The Experts below are selected from a list of 15237 Experts worldwide ranked by ideXlab platform
Odhran P Shelley - One of the best experts on this subject based on the ideXlab platform.
-
Copper Wire theft and high voltage electrical burns
International journal of burns and trauma, 2014Co-Authors: Eamon C Francis, Odhran P ShelleyAbstract:High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper Wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage Copper Wire and its omnipresence on an international scale.
-
Case Report Copper Wire theft and high voltage electrical burns
International Journal of Burn Trauma, 2014Co-Authors: Eamon C Francis, Odhran P ShelleyAbstract:High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper Wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage Copper Wire and its omnipresence on an international scale.
Bob Chylak - One of the best experts on this subject based on the ideXlab platform.
-
Copper Wire Bonding: R&D to High Volume Manufacturing
2020Co-Authors: Bob Chylak, Horst Clauberg, John FoleyAbstract:During the past two years Copper Wire bonding has entered high volume manufacturing at a number of leading edge OSATs and IDMs. Usage of Copper Wire has achieved 20% market share and is expected to...
-
nickel palladium bond pads for Copper Wire bonding
Microelectronics Reliability, 2011Co-Authors: Horst Clauberg, Petra Backus, Bob ChylakAbstract:The semiconductor packaging industry is undergoing a step-change transition from gold to Copper Wire bonding brought on by a quadrupling of gold cost over the last 8 years. The transition has been exceptionally rapid over the last 3 years and virtually all companies in the industry now have significant Copper Wire bonding production. Among the challenges to Copper Wire bonding is the damage to bond pads that had been engineered for Wire bonding with the softer gold Wire. This paper presents an extensive evaluation of electroless NiPd and NiPdAu bond pads that offer a much more robust alternative to the standard Al pad finish. These NiPd(Au) bond are shown to outperform Al in virtually all respects: bond strength, bond parameter window, lack of pad damage and reliability.
-
Wire bonding optimization with fine Copper Wire for volume production
2010 12th Electronics Packaging Technology Conference, 2010Co-Authors: Oranna Yauw, Horst Clauberg, Liming Shen, Bob ChylakAbstract:The adoption of Copper Wire in high volume Wire bonding production has proven successful as seen in the tremendous increase in Copper Wire consumption in the past year. This increase largely came from the conversion from gold to Copper Wire in fine pitch devices which previously had been more conservative due to concerns related to Copper Wire reliability. Fine pitch applications with bond pad openings of 45um and less using 0.8mil and less Wire diameter require more stringent control on bonding qualities. Specially designed Copper hardware that maintains an oxygen free environment, as well as more elaborate Wire bonding processes were required to meet the challenges in Copper Wire bonding, some with success but often with compromises to production throughput and mean-time-between-assist (MTBA).
-
Wire bonding with Pd-coated Copper Wire
2010 IEEE CPMT Symposium Japan, 2010Co-Authors: Horst Clauberg, Bob Chylak, Nelson Wong, Johnny Yeung, Eugen MilkeAbstract:The last three years have seen an aggressive implementation of fine-pitch Copper Wire bonding in face of ever-increasing gold prices. Numerous technical hurdles associated with Copper Wire bonding have mostly been overcome. However, achieving process robustness equivalent to gold Wire bonding is still challenging and requires enhanced manufacturing control procedures. Although the 2nd bond in Copper Wire bonding is generally very reliable, it often requires additional process steps, such as skidding or scrubbing motions. These processes require additional time and cause an overall reduction in Wire bonder throughput. Pd-coated Cu Wire is emerging as an alternative to bonding with bare Cu Wire. While not quite achieving the same cost savings as bare Copper Wire, it offers the promise of a more robust bonding process. Being a noble metal, the Pd-coating prevents oxidation of the Wire surface. This improves 2nd bond performance, increases shelf life and protects the Wire against corrosion. Better 2nd bond performance may allow for faster 2nd bond processes in some applications and hence greater throughput relative to bare Copper. The effect of the Pd on the first bond is less certain. While residual Pd on the ball surface may enhance adhesion by analogy to the improvement seen at 2nd bond, the distribution of the Pd on the surface and within the ball is generally not uniform. Cross-sectional analysis of free air ball formed under different EFO parameters revealed different Pd distribution within the ball with more non-uniform mixing and swirling structures at high EFO current settings. In addition, formation of Pd-Cu alloys in the ball will increase its hardness at high EFO settings compared to low settings and may in turn exacerbate damage to bond pads, which is already a problem in Copper Wire bonding. This paper compares the bonding performance of Pd-coated Cu Wire to bare Copper Wire at both 1st and 2nd bond. Bond strengths and process window are characterized. It is shown that Pd-coated Wire can be successfully bonded using nitrogen rather than forming gas as the cover gas during ball formation. Bonding with nitrogen would partially recover the higher cost of the Wire relative to bare Cu.
-
Wire bonding optimization with fine Copper Wire for volume production
2010 12th Electronics Packaging Technology Conference, 2010Co-Authors: Oranna Yauw, Horst Clauberg, Liming Shen, Bob ChylakAbstract:The adoption of Copper Wire in high volume Wire bonding production has proven successful as seen in the tremendous increase in Copper Wire consumption in the past year. This increase largely came from the conversion from gold to Copper Wire in fine pitch devices which previously had been more conservative due to concerns related to Copper Wire reliability. Fine pitch applications with bond pad openings of 45um and less using 0.8mil and less Wire diameter require more stringent control on bonding qualities. Specially designed Copper hardware that maintains an oxygen free environment, as well as more elaborate Wire bonding processes were required to meet the challenges in Copper Wire bonding, some with success but often with compromises to production throughput and mean-time-between-assist (MTBA). Palladium-coated Copper (Pd-Cu) Wire has emerged as an alternative candidate to bare Cu Wire especially in 0.8mil and even finer Wire diameter applications. Its ability to form uniformly shaped free-air-balls (FABs) with nitrogen instead of forming gas, better bondability on lead surfaces, as well as its resistance to oxidation and corrosion tend to offset the higher cost of Pd-Cu Wire compared to bare Cu Wire. The advantages of Pd-Cu Wire are readily seen in terms of production throughput and MTBA. Both bare Cu and Pd-Cu Wires have been widely studied in terms of their hardness and FAB formation. Second bond bondability has also been compared with Pd-Cu Wire demonstrating higher stitch strength and a wider process window without the use of elaborate bonding processes. For first bond, both bare Cu and Pd-Cu Wires are seeing challenges in pad damage control in the form of peeling and cracking, with Pd-Cu Wire showing smaller working process windows in most cases. Much attention has been put in studying the higher hardness of Pd-Cu Wire compared to pure Cu Wire, though the difference is not too significant. FABs generated from Pd-Cu Wire have been studied with respect to various factors such as electric-flame off (EFO) parameters, types of inert gas, and the gas flow rate used to maintain the oxygen free environment. Correlation between these parameters and the distribution of Pd on the surface of a FAB was used to explain the different degrees of hardness seen. It has been claimed that both EFO parameters and the type of inert gas used affect the mixing of Pd into the FAB and result in different FAB hardness. The control of FAB formation by means of EFO parameters and inert gas used showed a certain influence on the first bond process window. In this paper, experiments were carried out to understand the difference in FAB formation and first bond and second bond process windows using 0.8mil bare Cu and Pd-Cu Wires in fine pitch packages. This understanding helps in setting up a robust process with special attention to process parameters that are critical in controlling key bonding performance like ball size, shear, stitch pull strength, pad splash, and pad damage. It is the objective of this paper to demonstrate the feasibility of fine pitch Cu Wire processes for high volume production.
Horst Clauberg - One of the best experts on this subject based on the ideXlab platform.
-
Copper Wire Bonding: R&D to High Volume Manufacturing
2020Co-Authors: Bob Chylak, Horst Clauberg, John FoleyAbstract:During the past two years Copper Wire bonding has entered high volume manufacturing at a number of leading edge OSATs and IDMs. Usage of Copper Wire has achieved 20% market share and is expected to...
-
Copper Wire bond investigation on multiple surface finishes - enabling Wire bond packages without gold
18th European Microelectronics & Packaging Conference, 2011Co-Authors: Mustafa Oezkoek, Nigel White, Horst ClaubergAbstract:During the past two years, fine pitch Copper Wire bonding has finally entered high volume production. It is estimated that nearly 15% of all Wire bonders used in production are now equipped for Copper Wire bonding. Most of these are used exclusively for Copper Wire bonding. In terms of pitch, Copper Wire is only barely lagging behind the most advanced gold applications. The most commonly used Copper Wire is 20um in diameter and 18um Copper Wire is entering final qualification. Evaluations with even finer Wire are underway.
-
nickel palladium bond pads for Copper Wire bonding
Microelectronics Reliability, 2011Co-Authors: Horst Clauberg, Petra Backus, Bob ChylakAbstract:The semiconductor packaging industry is undergoing a step-change transition from gold to Copper Wire bonding brought on by a quadrupling of gold cost over the last 8 years. The transition has been exceptionally rapid over the last 3 years and virtually all companies in the industry now have significant Copper Wire bonding production. Among the challenges to Copper Wire bonding is the damage to bond pads that had been engineered for Wire bonding with the softer gold Wire. This paper presents an extensive evaluation of electroless NiPd and NiPdAu bond pads that offer a much more robust alternative to the standard Al pad finish. These NiPd(Au) bond are shown to outperform Al in virtually all respects: bond strength, bond parameter window, lack of pad damage and reliability.
-
Palladium surface finishes for Copper Wire bonding (Part I: The selection of surface finishes)
2011 6th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2011Co-Authors: Mustafa Özkök, Horst ClaubergAbstract:During the past two years, fine pitch Copper Wire bonding has finally entered high volume production. It is estimated that nearly 15% of all Wire bonders used in production are now equipped for Copper Wire bonding. Most of these are used exclusively for Copper Wire bonding. In terms of pitch, Copper Wire is only barely lagging behind the most advanced gold applications. The most commonly used Copper Wire is 20um in diameter and 18um Copper Wire is entering final qualification. Evaluations with even finer Wire are underway. Although some technical challenges remain, many years of research have now resolved most of the problems associated with Copper Wire bonding and attention is beginning to shift from merely ensuring reliable manufacturing processes to optimizing processes for efficiency and throughput. The most advanced Wire bonders now have pre-configured processes specifically designed for Copper. In addition to throughput optimization, further cost reductions are being sought. Among these is the desire to eliminate the high-cost gold not just from the Wire, but also from the substrate. On the substrate side the electronics packaging industry still works with electrolytic nickel / electrolytic (soft) gold (Ni/Au) for Copper Wire bond applications. This surface finish works with Copper Wire bonding but includes some disadvantages, such as: - Thick expensive Au layers of 0.1 to 0.4μm - Electrically connected pads (bussing for the plating) which require added space on the substrate. - Pd-coated Copper Wire often delivers better results on gold covered finishes, but is two to three times more expensive as pure Copper Wire. Furthermore electrolytic Ni/Au was not chosen as a result of in-depth investigations for the most effective surface finish. The selection was made because it was the surface finish with the highest distribution in the market for Wire bond packages. This paper is offering the results of a two company joint work regarding an alternative Copper Wire bondable surface finish for substrates mainly with palladium as the final Copper Wire bondable layer. This offers further cost reduction possibilities. Furthermore, Copper palladium intermetallics are regarded as very reliable.
-
Wire bonding optimization with fine Copper Wire for volume production
2010 12th Electronics Packaging Technology Conference, 2010Co-Authors: Oranna Yauw, Horst Clauberg, Liming Shen, Bob ChylakAbstract:The adoption of Copper Wire in high volume Wire bonding production has proven successful as seen in the tremendous increase in Copper Wire consumption in the past year. This increase largely came from the conversion from gold to Copper Wire in fine pitch devices which previously had been more conservative due to concerns related to Copper Wire reliability. Fine pitch applications with bond pad openings of 45um and less using 0.8mil and less Wire diameter require more stringent control on bonding qualities. Specially designed Copper hardware that maintains an oxygen free environment, as well as more elaborate Wire bonding processes were required to meet the challenges in Copper Wire bonding, some with success but often with compromises to production throughput and mean-time-between-assist (MTBA).
Jiaji Wang - One of the best experts on this subject based on the ideXlab platform.
-
Oxidation study of Copper Wire bonding
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010Co-Authors: Xiangquan Fan, Binhai Zhang, Techun Wang, Yuqi Cong, Jiaji WangAbstract:Copper Wire bonding is the most effective alternative of gold Wire bonding. As Copper is more chemical reactive than gold, easier oxidation is one of the most major problem Copper Wire bonding encountered. Anti-oxidation technology must be used in Copper Wire bonding process. In general, there are two different ways to improve the anti-oxidation properties of Copper bonding Wire. One of which is injecting forming gas (FG) containing reducibility; the other is plated anti-oxidation metal coating on 4N pure Copper Wire. In this paper, we have investigated the performance of Copper Wire anti-oxidation technology. An optimized forming gas flow rate has been obtained for the pure Copper Wire. Evidences of anti-oxidation performance have also been shown for Pd-coated Copper Wire.
-
Properties of Cu-Al intermetallic compounds in Copper Wire bonding
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging ICEPT-HDP 2010, 2010Co-Authors: Binhai Zhang, Techun Wang, Yuqi Cong, Mike Zhao, Xiangquan Fan, Jiaji WangAbstract:Because of its high thermal conductivity, great electrical property and low cost, Copper Wire is considered to replace the conventional gold Wire and is becoming widely used in IC assembly processes recent years. Compared to gold Wire, Copper Wires has higher thermal conductivity, lower electrical resistivity, and higher pull strength allowing for a reduced Wire diameter. Besides, Copper Wire is much cheaper than gold Wire, which reduces the overall cost of IC assembly. However, Copper Wire bonding also has its own limitations and only few results are reported on the research of Cu-Al intermetallic compounds (IMC) in bonding process. In the paper, the study is focused on Cu-Al IMC's properties and its behaviors in Copper Wire bonding, combining theories with many analysis means such as SEM, TEM and EDS. The paper gives a systematic study on Cu-Al IMC micro-structure and micro-compositions. Moreover, as the application of Copper Wire coated with Palladium is a solution to prevent Copper oxidation during the bonding process, we also give a discussion on the differences in IMC growing between Copper Wire and Copper Wire with Pd coated. We study the IMC structure in Copper Wire bonding process with Palladium coated using TEM and analyze the impact that Palladium has on IMC growing and reliability.
-
Behaviors of Palladium in Palladium coated Copper Wire bonding process
2009 International Conference on Electronic Packaging Technology and High Density Packaging ICEPT-HDP 2009, 2009Co-Authors: Binhai Zhang, Kaiyou Qian, Ted Wang, Yuqi Cong, Mike Zhao, Xiangquan Fan, Jiaji WangAbstract:Because of its high thermal conductivity, great electrical property and low cost, Copper Wire is considered to replace the conventional gold Wire and becomes widely used in IC assembly processes recent years. However, Copper Wire bonding also has its limitations. Copper oxidation, its high hardness and yield strength are two main disadvantages that manufacturers concern most. The application of Copper Wire coated with palladium is a solution to prevent Copper oxidation during the bonding process. Nevertheless, Pd coated Copper Wire brings in new possible influences to bonding interface and its reliability. This paper gave a systematic study on behaviors of palladium in palladium coated Copper Wire during the bonding process. SEM and EDS were used to analyze Pd distributions in Copper Wire, FAB (free air ball), bonded ball and its interface. It was shown that Pd distribution changed with bonding process going on and the factors that might cause these changes were discussed.
Eamon C Francis - One of the best experts on this subject based on the ideXlab platform.
-
Copper Wire theft and high voltage electrical burns
International journal of burns and trauma, 2014Co-Authors: Eamon C Francis, Odhran P ShelleyAbstract:High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper Wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage Copper Wire and its omnipresence on an international scale.
-
Case Report Copper Wire theft and high voltage electrical burns
International Journal of Burn Trauma, 2014Co-Authors: Eamon C Francis, Odhran P ShelleyAbstract:High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper Wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage Copper Wire and its omnipresence on an international scale.