The Experts below are selected from a list of 324 Experts worldwide ranked by ideXlab platform
Song Lin Zhuang - One of the best experts on this subject based on the ideXlab platform.
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The study on the micro-voids of InP/Si and InP/SiO 2 wafer bonding by infrared transmission and Scanning Acoustic Microscopy
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012Co-Authors: Xuan Xiong Zhang, Fan Yang, Song Lin ZhuangAbstract:Low temperature wafer bonding for InP/Si and InP/SiO 2 was studied. Scanning Acoustic Microscopy (SAM) has to be used for characterizing the bonding interface to determine if there are micro-voids ( 2 bonding. The micro-voids also appear in the wafer bonding with oxide.
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the study on the micro voids of inp si and inp sio 2 wafer bonding by infrared transmission and Scanning Acoustic Microscopy
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012Co-Authors: Xuan Xiong Zhang, Fan Yang, Song Lin ZhuangAbstract:Low temperature wafer bonding for InP/Si and InP/SiO 2 was studied. Scanning Acoustic Microscopy (SAM) has to be used for characterizing the bonding interface to determine if there are micro-voids ( 2 bonding. The micro-voids also appear in the wafer bonding with oxide.
S. Brand - One of the best experts on this subject based on the ideXlab platform.
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gigahertz Scanning Acoustic Microscopy analysis of voids in cu sn micro connects
Applied Physics Letters, 2017Co-Authors: Glenn Ross, Vesa Vuorinen, Matthias Petzold, Mervi Paulastokrockel, S. BrandAbstract:Gigahertz Scanning Acoustic Microscopy (GHz-SAM) is applied to the characterization of bulk voids in the Cu-Sn material system, often used in micro-connects. An increased demand for the development of miniaturized interconnect technologies, such as micro-connects, means that fast characterization methods are required for the assessment and detection of reliability impacting defects. This study attempts to formulate an analytical technique aimed at detecting micro-structural defects in Cu-Sn micro-connects, such as micro-bumps for 1st level interconnects and solid-liquid interdiffusion bonds for nano- and microelectromechanical systems. To study the potential of the analytical method, a specific electroplating chemistry was used that increases the probability of defect formation in the electroplated Cu film. The chemistry is known under certain electroplating overpotentials to promote hydrogen bubble induced voids within the Cu. The samples containing voids were inspected by GHz-SAM with a highly focused a...
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Non-destructive wafer-level bond defect identification by Scanning Acoustic Microscopy
Microsystem Technologies, 2015Co-Authors: S. Brand, Sebastian Tismer, K. Schjølberg-henriksenAbstract:Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the application of Scanning Acoustic Microscopy (SAM) for assessing the quality of metal thermocompression bonds, both by evaluating its capabilities of localizing areas of poor bonding, and by finding defects in the integrity of the bond seal. Wafer laminates containing a test vehicle of sealing frames with pre-defined defects in the bond metal layer were sealed by Au–Au and Al–Al thermocompression bonding. Employing SAM, an area of five chips of poor bonding was identified non-destructively on the Al–Al laminate. Line defects of width 3.6 µm and point defects of diameter 22.4 µm have also been identified by SAM. The dicing yield for sealing frames was above 96 % for all frames of widths 100–400 µm and for both bond metal systems. The average bond strength was 31.5 ± 11.9 MPa for Al–Al thermocompression bonds and 37.3 ± 9.7 MPa for Au–Au thermocompression bonds. Scanning Acoustic Microscopy operates non-destructively and proved to be an extremely useful tool complementing current state-of-the-art methods for bond quality assessment.
J. Lawrence Katz - One of the best experts on this subject based on the ideXlab platform.
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Scanning Acoustic Microscopy Study of Human Cortical and Trabecular Bone
Annals of Biomedical Engineering, 2001Co-Authors: Sauwanan Bumrerraj, J. Lawrence KatzAbstract:Scanning Acoustic Microscopy (SAM) has been used in the burst mode to study the properties of human cortical and trabecular bone. An Olympus UH3 SAM (Olympus Co., Tokyo, Japan) was used with a 400 MHz burst mode lens (120° aperture, nominal lateral resolution 2.5 μm). The human cortical bone was from the midshaft of a femur from a 60+ male cadaver; the trabecular bone specimens were obtained from the distal femoral condyles of another 60+ human male cadaver. Elastic moduli for both trabecular and cortical bone were obtained by means of a series of calibration curves correlating SAM gray levels of known materials with their elastic moduli; specimens included: polypropylene, PMMA, Teflon, aluminum, Pyrex glass, titanium, and stainless steel. Values obtained by this method are in good agreement with those obtained by nanoindentation techniques. The three critical findings earlier by Katz and Meunier were observed here as well in both the cortical and trabecular bone samples. © 2001 Biomedical Engineering Society. PAC01: 8764-t, 8719Rr
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Scanning Acoustic Microscopy study of titanium–ceramic interface of dental restorations
Journal of Biomedical Materials Research, 1998Co-Authors: Russell Wang, Eric Meyers, J. Lawrence KatzAbstract:Failures that occur in titanium-ceramic restorations are of concern in clinical dentistry. The purpose of this study was to nondestructively characterize the internal cracks and nonadherent defects at the titanium-porcelain interface using Scanning Acoustic Microscopy. Titanium samples coated with porcelain without a bonding agent, with sputter coated palladium or chromium as an oxygen diffusion barrier on the titanium, and with the use of a porcelain bonding agent (control group) were compared. The Scanning Acoustic Microscopy analyses were correlated with four-point bending test results. The group that was initially coated with palladium had fewer interfacial defects and a higher load to failure than the control group, and the group that did not contain the bonding agent had a higher void area and a lower load to failure than the control group. The use of chromium produced no differences from the control group. Samples after a four-point bending test were also analyzed by Scanning electron Microscopy. The Scanning electron Microscopy was not able to characterize interfacial defects at the fractured titanium-ceramic interface for some of the samples. The validity of nondestructive analysis at the Ti-ceramic interface using Scanning Acoustic Microscopy was demonstrated in this study.
Xuan Xiong Zhang - One of the best experts on this subject based on the ideXlab platform.
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The study on the micro-voids of InP/Si and InP/SiO 2 wafer bonding by infrared transmission and Scanning Acoustic Microscopy
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012Co-Authors: Xuan Xiong Zhang, Fan Yang, Song Lin ZhuangAbstract:Low temperature wafer bonding for InP/Si and InP/SiO 2 was studied. Scanning Acoustic Microscopy (SAM) has to be used for characterizing the bonding interface to determine if there are micro-voids ( 2 bonding. The micro-voids also appear in the wafer bonding with oxide.
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the study on the micro voids of inp si and inp sio 2 wafer bonding by infrared transmission and Scanning Acoustic Microscopy
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012Co-Authors: Xuan Xiong Zhang, Fan Yang, Song Lin ZhuangAbstract:Low temperature wafer bonding for InP/Si and InP/SiO 2 was studied. Scanning Acoustic Microscopy (SAM) has to be used for characterizing the bonding interface to determine if there are micro-voids ( 2 bonding. The micro-voids also appear in the wafer bonding with oxide.
Sauwanan Bumrerraj - One of the best experts on this subject based on the ideXlab platform.
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Scanning Acoustic Microscopy Study of Human Cortical and Trabecular Bone
Annals of Biomedical Engineering, 2001Co-Authors: Sauwanan Bumrerraj, J. Lawrence KatzAbstract:Scanning Acoustic Microscopy (SAM) has been used in the burst mode to study the properties of human cortical and trabecular bone. An Olympus UH3 SAM (Olympus Co., Tokyo, Japan) was used with a 400 MHz burst mode lens (120° aperture, nominal lateral resolution 2.5 μm). The human cortical bone was from the midshaft of a femur from a 60+ male cadaver; the trabecular bone specimens were obtained from the distal femoral condyles of another 60+ human male cadaver. Elastic moduli for both trabecular and cortical bone were obtained by means of a series of calibration curves correlating SAM gray levels of known materials with their elastic moduli; specimens included: polypropylene, PMMA, Teflon, aluminum, Pyrex glass, titanium, and stainless steel. Values obtained by this method are in good agreement with those obtained by nanoindentation techniques. The three critical findings earlier by Katz and Meunier were observed here as well in both the cortical and trabecular bone samples. © 2001 Biomedical Engineering Society. PAC01: 8764-t, 8719Rr