The Experts below are selected from a list of 327 Experts worldwide ranked by ideXlab platform

Cyril Buttay - One of the best experts on this subject based on the ideXlab platform.

  • Lifetime of power Electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling
    Microelectronics Reliability, 2017
    Co-Authors: Wael Sabbah, Oriol Avino-salvado, Fadli Arabi, Cyril Buttay, Loic Théolier, Hervé Morel
    Abstract:

    We investigate the effect of three testing conditions (thermal shock, Rapid Temperature Change – RTC – and high temperature storage) on the interconnects of a power Electronic Module. In particular, the mechanical strength of thick aluminium wirebonds is investigated and shows that while it is not affected by storage at 230 °C, it is much more sensitive to thermal cycling. Shock tests are found to be especially severe, despite having a smaller temperature swing than RTC. Regarding the die attach, no noticeable reduction in mechanical strength is found, regardless of the ageing conditions, and despite clear micro-structural evolutions.

  • compact double side liquid impingement cooled integrated power Electronic Module
    International Symposium on Power Semiconductor Devices and IC's, 2007
    Co-Authors: C M Johnson, Cyril Buttay, S J Rashidt, F Udrea, G A J Amaratunga, Peter T Ireland, Rajesh Kumar Malhan
    Abstract:

    This paper presents a compact integrated power Electronic Module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the Module and at the heat exchanger interface. A 3-phase inverter Module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper.

Elaine P. Scott - One of the best experts on this subject based on the ideXlab platform.

  • Evaluation of Thermal Resistance Matrix Method for an Embedded Power Electronic Module
    IEEE Transactions on Components and Packaging Technologies, 2008
    Co-Authors: Manu Mital, Ying-feng Pang, Elaine P. Scott
    Abstract:

    Thermal characterization provides data on the thermal performance of Electronic components under given cooling conditions. The most common thermal characterization parameter used to characterize the behavior of Electronic components is the thermal resistance. In this work, experiments are conducted to obtain thermal characterization data for different chips in a multichip package. Using this data, it is shown that the assumption of a linear temperature rise with input power is valid within the expected range of operation of the Electronic Module. Secondly, the applicability of a resistance matrix superposition methodology to the packaging structure of an integrated power Electronic Module is evaluated. The temperatures and the associated uncertainties involved in using the resistance matrix superposition method are compared to those obtained directly by powering all chips. It is shown that for any arbitrary power losses from the chips, the resistance matrix superposition method can predict the temperatures of a multichip package with reasonable accuracy for temperature rise up to 50degC.

  • Thermal Design and Optimization of an IGBT Power Electronic Module
    Electronic and Photonic Packaging Electrical Systems Design and Photonics and Nanotechnology, 2005
    Co-Authors: Manu Mital, Elaine P. Scott
    Abstract:

    This paper presents thermal design optimization of an insulated gate bipolar transistor (IGBT) integrated power Electronic Module (IPEM). A commercially available finite element package was used to create a 3D geometric layout of the IGBT Module. Thermal simulations were performed under different forced air convection conditions, and for both single and double-sided cooling, to study the effects on the hot-spots and maximum temperature rise of the Module. The design optimization for the Module was performed by varying parameters (choice of materials and layer thicknesses) and studying their effect on the thermal performance of the Module. The results of these studies were several improved designs for the Module.Copyright © 2005 by ASME

Rajesh Kumar Malhan - One of the best experts on this subject based on the ideXlab platform.

  • compact double side liquid impingement cooled integrated power Electronic Module
    International Symposium on Power Semiconductor Devices and IC's, 2007
    Co-Authors: C M Johnson, Cyril Buttay, S J Rashidt, F Udrea, G A J Amaratunga, Peter T Ireland, Rajesh Kumar Malhan
    Abstract:

    This paper presents a compact integrated power Electronic Module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the Module and at the heat exchanger interface. A 3-phase inverter Module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper.

Manu Mital - One of the best experts on this subject based on the ideXlab platform.

  • Evaluation of Thermal Resistance Matrix Method for an Embedded Power Electronic Module
    IEEE Transactions on Components and Packaging Technologies, 2008
    Co-Authors: Manu Mital, Ying-feng Pang, Elaine P. Scott
    Abstract:

    Thermal characterization provides data on the thermal performance of Electronic components under given cooling conditions. The most common thermal characterization parameter used to characterize the behavior of Electronic components is the thermal resistance. In this work, experiments are conducted to obtain thermal characterization data for different chips in a multichip package. Using this data, it is shown that the assumption of a linear temperature rise with input power is valid within the expected range of operation of the Electronic Module. Secondly, the applicability of a resistance matrix superposition methodology to the packaging structure of an integrated power Electronic Module is evaluated. The temperatures and the associated uncertainties involved in using the resistance matrix superposition method are compared to those obtained directly by powering all chips. It is shown that for any arbitrary power losses from the chips, the resistance matrix superposition method can predict the temperatures of a multichip package with reasonable accuracy for temperature rise up to 50degC.

  • Thermal Design and Optimization of an IGBT Power Electronic Module
    Electronic and Photonic Packaging Electrical Systems Design and Photonics and Nanotechnology, 2005
    Co-Authors: Manu Mital, Elaine P. Scott
    Abstract:

    This paper presents thermal design optimization of an insulated gate bipolar transistor (IGBT) integrated power Electronic Module (IPEM). A commercially available finite element package was used to create a 3D geometric layout of the IGBT Module. Thermal simulations were performed under different forced air convection conditions, and for both single and double-sided cooling, to study the effects on the hot-spots and maximum temperature rise of the Module. The design optimization for the Module was performed by varying parameters (choice of materials and layer thicknesses) and studying their effect on the thermal performance of the Module. The results of these studies were several improved designs for the Module.Copyright © 2005 by ASME

Kim Evans - One of the best experts on this subject based on the ideXlab platform.

  • Impact of Thermal Cycling in Humid Environments on Power Electronic Modules
    IEEE Transactions on Components Packaging and Manufacturing Technology, 2012
    Co-Authors: Ningyan Wang, Ian Cotton, Kim Evans
    Abstract:

    The reliable operation of power Electronic Modules operating at high voltage is essential. The dielectric system within the power Electronic Module is reasonably simple, but must be worked as hard as possible to achieve the highest Module power densities. It is well known that a critical location in a power Electronic Module in terms of high voltage performance is the edge of the substrate metallization where high electric fields can give rise to partial discharge within power Electronic Modules and can lead to eventual failure. This paper focuses on two particular issues. First, the performance of the gap between the substrate metallization on which the collector and emitter of the device sit is examined. Second, the performance of the substrate-gel interface is examined once samples have been thermally aged in a humid environment.

  • Partial discharge control in a power Electronic Module using high permittivity non-linear dielectrics
    IEEE Transactions on Dielectrics and Electrical Insulation, 2010
    Co-Authors: Ningyan Wang, Ian Cotton, J. Robertson, Sarah Follmann, Kim Evans, David Newcombe
    Abstract:

    High electric fields at the edge of the substrate metallization can give rise to partial discharge within power Electronic Modules and can lead to eventual failure. This paper examines the use of silicone gels filled with barium titanate to reduce the electric field enhancement at the edge of substrate metallization and therefore increase partial discharge inception voltages. The barium titanate filled gel produces a dielectric in which the relative permittivity is increased over a plain gel and that also exhibits a dependence on electric field. The theoretical electric field reduction that can be achieved in a power Electronic Module through the use of filled gels is demonstrated and compared against experimental measurements including the trial of the technique in some commercial Modules. As promising results are achieved, consideration is also given to the effect of the barium titanate filler on the viscosity of the gel and the thermal conductivity, two key manufacturing issues.

  • The impact of thermal cycling in humid environments on power Electronic Modules
    2009 IEEE 6th International Power Electronics and Motion Control Conference, 2009
    Co-Authors: Ningyan Wang, Ian Cotton, Kim Evans
    Abstract:

    The reliable operation of power Electronic Modules operating at high voltage is essential. The dielectric system within the power Electronic Module is reasonably simple but must be worked as hard as possible to achieve the highest Module power densities. It is well known that a critical location in a power Electronic Module in terms of high voltage performance is the edge of the substrate metallisation where high electric fields can give rise to partial discharge within power Electronic Modules and can lead to eventual failure. This paper focuses on two particular issues. Firstly the performance of the gap between the substrate metallisation on which the collector and emitter of the device sit is examined. Secondly, the performance of the substrate-gel interface is examined once samples have been thermally aged in a humid environment.