The Experts below are selected from a list of 294 Experts worldwide ranked by ideXlab platform

Sahana Swarup - One of the best experts on this subject based on the ideXlab platform.

  • Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2014
    Co-Authors: Sahana Swarup, Hai-bao Chen, Hai Wang
    Abstract:

    Thermal issue is the leading design constraint for 3-D stacked integrated circuits (ICs) and through silicon vias (TSVs) are used to effectively reduce the temperature of 3-D ICs. Normally, TSV is considered as a good Thermal Conductor in its vertical direction, and its vertical Thermal resistance has been well modeled. However, lateral heat transfer of TSVs, which is also important, was largely ignored in the past. In this paper, we propose an accurate physics-based model for lateral Thermal resistance of TSVs in terms of physical and material parameters, and study the conditions for model accuracy. For TSV arrays or farm, we show that the space or pitch between TSVs has a significant impact on TSV Thermal behavior and should be properly considered in the TSV models. The proposed lateral Thermal resistance model is fully compatible with the existing modeling approaches, and thus we could build a more accurate complete TSV Thermal model. The new TSV Thermal model can be easily integrated into a finite difference (FD) based Thermal analysis framework to improve analysis efficiency. The accuracy of the model is validated against a commercial finite element tool-COMSOL. Experimental results show that the improved TSV Thermal model (with proposed lateral Thermal model) could greatly improve the accuracy of FD method in Thermal simulation comparing with the existing method.

  • Compact lateral Thermal resistance modeling and characterization for TSV and TSV array
    2013 IEEE ACM International Conference on Computer-Aided Design (ICCAD), 2013
    Co-Authors: Sahana Swarup
    Abstract:

    Thermal issues are among the major concerns for 3D stacked ICs, and Through silicon vias (TSVs) are used to effectively reduce the temperature of 3D ICs. Normally, TSV is considered as a good Thermal Conductor in its vertical direction, and its vertical Thermal resistance has been studied extensively. However, lateral heat transfer of TSVs, which is also important, was largely ignored in the past. In this paper, we propose an accurate physics-based model for lateral resistance of TSVs in terms of physical and material parameters, and discuss the conditions valid for model accuracy. In addition to modeling the lateral Thermal resistance of a single TSV, the proposed Thermal model is also applicable to TSV arrays or TSV farms. We show that the TSV insulation linear and space between TSVs could impose a significant impact on TSV Thermal behavior. The new TSV Thermal model can be easily integrated into a finite difference based Thermal analysis framework to improve analysis efficiency. The accuracy of the model is validated against a commercial finite element tool - COMSOL. Experimental results show that the proposed TSV lateral Thermal resistance model is very accurate for both a single TSV and TSV arrays.

H. Kirkici - One of the best experts on this subject based on the ideXlab platform.

  • Surface breakdown and surface flashover characteristics of diamond and DLC thin films on dielectric substrates in vacuum
    IEEE 1997 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 1997
    Co-Authors: H. Kirkici, D.w. Noles
    Abstract:

    Summary form only given. Polycrystalline diamond and diamond-like carbon (DLC) thin films are becoming attractive candidates for protective coatings and as dielectric materials in the space environment because they are excellent electrical insulators, exceptional Thermal Conductor materials, and are also highly resistive to chemical attacks. Therefore, the design and development of high voltage devices using diamond in vacuum requires a sound understanding of surface flashover phenomena across solid insulators supporting the "high voltage" electrodes. In this work, the authors present experimental results identifying some surface flashover characteristics of polycrystalline diamond and DLC thin films deposited on different dielectric materials such as quartz, silicon nitride, and cubic boron nitride in space vacuum conditions. These samples were produced by a microwave plasma deposition technique, the electrodes were copper, and a dc voltage was applied between the electrodes.

  • Surface flashover characteristics of polished-polycrystalline diamond thin films in vacuum
    Digest of Technical Papers. Tenth IEEE International Pulsed Power Conference, 1995
    Co-Authors: H. Kirkici
    Abstract:

    Diamond is known to be an excellent electrical insulator and also an exceptional Thermal Conductor material. Because of these properties of diamond, polycrystalline diamond thin films are becoming attractive candidates for protective coatings, and, as insulating material for high voltage systems. They are also being examined for use in the construction of spacecraft components. In this work, experimental results of surface flashover of polycrystalline diamond thin films operated in space vacuum conditions are presented. The polycrystalline diamond samples used in the experiments were produced by a microwave plasma CVD deposition technique, and the diamond films were polished to optical quality before the experiments. The electrode material was copper, and a DC voltage was applied between the electrodes. Two copper electrodes were placed on the diamond film surface at a discrete distance from one another. The sample/electrode assembly was placed in a high vacuum chamber and the surface flashover occurred between the electrodes but on the surface of the diamond surface in vacuum. Surface flashover voltage characteristics and breakdown voltage-wave forms of polished diamond thin film samples were determined. These results were compared with the surface flashover characteristics of quartz and optical quality diamond-like carbon (DLC) thin film samples.

  • Optical spectroscopy studies of surface breakdown of polycrystalline diamond thin films in vacuum
    Proceedings of IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP'94), 1994
    Co-Authors: H. Kirkici, M.f. Rose, R.r. Criss, R. Ramesham, R.f. Askew
    Abstract:

    Diamond is known to be an excellent electrical insulator and Thermal Conductor. These properties of diamond make it an attractive candidate as the insulating material for high voltage systems to be used in low earth orbit (LEO) and interplanetary space environment. However, to the knowledge of the authors, the surface flashover and surface breakdown characteristics of polycrystalline diamond thin films have not been investigated to date. In this work we will present experimental results of surface flashover characteristics of polycrystalline diamond and other synthetic thin films in vacuum. Electrical characteristics of surface breakdown and optical emission spectra of the surface flashover plasma are investigated. Optical spectroscopic studies of the luminosity of the discharge reveals information about the excited and ionized species in the vicinity of the surface. An optical multi channel analyzer was used to identify the emission lines of the optical spectrum.

Ilari Maasilta - One of the best experts on this subject based on the ideXlab platform.

  • Effect of a Thin AlOx Layer on Transition-Edge Sensor Properties
    Journal of Low Temperature Physics, 2012
    Co-Authors: Kimmo Kinnunen, M. R. J. Palosaari, Ilari Maasilta
    Abstract:

    We have studied the physics of transition-edge sensor (TES) devices with an insulating AlOx layer on top of the device to allow implementation of more complex detector geometries. By comparing devices with and without the insulating film, we have observed significant additional noise apparently caused by the insulator layer. In addition, AlOx was found to be a relatively good Thermal Conductor. This adds an unforeseen internal Thermal feature to the system.

  • Effect of a Thin AlOx Layer on Transition-Edge Sensor Properties
    Journal of Low Temperature Physics, 2012
    Co-Authors: Kimmo Kinnunen, M. R. J. Palosaari, Ilari Maasilta
    Abstract:

    We have studied the physics of transition-edge sensor (TES) devices with an insulating AlOx layer on top of the device to allow implementation of more complex detector geometries. By comparing devices with and without the insulating film, we have observed significant additional noise apparently caused by the insulator layer. In addition, AlOx was found to be a relatively good Thermal Conductor. This adds an unforeseen internal Thermal feature to the system.Comment: 6 pages, 5 figures, Low Temperature Detectors 14 conferenc

Jong Hee Lee - One of the best experts on this subject based on the ideXlab platform.

  • Scalable growth of free-standing graphene wafers with copper(Cu) catalyst on SiO2/Si substrate: Thermal conductivity of the wafers
    Applied Physics Letters, 2010
    Co-Authors: Yun Hi Lee, Jong Hee Lee
    Abstract:

    The authors report scalable growth of free-standing graphene wafers with copperCu catalyst on SiO2/Si substrate at low temperature and investigation of their Thermal conductivity. The Cu is the most common and the cheapest catalyst among electronic materials. Our process for producing the graphene with the Cu is based on a low-pressure, fast-heating chemical vapor deposition method. Thermal conductivity measurements with nondestructive Raman spectroscopy showed that the free-standing-graphene is a good Thermal Conductor. The possibility of growing graphene wafer at low temperatures by using a Cu thin film should accelerate research and facilitate the development of graphene for practical applications ©

Kimmo Kinnunen - One of the best experts on this subject based on the ideXlab platform.

  • Effect of a Thin AlOx Layer on Transition-Edge Sensor Properties
    Journal of Low Temperature Physics, 2012
    Co-Authors: Kimmo Kinnunen, M. R. J. Palosaari, Ilari Maasilta
    Abstract:

    We have studied the physics of transition-edge sensor (TES) devices with an insulating AlOx layer on top of the device to allow implementation of more complex detector geometries. By comparing devices with and without the insulating film, we have observed significant additional noise apparently caused by the insulator layer. In addition, AlOx was found to be a relatively good Thermal Conductor. This adds an unforeseen internal Thermal feature to the system.

  • Effect of a Thin AlOx Layer on Transition-Edge Sensor Properties
    Journal of Low Temperature Physics, 2012
    Co-Authors: Kimmo Kinnunen, M. R. J. Palosaari, Ilari Maasilta
    Abstract:

    We have studied the physics of transition-edge sensor (TES) devices with an insulating AlOx layer on top of the device to allow implementation of more complex detector geometries. By comparing devices with and without the insulating film, we have observed significant additional noise apparently caused by the insulator layer. In addition, AlOx was found to be a relatively good Thermal Conductor. This adds an unforeseen internal Thermal feature to the system.Comment: 6 pages, 5 figures, Low Temperature Detectors 14 conferenc