and have found many security related applications. The Ring Oscillator PUF relies on pairs of Ring Oscillators which have sufficiently large difference in delay to generate reliable bits. Current RO PUF approaches use redundancy to provide reliability under different operating temperature and thus have very high hardware cost.We propose a temperature-aware cooperative (TAC) RO PUF implementation to reduce such cost. The basic idea is to allow a pair of Ring Oscillators to generate an unreliable bit as long as we can find means to convert it to a reliable bit. We define bit generation rules that explicitly take temperature into consideration and pair up the Ring Oscillator pairs so they can cooperate. Experiments on FPGA show that our approach can significantly improve the efficiency of the RO PUF implementation. With the same hardware that the current state-of-art approach requires to generate one reliable bit, our TAC RO PUF approach can generate as high as 1.8 reliable bits, that is, an 80% improvement in hardware utilization.

  • HOST - Temperature-aware cooperative Ring Oscillator PUF
    2009 IEEE International Workshop on Hardware-Oriented Security and Trust, 2009
    Co-Authors: Chien Yin
    Abstract:

    Physical unclonable functions leverage the manufacture variations duRing silicon fabrication process and have found many security related applications. The Ring Oscillator PUF relies on pairs of Ring Oscillators which have sufficiently large difference in delay to generate reliable bits. Current RO PUF approaches use redundancy to provide reliability under different operating temperature and thus have very high hardware cost.We propose a temperature-aware cooperative (TAC) RO PUF implementation to reduce such cost. The basic idea is to allow a pair of Ring Oscillators to generate an unreliable bit as long as we can find means to convert it to a reliable bit. We define bit generation rules that explicitly take temperature into consideration and pair up the Ring Oscillator pairs so they can cooperate. Experiments on FPGA show that our approach can significantly improve the efficiency of the RO PUF implementation. With the same hardware that the current state-of-art approach requires to generate one reliable bit, our TAC RO PUF approach can generate as high as 1.8 reliable bits, that is, an 80% improvement in hardware utilization.

A.a. Abidi - One of the best experts on this subject based on the ideXlab platform.