The Experts below are selected from a list of 10887 Experts worldwide ranked by ideXlab platform
Stephen Y. Chou - One of the best experts on this subject based on the ideXlab platform.
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Ultrafast Nanoimprint Lithography (Invited Paper)
Ultrafast Phenomena in Semiconductors and Nanostructure Materials IX, 2005Co-Authors: Qiangfei Xia, Stephen Y. ChouAbstract:Both ultrafast thermal and photocurable Nanoimprint Lithography (NIL) are studied and high fidelity transfers of nanopatterns from molds to resists have been achieved. In ultrafast thermal NIL, we use a single excimer laser pulse to melt a NIL resist polymer and imprint it using a fused silica mold. The entire imprint process, from melting the polymer to completion of the imprint, takes less than 200 ns. This technique, termed laser assisted Nanoimprint Lithography (LAN), has patterned nanostructures in various polymer films with high fidelity over the entire mold area. In LAN, the short laser pulse is absorbed primarily by the resist and the laser energy is minute, hence substrate heating and distortion are negligible. In ultrafast photocurable NIL, a flash lamp (pulse width 94 μs) is used to crosslink photo curable resists over a 4 in. wafer with high uniformity by a single pulse. The significant reduction of the heating of the substrate and mold will greatly benefit overlay alignment.
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Fabrication of 5 nm linewidth and 14 nm pitch features by Nanoimprint Lithography
Applied Physics Letters, 2004Co-Authors: Michael D Austin, Dan Wasserman, Zhaoning Yu, Mingtao Li, S.a. Lyon, Haixiong Ge, Wei Wu, Stephen Y. ChouAbstract:We report advances in Nanoimprint Lithography, its application in nanogap metal contacts, and related fabrication yield. We have demonstrated 5 nm linewidth and 14 nm linepitch in resist using Nanoimprint Lithography at room temperature with a pressure less than 15 psi. We fabricated gold contacts (for the application of single macromolecule devices) with 5 nm separation by Nanoimprint in resist and lift-off of metal. Finally, the uniformity and manufacturability of Nanoimprint over a 4 in. wafer were demonstrated.
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Impact of Nanoimprint Lithography to device development
61st Device Research Conference. Conference Digest (Cat. No.03TH8663), 2003Co-Authors: Stephen Y. ChouAbstract:In this paper, we review the status of Nanoimprint Lithography and its applications in nanodevices. In addition to sub-10 nm resolution, 3D patterning, and applications in other areas, we particularly discuss the fabrication of nanotransistors and circuits on 4 wafers using NIL at all Lithography level and the fabrication of room temperature Si single electron transistors.
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Direct three-dimensional patterning using Nanoimprint Lithography
Applied Physics Letters, 2001Co-Authors: Mingtao Li, Lei Chen, Stephen Y. ChouAbstract:We demonstrated that Nanoimprint Lithography (NIL) can create three-dimensional patterns, sub-40 nm T-gates, and air-bridge structures, in a single step imprint in polymer and metal by lift-off. A method based on electron beam Lithography and reactive ion etching was developed to fabricate NIL molds with three-dimensional protrusions. The low-cost and high-throughput Nanoimprint Lithography for three-dimensional nanostructures has many significant applications such as monolithic microwave integrated circuits and nanoelectromechanical system.
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Molecular alignment in submicron patterned polymer matrix using Nanoimprint Lithography
Applied Physics Letters, 2000Co-Authors: Jian Wang, Xiaoyun Sun, Lei Chen, Lei Zhuang, Stephen Y. ChouAbstract:We report a promising approach to align molecules in a polymer film patterned by Nanoimprint Lithography. We found that molecules and chromophores are spontaneously aligned in the plane of the film during the nanopatterning process. Since the polymer–chromophore (called guest–host) system plays an important role in the field of nonlinear optics and organic optoelectronics, in this letter we present a technique to combine the high-resolution patterning capability of Nanoimprint Lithography with the ability to control molecule and chromophore orientation. It opens up a way to realize new molecular electronic and optoelectronic devices.
Jaejong Lee - One of the best experts on this subject based on the ideXlab platform.
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Roll-to-roll Nanoimprint Lithography for patterning on a large-area substrate roll
Microelectronic Engineering, 2014Co-Authors: Hyungjun Lim, Jihyeong Ryu, Geehong Kim, Kee-bong Choi, Sunghwi Lee, Hyun-ha Park, Sanghee Jung, Jaejong LeeAbstract:Graphical abstract We present a process for direct Nanoimprint Lithography from one roll to another.The roll-to-roll Nanoimprint Lithography was conducted in a step-and-repeat manner.We fabricated nanopatterns on a substrate roll of 250-mm diameter and 366-mm width.The substrate roll will be used for the production of nanopatterned films. In this paper, we present a process for direct Nanoimprint Lithography from one roll to another. The basic concept of roll-to-roll Nanoimprint Lithography (R2R-NIL) is illustrated and the possibility of pattern-transfer between two cylindrical, curved surfaces is evaluated. For the replication of nanopatterns to a large-area roll from a small-area roll, the R2R-NIL process has to be conducted in a step-and-repeat manner. We were finally able to fabricate nanopatterns on a substrate roll of 250-mm diameter and 366-mm width. There exist seams and stitches of more than 1-mm in width on the patterned area of the substrate roll. For such a large roll, pre- and post-processes, including spin-coating, are also required. Even so, R2R-NIL is expected to be an effective tool to fabricate large-area rolls that can be used for the production of nanopatterned films.
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Nanoimprint Lithography with a focused laser beam for the fabrication of nanopatterned microchannel molds.
Lab on a Chip, 2013Co-Authors: Hyungjun Lim, Jihyeong Ryu, Geehong Kim, Kee-bong Choi, Sunghwi Lee, Jaejong LeeAbstract:We present a process based on Nanoimprint Lithography for the fabrication of a microchannel mold having nanopatterns formed at the bottoms of its microchannels. A focused laser beam selectively cures the resist in the micrometer scale during Nanoimprint Lithography. Nanopatterns within the microchannels may be used to control microfluidic behavior.
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nano scale patterning using the roll typed uv Nanoimprint Lithography tool
Microelectronic Engineering, 2008Co-Authors: Jaejong Lee, Kee-bong Choi, Sooyeon Park, Geehong KimAbstract:Nanoimprint Lithography is a promising technology to produce sub-100nm half-pitch features on silicon wafers. To achieve nano-imprinting process, nano-imprinting Lithography equipment must have required some multi-functional units which are imprinting head, self-alignment wafer stage, overlay and alignment system for multi-layer process, stamp with sub-100nm half-pitch patterns, and anti-vibration unit, etc. Although imprinting process has many advantages in terms of low cost, high throughput and reproducibility, these imprinting technologies have a limitation to increase imprinting area and imprinting tool sizes. Also, air entrap phenomenon which is generated between the stamp and the resist surfaces during imprinting process is getting important parameter in the press type imprinting process. In order to get over these limitations and the air entrap and to fabricate large area product, such as above 8in. wafer, display unit and multi-functional device, roll typed UV-Nanoimprint Lithography tool are certainly necessary. In this study, the roll typed UV-Nanoimprint Lithography tool which is can be loaded PDMS (polydimethylsiloxane), polycarbonate and PET film as soft stamp, is proposed.
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Design of a Rubber Membrane under Substrate for Nanoimprint Lithography Process
Key Engineering Materials, 2006Co-Authors: Seung Woo Han, Jaejong Lee, Ki Jeong Seo, Seung-woo Lee, Hak Joo Lee, Jung Yup KimAbstract:Nanoimprint Lithography is a promising technology to produce sub-100 nm scale features on silicon chips. One of key issues in the Nanoimprint Lithography is how to make uniform contact between the stamp and the substrate on a large area. In this study a rubber membrane unit under substrate is introduced to resolve this problem. Two layers of membrane were designed to consider air flow in the middle of resist on a silicon wafer. The geometry design for accomplishing uniform contact was carried out using finite element analysis. The material modeling of hyperelastic properties of rubber is characterized by the Mooney-Rivlin strain energy functions. Material constants in the strain energy functions are able to be determined via the curve fitting of experimental stress-strain data. Simple tension and equi-biaxial tests were performed to determine the material constants. To evaluate the effects of a rubber membrane unit, Nanoimprint Lithography process with it was executed. We could confirm that a distinct improvement of uniform contact was shown and air flow problem was solved during the process.
Clivia M. Sotomayor Torres - One of the best experts on this subject based on the ideXlab platform.
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3D nanofabrication by reverse contact UV Nanoimprint Lithography
Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference MNC, 2007Co-Authors: Nikolaos Kehagias, G. Chansin, V. Reboud, Marc Zelsmann, CLAUS JEPPESEN, Gabi Gruetzner, C. Schuster, Franz Reuther, Clivia M. Sotomayor TorresAbstract:A newly developed nanofabrication technique, namely reverse contact UV Nanoimprint Lithography, which is a combination of Nanoimprint Lithography and contact printing Lithography is carried out to fabricate the multilayered polymer structures with sub-micrometer features. This method results in resist pattern transfer without a residual layer thereby rending unnecessary the etching steps typically needed in the imprint Lithography techniques for three-dimensional (3D) patterning.
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Nanoimprint Lithography: Challenges and prospects
Nanotechnology, 2001Co-Authors: S. Zankovych, J. Seekamp, J. U. Bruch, Thorsten Hoffmann, Clivia M. Sotomayor TorresAbstract:We review the salient aspects of Nanoimprint Lithography and consider the challenges it faces in becoming a standard fabrication technique, such as costs and throughput. We discuss material issues such as visco-elasticity and functionality of the printed material. By way of an illustration, we present printing results of 50 nm features over a 2 ž 2 cm2 area which are reproducible with high fidelity. Data of printing 15 nm features in PMMA using a Cr stamp was obtained.
Feng Sun - One of the best experts on this subject based on the ideXlab platform.
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Nanoimprint Lithography: A processing technique for nanofabrication advancement
Nano-Micro Letters, 2011Co-Authors: Weimin Zhou, Guoquan Min, Yanbo Liu, Jinhe Wang, Jing Zhang, Yanping Zhang, Feng SunAbstract:Nanoimprint Lithography (NIL) is an emerging micro/nano-patterning technique, which is a high-resolution, high-throughput and yet simple fabrication process. According to International Technology Roadmap for Semiconductor (ITRS), NIL has emerged as the next generation Lithography candidate for the 22 nm and 16 nm technological nodes. In this paper, we present an overview of Nanoimprint Lithography. The classfication, research focus, critical issues, and the future of Nanoimprint Lithography are intensively elaborated. A pattern as small as 2.4 nm has been demonstrated. Full-wafer Nanoimprint Lithography has been completed on a 12-inch wafer. Recently, 12.5 nm pattern resolution through soft molecular scale Nanoimprint Lithography has been achieved by EV Group, a leading Nanoimprint Lithography technology supplier.
Weimin Zhou - One of the best experts on this subject based on the ideXlab platform.
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Nanoimprint Lithography Process
Nanoimprint Lithography: An Enabling Process for Nanofabrication, 2012Co-Authors: Weimin ZhouAbstract:It is well known now that a Nanoimprint Lithography process generally consists of stamp modification, spin coating of resist, imprinting, and then etching for pattern transfer. The stamp modification has been already demonstrated in Chap. 4. Before imprinting, the substrate surface is coated by a thin film for imprinting; how to create a uniform imprinted film is a crucial issue. The spin coating is generally a common method to control film thickness. There are three main Nanoimprint Lithography techniques: hot embossing (HE), UV-based Nanoimprint Lithography (UV-NIL), and soft Lithography. Various soft Lithography techniques have been proposed such as microcontact printing (μCP), replica molding (REM), microtransfer molding (μTM), micromolding in capillaries (MIMIC), and solvent-assisted micromolding (SAMIM). They can be widely used in various fields. In Nanoimprint Lithography process, the controlling of pattern defect, alignment, and full area imprinted pattern are among the hot topics. Recently, a great deal of attention has been paid to soft UV Nanoimprint because of the full area conformal contact with the substrate.
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Nanoimprint Lithography Process
Nanoimprint Lithography: An Enabling Process for Nanofabrication, 2012Co-Authors: Weimin ZhouAbstract:It is well known now that a Nanoimprint Lithography process generally consists of stamp modification, spin coating of resist, imprinting, and then etching for pattern transfer. The stamp modification has been already demonstrated in Chap. 4. Before imprinting, the substrate surface is coated by a thin film for imprinting; how to create a uniform imprinted film is a crucial issue. The spin coating is generally a common method to control film thickness. There are three main Nanoimprint Lithography techniques: hot embossing (HE), UV-based Nanoimprint Lithography (UV-NIL), and soft Lithography. Various soft Lithography techniques have been proposed such as microcontact printing (μCP), replica molding (REM), microtransfer molding (μTM), micromolding in capillaries (MIMIC), and solvent-assisted micromolding (SAMIM). They can be widely used in various fields. In Nanoimprint Lithography process, the controlling of pattern defect, alignment, and full area imprinted pattern are among the hot topics. Recently, a great deal of attention has been paid to soft UV Nanoimprint because of the full area conformal contact with the substrate.
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Nanoimprint Lithography: A processing technique for nanofabrication advancement
Nano-Micro Letters, 2011Co-Authors: Weimin Zhou, Guoquan Min, Yanbo Liu, Jinhe Wang, Jing Zhang, Yanping Zhang, Feng SunAbstract:Nanoimprint Lithography (NIL) is an emerging micro/nano-patterning technique, which is a high-resolution, high-throughput and yet simple fabrication process. According to International Technology Roadmap for Semiconductor (ITRS), NIL has emerged as the next generation Lithography candidate for the 22 nm and 16 nm technological nodes. In this paper, we present an overview of Nanoimprint Lithography. The classfication, research focus, critical issues, and the future of Nanoimprint Lithography are intensively elaborated. A pattern as small as 2.4 nm has been demonstrated. Full-wafer Nanoimprint Lithography has been completed on a 12-inch wafer. Recently, 12.5 nm pattern resolution through soft molecular scale Nanoimprint Lithography has been achieved by EV Group, a leading Nanoimprint Lithography technology supplier.
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Characterization of anti-adhesive self-assembled monolayer for Nanoimprint Lithography
Applied Surface Science, 2008Co-Authors: Weimin Zhou, Guoquan Min, Yanbo Liu, Jing Zhang, Xiaomin Niu, Zhitang Song, Yongzhong Wan, Liyi Shi, Songlin FengAbstract:Abstract In Nanoimprint Lithography process, resist adhesion to the mold was usually self-assembled and a release agent on the mold surface to detach easily from the imprinted resist. In the paper, the commercially available silane, 1 H ,1 H ,2 H ,2 H -perfluorodecyltrichlorosilane (CF 3 –(CF 2 ) 7 –(CH 2 ) 2 –SiCl 3 or FDTS) was used to investigate the anti-adhesion for UV-Nanoimprint Lithography. A water contact angle as high as 113.11 was achieved by self-assembled monolayer (SAM) deposited on the quarter mold by vapor evaporation, which is desirable for a good anti-adhesion agent between the fused silica and the curing resist. The homogeneous monolayer was also evaluated by AFM and XPS. UV-NIL using FDTS-coated fused silica process good pattern transfer fidelity. It is shown that the FDTS is an excellent and promising release agent material for UV-Nanoimprint Lithography.
