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Jooho Moon - One of the best experts on this subject based on the ideXlab platform.

  • a low cure temperature copper nano Ink for highly Conductive printed electrodes
    Current Applied Physics, 2009
    Co-Authors: Byoungyoon Lee, Yoonhyun Kim, Seungnam Yang, Inbum Jeong, Jooho Moon
    Abstract:

    Abstract We have developed a copper metal-organic-based Conductive Ink which can be applied to printing and roll-to-roll processes. Metal-organics printed on flexible substrates decompose into highly Conductive copper metal when annealed at above 250 °C. The new nano Ink was prepared by mixing copper carboxylate with copper complex nano particles of a mean size below 100 nm. The viscosity of the copper Ink was in the range of 10 4 –10 5  mPa s (at 50 rpm). The resistivity of the Conductive film, after annealing under the condition of 3% H 2 above 250 °C for 20 min, was below 10 μΩ cm and it could be further reduced to 4.4 μΩ cm when annealed at 320 °C for 20 min. We successfully demonstrated a printable copper nano Ink that proceeds to form highly Conductive metal film when annealed at low temperature on flexible substrates.

  • Ink jet printing of cu ag based highly Conductive tracks on a transparent substrate
    Langmuir, 2009
    Co-Authors: Kyoohee Woo, Dongjo Kim, Jang Sub Kim, Soonkwon Lim, Jooho Moon
    Abstract:

    We have developed a Cu−Ag-based mixed metal Conductive Ink from which highly Conductive tracks form on a flexible substrate after annealing at low temperature. Addition of small Ag particles significantly improves the particle packing density by filling the interstices formed between the larger Cu particles, which in turn facilitates better conductivity compared to pure Cu metal film. The particle size and volume ratio of the Ag particles added should be carefully controlled to achieve maximum packing density in the bimodal particle system, which is consistent with the theoretical considerations of the Furnas model. In addition, we demonstrate direct writing of complex patterns that exhibit high conductivity upon annealing at sufficiently low temperature (175−210 °C) to not damage the transparent plastic substrate such as polyethersulphone (PES).

  • controlling the thickness of the surface oxide layer on cu nanoparticles for the fabrication of Conductive structures by Ink jet printing
    Advanced Functional Materials, 2008
    Co-Authors: Sunho Jeong, Hyunjung Shin, Jooho Moon
    Abstract:

    With the aim of preparing a high performance Conductive Ink, we sought to control the surface chemistry of Cu nanoparticles so as to minimize surface oxidation. Specifically, the surface oxide layer on Cu nanoparticles synthesized in ambient atmosphere was minimized by adjusting the molecular weight of poly(N-vinylpyrrolidone) capping molecules, as confirmed by high resolution transmission electron microscopy and X-ray photoelectron spectroscopy analyses. In addition, we demonstrate that by minimizing the thickness of the surface oxide layer, Cu granular films with good conductivity could be obtained by sintering nanoparticle assembles. Finally, we fabricated highly Conductive Cu patterns on a plastic substrate by Ink-jet printing.

  • direct writing of copper Conductive patterns by Ink jet printing
    Thin Solid Films, 2007
    Co-Authors: Bong Kyun Park, Sunho Jeong, Jooho Moon
    Abstract:

    Abstract Ink-jet printing of metal nanoparticles is an attractive method for direct patterning Conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a Conductive Ink containing copper nanoparticles as an alternative that is inexpensive Conductive material. Copper particles with a size of 40–50 nm were synthesized by polyol process, from which the well-dispersed Conductive Ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the Conductive lines using Cu Conductive Ink. The Ink-jet printed copper patterns exhibited metal-like appearance and became highly Conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.

  • Organic thin film transistor using silver electrodes by the Ink-jet printing technology
    Thin Solid Films, 2007
    Co-Authors: Dongjo Kim, Bong Kyun Park, Sunho Jeong, Sul Lee, Jooho Moon
    Abstract:

    Abstract We have developed a Conductive Ink containing silver nanoparticles from which the electrodes for organic thin film transistor were directly patterned by Ink-jet printing. Nano-sized silver particles having ∼ 20 nm diameter was used for a direct metal printing. Silver Conductive Ink was printed on the heavily doped n-type silicon wafer with 200-nm thick thermal SiO 2 layer as a substrate. To achieve a high line resolution and smooth Conductive path, the printing conditions such as the inter-drop distance, stage moving velocity and temperature of the pre-heated substrates were optimized. After the heat-treatment at temperatures of 200 °C for 30 min, the printed silver patterns exhibit metal-like appearance and the conductivity. To fabricate a coplanar type TFTs, an active material of semiconducting oligomer, α,ω-dihexylquaterthiophene (DH4T) in a chlorobenzene was deposited between the Ink-jet printed silver electrodes by drop casting. The OTFT with the Ink-jetted source/drain electrodes shows general performance characteristics with good saturation behavior and no significant contact resistance as compared to the one with vacuum deposited electrodes. The electrical characteristic parameters of OTFT show the mobility of 1.3 × 10 − 3  cm 2 V − 1 s − 1 in the saturation regime, on/off current ratio over 10 3 , and threshold voltage of about − 13 V.

Yoonhyun Kim - One of the best experts on this subject based on the ideXlab platform.

  • a self reducible and alcohol soluble copper based metal organic decomposition Ink for printed electronics
    ACS Applied Materials & Interfaces, 2014
    Co-Authors: Dong Hun Shin, Seunghee Woo, Hyesuk Yem, Minjeong Cha, Sooncheol Jeong, Yoonhyun Kim, Sanghun Cho, Mingyu Kang, Kyung Tae Kang, Yuanzhe Piao
    Abstract:

    We report a novel method for the synthesis of a self-reducible (thermally reducible without a reducing atmosphere) and alcohol-soluble copper-based metal–organic decomposition (MOD) Ink for printed electronics. Alcohol-solvent-based Conductive Inks are necessary for commercial printing processes such as reverse offset printing. We selected copper(II) formate as a precursor and alkanolamine (2-amino-2-methyl-1-propanol) as a ligand to make an alcohol-solvent-based Conductive Ink and to assist in the reduction reaction of copper(II) formate. In addition, a co-complexing agent (octylamine) and a sintering helper (hexanoic acid) were introduced to improve the metallic copper film. The specific resistivity of copper-based MOD Ink (Cuf-AMP-OH Ink) after heat treatment at 350 °C is 9.46 μΩ·cm, which is 5.5 times higher than the specific resistivity of bulk copper. A simple stamping transfer was conducted to demonstrate the potential of our Ink for commercial printing processes.

  • Use of copper Ink for fabricating Conductive electrodes and RFID antenna tags by screen printing
    Current Applied Physics, 2012
    Co-Authors: Yoonhyun Kim, Byoungyoon Lee, Seungnam Yang, Inbum Jeong, In-ho Byun, Sung Min Cho
    Abstract:

    Abstract We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper Conductive Ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 μΩ cm and 5B level of adhesion strength were obtained with 5% addition of epoxy resin as a binder. The copper Ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna.

  • a low cure temperature copper nano Ink for highly Conductive printed electrodes
    Current Applied Physics, 2009
    Co-Authors: Byoungyoon Lee, Yoonhyun Kim, Seungnam Yang, Inbum Jeong, Jooho Moon
    Abstract:

    Abstract We have developed a copper metal-organic-based Conductive Ink which can be applied to printing and roll-to-roll processes. Metal-organics printed on flexible substrates decompose into highly Conductive copper metal when annealed at above 250 °C. The new nano Ink was prepared by mixing copper carboxylate with copper complex nano particles of a mean size below 100 nm. The viscosity of the copper Ink was in the range of 10 4 –10 5  mPa s (at 50 rpm). The resistivity of the Conductive film, after annealing under the condition of 3% H 2 above 250 °C for 20 min, was below 10 μΩ cm and it could be further reduced to 4.4 μΩ cm when annealed at 320 °C for 20 min. We successfully demonstrated a printable copper nano Ink that proceeds to form highly Conductive metal film when annealed at low temperature on flexible substrates.

Lauri Sydanheimo - One of the best experts on this subject based on the ideXlab platform.

  • possibilities of 3d direct write dispensing for textile uhf rfid tag manufacturing
    International Symposium on Antennas and Propagation, 2015
    Co-Authors: Toni Bjorninen, Lauri Sydanheimo, Johanna Virkki, Leena Ukkonen
    Abstract:

    We outline the possibilities of 3D direct write dispensing in the manufacturing of UHF RFID tags on textile materials and present considerations regarding the process parameters to achieve high-performance tags when the antenna is deposited directly on the rough and porous textile material. We also show that it is possible to use the dispensing to form the antenna-microchip connection using Conductive Ink only in order to simplify the manufacturing process. Our measurement results confirm that the manufactured textile-based RFID tags achieve high performance with the attainable read ranges of 8.5-to-11 meters in air.

  • the effect of Conductive Ink layer thickness on the functioning of printed uhf rfid antennas
    Proceedings of the IEEE, 2010
    Co-Authors: Sari Merilampi, Toni Bjorninen, A Vuorimaki, Leena Ukkonen, Pekka Ruuskanen, Lauri Sydanheimo
    Abstract:

    In this study, the effect of the Conductive Ink layer thickness on the performance of printed ultra-high-frequency (UHF) radio-frequency identification (RFID) tag antennas was investigated. A simple quarter wave dipole tag for European UHF RFID frequencies was designed to be tested in this study. All the tags were made by using screen-printing technique. Three different thicknesses for the Ink layer were used. Performance of the tags was analyzed by the measurement of threshold and backscatter power. The results show that it is possible to produce RFID tag antennas by screen printing and it is possible to optimize the tag performance by adjusting the thickness of the electrically Conductive layer. The results show how the performance characteristics deteriorated when the thickness of the printed Ink layer was reduced. However, it was also shown that thin Ink layers can be used in some applications and cost savings can be achieved in this way. It is therefore important to recognize these effects on the performance.

Shlomo Magdassi - One of the best experts on this subject based on the ideXlab platform.

  • effect of carboxylic acids on conductivity of metallic films formed by Inks based on copper silver core shell particles
    Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2017
    Co-Authors: Anna Pajorświerzy, Yousef Farraj, Alexande Kamyshny, Shlomo Magdassi
    Abstract:

    Abstract Conductive copper Inks have attracted much attention as low-cost replacement for the currently used silver Inks for printed electronics. The copper Inks should be stable to oxidation at all stages of fabrication of Conductive patterns: Ink formulation and storage, printing, and post-printing treatment. In the present study, air-stable copper-silver core-shell (Cu@Ag) submicron particles were utilized in Conductive Ink formulations. To improve the conductivity of the resulting Cu@Ag coatings, the effect of various carboxylic acids was evaluated. It was found that all acids led to decreased resistivity after sintering at elevated temperatures, while the lowest value was only 4 times higher than the bulk resistivity at 3 wt% of oleic. The mechanism governing the effect of carboxylic acids is discussed, in view of possible stabilizer exchange and oxide dissolution.

  • Conductive Inks with a built in mechanism that enables sintering at room temperature
    ACS Nano, 2011
    Co-Authors: Michael Grouchko, Alexander Kamyshny, Cristina Florentina Mihailescu, Dan F Anghel, Shlomo Magdassi
    Abstract:

    At present there is no metallic Ink that enables formation of Conductive patterns at room temperature by a single printing step. Printing Conductive features by metallic nanoparticle-based Inks must be followed by sintering while heating to elevated temperatures, thus preventing their utilization on most plastic substrates used in plastic electronics. In this report we present a new silver nanoparticle-based Conductive Ink, having a built-in sintering mechanism, which is triggered during drying of the printed pattern. The nanoparticles that are stabilized by a polymer undergo self-sintering spontaneously, due to the presence of a destabilizing agent, which comes into action only during drying of the printed pattern. The destabilizing agent, which contains Cl− ions, causes detachment of the anchoring groups of the stabilizer from the nanoparticles’ surface and thus enables their coalescence and sintering. It was found that the new metallic Ink leads to very high conductivities, by a single printing step: u...

Dawn M Pedrotty - One of the best experts on this subject based on the ideXlab platform.