The Experts below are selected from a list of 30378 Experts worldwide ranked by ideXlab platform

Louise C Hirst - One of the best experts on this subject based on the ideXlab platform.

  • light trapping optimisation framework based on fourier space grating design for coupling to waveguide modes in an ultra Thin Solar Cell
    Photovoltaic Specialists Conference, 2020
    Co-Authors: Eduardo Camarillo Abad, Hannah J Joyce, Louise C Hirst
    Abstract:

    Ever-Thinner Solar Cells are currently of interest to the photovoltaics community and demand the introduction of light-trapping techniques to retain a competitive photovoltaic performance. This work presents a framework for a guided light-trapping design applied to an ultra-Thin (< 100 nm) Solar Cell. The framework is based on a fundamental study of the waveguide modes supported by a realistic device architecture. Mode-coupling is ensured by introducing a scattering layer according to its Fourier spectrum. The framework can be applied to any device architecture and for single or multiple wavelength absorption enhancement, having the flexibility to attain high-efficiency in ever-Thinner photovoltaics.

  • intrinsic radiation tolerance of ultra Thin gaas Solar Cells
    Applied Physics Letters, 2016
    Co-Authors: Louise C Hirst, Michael K Yakes, Jeffrey H Warner, Mitchell F Bennett, Kenneth J Schmieder, R J Walters, Phillip P Jenkins
    Abstract:

    Radiation tolerance is a critical performance criterion of photovoltaic devices for space power applications. In this paper we demonstrate the intrinsic radiation tolerance of an ultra-Thin Solar Cell geometry. Device characteristics of GaAs Solar Cells with absorber layer thicknesses 80 nm and 800 nm were compared before and after 3 MeV proton irradiation. Both Cells showed a similar degradation in Voc with increasing fluence; however, the 80 nm Cell showed no degradation in Isc for fluences up to 1014 p+ cm−2. For the same exposure, the Isc of the 800 nm Cell had severely degraded leaving a remaining factor of 0.26.

Harry A. Atwater - One of the best experts on this subject based on the ideXlab platform.

Jonathan Grandidier - One of the best experts on this subject based on the ideXlab platform.

Headley Stokes - One of the best experts on this subject based on the ideXlab platform.

  • simulated space debris impact experiments on toughened laminated Thin Solar Cell cover glass
    International Journal of Impact Engineering, 1999
    Co-Authors: Robert Roybal, Pawel Tlomak, Charles Stein, Headley Stokes
    Abstract:

    Summary Increasing demands on the design criteria of space craft components have driven efforts to develop advanced space debris ground simulation techniques suitable to be incorporated into a space environmental effects chamber. A laser driven flyer method suitable in such a chamber was used to conduct an initial investigation of space debris impact on a new toughened Solar Cell coverglass material. Damage characteristics, including mechanical damage and contamination generated by impact with a 3mm diameter, 3 micron thick aluminum particle accelerated to 4.5 km/s, were looked at. Scanning electron microscopy, optical microscopy, and spectrophotometry were used to measure the mechanical damage and the loss of Solar transmission. Because of the limited number of impact tests made in this initial study a quantitative analysis was not possible. However, much insight was obtained from the observed damage.

Emanuel M. Sachs - One of the best experts on this subject based on the ideXlab platform.

  • detection of sub 500 μm cracks in multicrystalline silicon wafer using edge illuminated dark field imaging to enable Thin Solar Cell manufacturing
    Solar Energy Materials and Solar Cells, 2019
    Co-Authors: Sarah Wieghold, Samuel J Raymond, Luke T Meyer, Tonio Buonassisi, John R. Williams, Emanuel M. Sachs
    Abstract:

    Abstract High capital expenditures associated with manufacturing Thin silicon wafers make it difficult for the industry to scale up and prevent novel technologies from entering the market. Thin wafers fail largely due to breakage during Solar Cell processing and handling. One of the root causes for breakage is sub-mm edge cracks in the silicon wafer, and these cracks cannot be reliably detected by most commercially-available crack detection tools. In this work, we first investigate the correlation between wafer thickness and critical crack length, and explain the importance of detecting sub-500-μm edge cracks as the wafer thickness is reduced. Secondly, we extend our previous work of micro-crack detection to demonstrate an edge illumination technique using a near-infrared laser to image edge cracks less than 500 μm in length in multicrystalline silicon. Thirdly, we investigate two fundamental edge illumination mechanisms based on dark-field imaging; namely, direct and vicinal illumination. We will then compare these methods to a state-of-the-art rear illumination method. The advantages and disadvantages of both illumination methods are presented and provide an in-depth analysis of light-crack interaction. In particular, we find that the robustness of vicinal illumination is due to diffuse reflectance. The diffuse reflectance has less dependence on crack configurations, while direct illumination has more dependence on the crack configurations because it utilizes specular reflectance. Our results show that our proposed prototype can detect sub-mm edge cracks in multicrystalline silicon wafers, which is an important step in enabling Thin silicon wafer manufacturing.