The Experts below are selected from a list of 23295 Experts worldwide ranked by ideXlab platform
Young-bae Park - One of the best experts on this subject based on the ideXlab platform.
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A study on the Interfacial Adhesion energy between capping layer and dielectric for cu interconnects
Microelectronics Reliability, 2021Co-Authors: Cheol Ho Kim, Kirak Son, Gahui Kim, Sung Tae Kim, Sol-kyu Lee, So-yeon Lee, Young-bae Park, Young-chang JooAbstract:Abstract Recently, Cu interconnect and low-k materials have been applied to reduce the interconnect resistive-capacitive delay issue. However, as the process node size is reduced to a few nanometers, high leakage currents appear through the dielectric under high electric fields. Therefore, issues of Cu diffusion at the interface between the dielectric and the capping layer have been reported. This study investigated Interfacial Adhesion energy change at the film level between dielectric (low-k, tetraethyl orthosilicate (TEOS)) and capping layer (SiCN, SiN) taking into account the correlation between Interfacial Adhesion energy and interconnect reliability. In the capping layer/low-k interface, when low-k is applied to the top layer, it shows high Interfacial Adhesion energy (> 34.31 ± 3.49 J/m2) due to the presence of an O-rich thin layer. But when low-k is applied to the bottom layer, due to the Si C bond, it shows low Interfacial Adhesion energy ( 32.54 ± 1.97 J/m2) regardless of the stacking order and CMP process. It clearly shows that low-k dielectrics will affect the deterioration of the Interfacial Adhesion energy and O-rich layer will greatly improve the Interfacial Adhesion energy in dielectric/capping layers.
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Effects of Post-annealing and Co Interlayer Between SiN_x and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections
Electronic Materials Letters, 2020Co-Authors: Hyeonchul Lee, Kirak Son, Gahui Kim, Minsu Jeong, Jeongmin Seo, Taek-soo Kim, Young-bae ParkAbstract:Effects of Co interlayer and 200 °C post-annealing treatment on Interfacial Adhesion energy of SiN_x/Cu structure were systematically investigated. Initial Interfacial Adhesion energy of SiN_x/Cu structure measured by double cantilever beam test was 0.92 J/m^2. The Interfacial Adhesion energy increased to 2.94 J/m^2 with Co interlayer between SiN_x and Cu films. After post-annealing treatment at 200 °C for 500 h, the Interfacial Adhesion energy of SiN_x/Co/Cu structure decreased to 0.95 J/m^2. X-ray photoelectron spectroscopy analysis revealed that the Interfacial Adhesion energy increased for SiN_x/Co/Cu thin films due to CoSi_2 reaction layer at SiN_x/Co interface, but sharply decreased during post-annealing treatment by SiO_2 formation at SiN_x/Co interface. Graphic abstract
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Effect of Dielectric Process on the Interfacial Adhesion of RDL for FOWLP
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020Co-Authors: Young-bae ParkAbstract:The effect of low-temperature curable polybenzoxazole (PBO) process conditions on the Interfacial Adhesion energies between PBO dielectric and Cu redistribution layer for advanced fan-out packaging (FO package) were systematically investigated. The Interfacial Adhesion energies were 13.8 ± 2.0, 21.7 ± 2.7, and 6.3 ± 0.4 J/m2 under PBO curing temperature at 175, 200, and 225 °C, respectively. The X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the Interfacial Adhesion energy and the O 1s peak area fraction. Also, the nanoindentation analysis showed that there exists a little correlation between the Interfacial Adhesion energy and the hardness. Therefore, the optimized curing temperature of PBO must be carefully controlled to obtain Interfacial Adhesion of improvement to achieve Interfacial reliability for advanced FO package.
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Effects of Post-annealing and Co Interlayer Between SiN_x and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections
Electronic Materials Letters, 2020Co-Authors: Minsu Jeong, Young-bae ParkAbstract:Effects of Co interlayer and 200 °C post-annealing treatment on Interfacial Adhesion energy of SiN_x/Cu structure were systematically investigated. Initial Interfacial Adhesion energy of SiN_x/Cu structure measured by double cantilever beam test was 0.92 J/m^2. The Interfacial Adhesion energy increased to 2.94 J/m^2 with Co interlayer between SiN_x and Cu films. After post-annealing treatment at 200 °C for 500 h, the Interfacial Adhesion energy of SiN_x/Co/Cu structure decreased to 0.95 J/m^2. X-ray photoelectron spectroscopy analysis revealed that the Interfacial Adhesion energy increased for SiN_x/Co/Cu thin films due to CoSi_2 reaction layer at SiN_x/Co interface, but sharply decreased during post-annealing treatment by SiO_2 formation at SiN_x/Co interface. Graphic abstract
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Effects of Dielectric Curing Conditions on the Interfacial Adhesion of Cu RDL for Fan-Out Wafer Level Packaging
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019Co-Authors: Young-bae ParkAbstract:The effect of polybenzoxazole (PBO) dielectric curing and post-annealing treatment conditions at 150°C on the Interfacial Adhesion energies of Ti barrier and PBO dielectric layers for fan-out wafer level packaging applications were systematically investigated. The initial Interfacial Adhesion energies were 16.63, 25.95, and 16.58 J/m2 under PBO curing conditions at 175, 200, and 225°C, respectively. The Interfacial Adhesion energies were 25.95, 28.79, and 8.86 J/m2 at post-annealing times of 0, 24, and 100 h, respectively. The increased Interfacial Adhesion energy during PBO curing and post-annealing treatment for 24h seems to be closely related to M-O-C species at Ti/PBO interface, while decreased Interfacial Adhesion energy during post-annealing treatments for 100h seems be closely related to degradation of the PBO.
Béla Pukánszky - One of the best experts on this subject based on the ideXlab platform.
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improving Interfacial Adhesion in pla wood biocomposites
Composites Science and Technology, 2013Co-Authors: Károly Renner, János Móczó, Béla Pukánszky, Gabo Faludi, Gábor DoraAbstract:Abstract Two reactive coupling agents, N,N-(1,3-phenylene dimaleimide) (BMI) and 1,1-(methylenedi-4,1-phenylene)bismaleimide (DBMI) were used to improve Interfacial Adhesion in PLA/wood composites. First the effect of the coupling agents was established in a series of experiments in which the amount of coupling agent changed at constant wood content, and then the effect of coupling was determined at various wood loadings (0–60 vol%). Composites were homogenized in an internal mixer and compression molded to plates. Tensile properties were determined and micromechanical deformations were studied by acoustic emission measurements. The two compounds improved the properties of the composites. Stiffness, strength and deformability increased simultaneously supplying sufficient proof for coupling. Because of the flexibility of the molecule, DBMI is a more efficient coupling agent in the studied composites than BMI. However, the effect of coupling is small, because only a few very large particles debond under the effect of external load. Smaller particles adhere strongly to the matrix even without coupling proving that Interfacial Adhesion is strong in PLA/wood composites.
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PLA/lignocellulosic fiber composites: Particle characteristics, Interfacial Adhesion, and failure mechanism
Journal of Applied Polymer Science, 2013Co-Authors: Gabo Faludi, Károly Renner, János Móczó, Gábor Dora, Balázs Imre, Béla PukánszkyAbstract:Poly(lactic acid) (PLA) composites were prepared using six lignocellulosic fibers with widely varying particle characteristics. The composites were characterized by tensile testing, scanning electron (SEM), and polarization optical microscopy (POM). Micromechanical deformation processes during loading were followed by acoustic emission measurements. Interfacial Adhesion was estimated by three independent methods. Contrary to most claims published in the literature, Interfacial Adhesion between PLA and natural fibers was found to be rather strong, a result confirmed by the quantitative estimation of Adhesion strength, acoustic emission measurements, and SEM study. Strong Interfacial Adhesion results in weak dependence of the extent of reinforcement on the particle characteristics of the reinforcing fibers. Both acoustic emission measurements and microscopy indicated that the dominating micromechanical deformation process is the fracture of the fibers and close correlation was found between the initiation stress of fiber fracture, reinforcement, and the ultimate strength of the composites. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 39902.
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Improving Interfacial Adhesion in pla/wood biocomposites
Composites Science and Technology, 2013Co-Authors: Gabo Faludi, Károly Renner, János Móczó, Gábor Dora, Béla PukánszkyAbstract:Abstract Two reactive coupling agents, N,N-(1,3-phenylene dimaleimide) (BMI) and 1,1-(methylenedi-4,1-phenylene)bismaleimide (DBMI) were used to improve Interfacial Adhesion in PLA/wood composites. First the effect of the coupling agents was established in a series of experiments in which the amount of coupling agent changed at constant wood content, and then the effect of coupling was determined at various wood loadings (0–60 vol%). Composites were homogenized in an internal mixer and compression molded to plates. Tensile properties were determined and micromechanical deformations were studied by acoustic emission measurements. The two compounds improved the properties of the composites. Stiffness, strength and deformability increased simultaneously supplying sufficient proof for coupling. Because of the flexibility of the molecule, DBMI is a more efficient coupling agent in the studied composites than BMI. However, the effect of coupling is small, because only a few very large particles debond under the effect of external load. Smaller particles adhere strongly to the matrix even without coupling proving that Interfacial Adhesion is strong in PLA/wood composites.
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Quantitative determination of Interfacial Adhesion in composites with strong bonding
European Polymer Journal, 2010Co-Authors: Károly Renner, János Móczó, G. Vörös, Béla PukánszkyAbstract:Abstract An approach was proposed for the quantitative determination of Adhesion strength in composites, in which Adhesion is created by other mechanisms than secondary interactions. The approach is based upon a model, which gives debonding stress as a function of Interfacial Adhesion. Debonding stress was determined by acoustic emission experiments. The mechanism of deformation was checked by SEM experiments and the approach was verified on composites with known Interfacial Adhesion. The results showed that the use of functionalized polymer in PP/CaCO3 composites resulted in Adhesion strength one order of magnitude larger than without the coupling agent. The application of various surface modification techniques in PP/glass bead composites yielded different Adhesion values covering a range of about one order of magnitude. The quantitative determination of Interfacial Adhesion makes possible the design and optimization of most surface modification techniques in particulate filled and short fiber reinforced composites.
János Móczó - One of the best experts on this subject based on the ideXlab platform.
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pla lignocellulosic fiber composites particle characteristics Interfacial Adhesion and failure mechanism
Journal of Applied Polymer Science, 2014Co-Authors: János Móczó, Gabo Faludi, Gabo Dora, Alazs Imre, Karoly RenneAbstract:Poly(lactic acid) (PLA) composites were prepared using six lignocellulosic fibers with widely varying particle characteristics. The composites were characterized by tensile testing, scanning electron (SEM), and polarization optical microscopy (POM). Micromechanical deformation processes during loading were followed by acoustic emission measurements. Interfacial Adhesion was estimated by three independent methods. Contrary to most claims published in the literature, Interfacial Adhesion between PLA and natural fibers was found to be rather strong, a result confirmed by the quantitative estimation of Adhesion strength, acoustic emission measurements, and SEM study. Strong Interfacial Adhesion results in weak dependence of the extent of reinforcement on the particle characteristics of the reinforcing fibers. Both acoustic emission measurements and microscopy indicated that the dominating micromechanical deformation process is the fracture of the fibers and close correlation was found between the initiation stress of fiber fracture, reinforcement, and the ultimate strength of the composites. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 39902.
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improving Interfacial Adhesion in pla wood biocomposites
Composites Science and Technology, 2013Co-Authors: Károly Renner, János Móczó, Béla Pukánszky, Gabo Faludi, Gábor DoraAbstract:Abstract Two reactive coupling agents, N,N-(1,3-phenylene dimaleimide) (BMI) and 1,1-(methylenedi-4,1-phenylene)bismaleimide (DBMI) were used to improve Interfacial Adhesion in PLA/wood composites. First the effect of the coupling agents was established in a series of experiments in which the amount of coupling agent changed at constant wood content, and then the effect of coupling was determined at various wood loadings (0–60 vol%). Composites were homogenized in an internal mixer and compression molded to plates. Tensile properties were determined and micromechanical deformations were studied by acoustic emission measurements. The two compounds improved the properties of the composites. Stiffness, strength and deformability increased simultaneously supplying sufficient proof for coupling. Because of the flexibility of the molecule, DBMI is a more efficient coupling agent in the studied composites than BMI. However, the effect of coupling is small, because only a few very large particles debond under the effect of external load. Smaller particles adhere strongly to the matrix even without coupling proving that Interfacial Adhesion is strong in PLA/wood composites.
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PLA/lignocellulosic fiber composites: Particle characteristics, Interfacial Adhesion, and failure mechanism
Journal of Applied Polymer Science, 2013Co-Authors: Gabo Faludi, Károly Renner, János Móczó, Gábor Dora, Balázs Imre, Béla PukánszkyAbstract:Poly(lactic acid) (PLA) composites were prepared using six lignocellulosic fibers with widely varying particle characteristics. The composites were characterized by tensile testing, scanning electron (SEM), and polarization optical microscopy (POM). Micromechanical deformation processes during loading were followed by acoustic emission measurements. Interfacial Adhesion was estimated by three independent methods. Contrary to most claims published in the literature, Interfacial Adhesion between PLA and natural fibers was found to be rather strong, a result confirmed by the quantitative estimation of Adhesion strength, acoustic emission measurements, and SEM study. Strong Interfacial Adhesion results in weak dependence of the extent of reinforcement on the particle characteristics of the reinforcing fibers. Both acoustic emission measurements and microscopy indicated that the dominating micromechanical deformation process is the fracture of the fibers and close correlation was found between the initiation stress of fiber fracture, reinforcement, and the ultimate strength of the composites. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 39902.
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Improving Interfacial Adhesion in pla/wood biocomposites
Composites Science and Technology, 2013Co-Authors: Gabo Faludi, Károly Renner, János Móczó, Gábor Dora, Béla PukánszkyAbstract:Abstract Two reactive coupling agents, N,N-(1,3-phenylene dimaleimide) (BMI) and 1,1-(methylenedi-4,1-phenylene)bismaleimide (DBMI) were used to improve Interfacial Adhesion in PLA/wood composites. First the effect of the coupling agents was established in a series of experiments in which the amount of coupling agent changed at constant wood content, and then the effect of coupling was determined at various wood loadings (0–60 vol%). Composites were homogenized in an internal mixer and compression molded to plates. Tensile properties were determined and micromechanical deformations were studied by acoustic emission measurements. The two compounds improved the properties of the composites. Stiffness, strength and deformability increased simultaneously supplying sufficient proof for coupling. Because of the flexibility of the molecule, DBMI is a more efficient coupling agent in the studied composites than BMI. However, the effect of coupling is small, because only a few very large particles debond under the effect of external load. Smaller particles adhere strongly to the matrix even without coupling proving that Interfacial Adhesion is strong in PLA/wood composites.
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Quantitative determination of Interfacial Adhesion in composites with strong bonding
European Polymer Journal, 2010Co-Authors: Károly Renner, János Móczó, G. Vörös, Béla PukánszkyAbstract:Abstract An approach was proposed for the quantitative determination of Adhesion strength in composites, in which Adhesion is created by other mechanisms than secondary interactions. The approach is based upon a model, which gives debonding stress as a function of Interfacial Adhesion. Debonding stress was determined by acoustic emission experiments. The mechanism of deformation was checked by SEM experiments and the approach was verified on composites with known Interfacial Adhesion. The results showed that the use of functionalized polymer in PP/CaCO3 composites resulted in Adhesion strength one order of magnitude larger than without the coupling agent. The application of various surface modification techniques in PP/glass bead composites yielded different Adhesion values covering a range of about one order of magnitude. The quantitative determination of Interfacial Adhesion makes possible the design and optimization of most surface modification techniques in particulate filled and short fiber reinforced composites.
Károly Renner - One of the best experts on this subject based on the ideXlab platform.
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improving Interfacial Adhesion in pla wood biocomposites
Composites Science and Technology, 2013Co-Authors: Károly Renner, János Móczó, Béla Pukánszky, Gabo Faludi, Gábor DoraAbstract:Abstract Two reactive coupling agents, N,N-(1,3-phenylene dimaleimide) (BMI) and 1,1-(methylenedi-4,1-phenylene)bismaleimide (DBMI) were used to improve Interfacial Adhesion in PLA/wood composites. First the effect of the coupling agents was established in a series of experiments in which the amount of coupling agent changed at constant wood content, and then the effect of coupling was determined at various wood loadings (0–60 vol%). Composites were homogenized in an internal mixer and compression molded to plates. Tensile properties were determined and micromechanical deformations were studied by acoustic emission measurements. The two compounds improved the properties of the composites. Stiffness, strength and deformability increased simultaneously supplying sufficient proof for coupling. Because of the flexibility of the molecule, DBMI is a more efficient coupling agent in the studied composites than BMI. However, the effect of coupling is small, because only a few very large particles debond under the effect of external load. Smaller particles adhere strongly to the matrix even without coupling proving that Interfacial Adhesion is strong in PLA/wood composites.
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PLA/lignocellulosic fiber composites: Particle characteristics, Interfacial Adhesion, and failure mechanism
Journal of Applied Polymer Science, 2013Co-Authors: Gabo Faludi, Károly Renner, János Móczó, Gábor Dora, Balázs Imre, Béla PukánszkyAbstract:Poly(lactic acid) (PLA) composites were prepared using six lignocellulosic fibers with widely varying particle characteristics. The composites were characterized by tensile testing, scanning electron (SEM), and polarization optical microscopy (POM). Micromechanical deformation processes during loading were followed by acoustic emission measurements. Interfacial Adhesion was estimated by three independent methods. Contrary to most claims published in the literature, Interfacial Adhesion between PLA and natural fibers was found to be rather strong, a result confirmed by the quantitative estimation of Adhesion strength, acoustic emission measurements, and SEM study. Strong Interfacial Adhesion results in weak dependence of the extent of reinforcement on the particle characteristics of the reinforcing fibers. Both acoustic emission measurements and microscopy indicated that the dominating micromechanical deformation process is the fracture of the fibers and close correlation was found between the initiation stress of fiber fracture, reinforcement, and the ultimate strength of the composites. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 39902.
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Improving Interfacial Adhesion in pla/wood biocomposites
Composites Science and Technology, 2013Co-Authors: Gabo Faludi, Károly Renner, János Móczó, Gábor Dora, Béla PukánszkyAbstract:Abstract Two reactive coupling agents, N,N-(1,3-phenylene dimaleimide) (BMI) and 1,1-(methylenedi-4,1-phenylene)bismaleimide (DBMI) were used to improve Interfacial Adhesion in PLA/wood composites. First the effect of the coupling agents was established in a series of experiments in which the amount of coupling agent changed at constant wood content, and then the effect of coupling was determined at various wood loadings (0–60 vol%). Composites were homogenized in an internal mixer and compression molded to plates. Tensile properties were determined and micromechanical deformations were studied by acoustic emission measurements. The two compounds improved the properties of the composites. Stiffness, strength and deformability increased simultaneously supplying sufficient proof for coupling. Because of the flexibility of the molecule, DBMI is a more efficient coupling agent in the studied composites than BMI. However, the effect of coupling is small, because only a few very large particles debond under the effect of external load. Smaller particles adhere strongly to the matrix even without coupling proving that Interfacial Adhesion is strong in PLA/wood composites.
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Quantitative determination of Interfacial Adhesion in composites with strong bonding
European Polymer Journal, 2010Co-Authors: Károly Renner, János Móczó, G. Vörös, Béla PukánszkyAbstract:Abstract An approach was proposed for the quantitative determination of Adhesion strength in composites, in which Adhesion is created by other mechanisms than secondary interactions. The approach is based upon a model, which gives debonding stress as a function of Interfacial Adhesion. Debonding stress was determined by acoustic emission experiments. The mechanism of deformation was checked by SEM experiments and the approach was verified on composites with known Interfacial Adhesion. The results showed that the use of functionalized polymer in PP/CaCO3 composites resulted in Adhesion strength one order of magnitude larger than without the coupling agent. The application of various surface modification techniques in PP/glass bead composites yielded different Adhesion values covering a range of about one order of magnitude. The quantitative determination of Interfacial Adhesion makes possible the design and optimization of most surface modification techniques in particulate filled and short fiber reinforced composites.
Albert F. Yee - One of the best experts on this subject based on the ideXlab platform.
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Interfacial Adhesion and toughening mechanisms in an alloy of polycarbonate/polyethylene
Polymer, 1992Co-Authors: Hung-jue Sue, J. Huang, Albert F. YeeAbstract:Abstract Interfacial Adhesion and toughening mechanisms in an alloy of polycarbonate/polyethylene (PC/PE) are investigated using transmission electron microscopy. In contrast to the general speculation, it is found that the PE particles strongly adhere to the PC matrix. The toughening mechanisms in the PC/PE blend are found to be debonding of the PC/PE interface, which relieves the triaxial tension in front of the crack tip, followed by shear banding of the PC matrix. Possible causes for such an unexpected strong Interfacial Adhesion between PC and PE are discussed. Also, the importance of the cavitational strength of the toughener phase in toughness optimization is addressed.