The Experts below are selected from a list of 897 Experts worldwide ranked by ideXlab platform

Kanti Jain - One of the best experts on this subject based on the ideXlab platform.

  • Design and Fabrication of Large-Area, Redundant, Stretchable Interconnect Meshes Using Excimer Laser Photoablation and In Situ Masking
    IEEE Transactions on Advanced Packaging, 2010
    Co-Authors: Junghun Chae, Kanti Jain
    Abstract:

    Stretchable interconnects play an important role towards the realization of the realm of systems that include large-area sensor skins and wearable electronics. These interconnects must be reliable and robust for viability, and must be flexible, stretchable, and conformable to nonplanar surfaces for diverse applicability. This research describes the design, modeling, fabrication, and testing of stretchable interconnects on polymer substrates using metal patterns both as functional interconnect layers and as in situ masks for excimer laser Photoablation. The fluences for Photoablation of polymers are generally much lower than the threshold fluence for removal or damage of metals; thus, metal thin films that are designed as structural layers in the sensor skin can be used as in situ masks for polymers if the proper fluence is used. Self-aligned single-layer and multilayer interconnects of various designs (rectilinear and “meandering”) have been fabricated, and certain “meandering” interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. Furthermore, redundant interconnect meshes have been modeled and fabricated that increase the viability of the interconnect mesh while stretching up to 30% uniaxially and a prototype redundant interconnect mesh has been fabricated using seamless-scanning large-area fabrication techniques.

  • large area high speed patterning of carbon nanotubes using material assisted excimer laser Photoablation
    Materials Letters, 2009
    Co-Authors: Junghun Chae, Kanti Jain
    Abstract:

    Large-area patterning of carbon nanotubes (CNTs) using a nonlithographic process is demonstrated. Projection imaging with deep ultraviolet radiation from 248 nm KrF excimer laser and material-assisted Photoablation were used to pattern the CNTs. A matrix of CNTs dissolved in a DMF solution was deposited on a silicon wafer by spin coating, followed by coating of photodefinable polyimide on the CNTs. The CNTs and the polyimide layer were simultaneously patterned by the excimer laser projection Photoablation process. Even though CNTs cannot be directly photoablated by low-fluence excimer laser radiation, simultaneous patterning of the illuminated CNT-polyimide combination region occurred due to the physical force of dissociated fragments of polyimide layer. We have demonstrated clean, large-area patterning of CNTs on 100 mm diameter Si wafers. Additionally, this patterning process is economical and provides higher throughput compared with conventional methods.

  • stretchable multilayer self aligned interconnects fabricated using excimer laser Photoablation and in situ masking
    Proceedings of SPIE the International Society for Optical Engineering, 2009
    Co-Authors: Kanti Jain
    Abstract:

    Stretchable interconnects are essential to large-area flexible circuits and large-area sensor array systems, and they play an important role towards the realization of the realm of systems which include wearable electronics, sensor arrays for structural health monitoring, and sensor skins for tactile feedback. These interconnects must be reliable and robust for viability, and must be flexible, stretchable, and conformable to non-planar surfaces. This research describes the design, modeling, fabrication, and testing of stretchable interconnects on polymer substrates using metal patterns both as functional interconnect layers and as in-situ masks for excimer laser Photoablation. Excimer laser Photoablation is often used for patterning of polymers and thin-film metals. The fluences for Photoablation of polymers are generally much lower than the threshold fluence for removal or damage of high-thermallyconductive metals; thus, metal thin films can be used as in-situ masks for polymers if the proper fluence is used. Selfaligned single-layer and multi-layer interconnects of various designs (rectilinear and 'meandering') have been fabricated, and certain 'meandering' interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. These results are compared with Finite Element Analysis (FEA) models and are observed to be in good accordance with them. This fabrication approach eliminates masks and microfabrication processing steps as compared to traditional fabrication approaches; furthermore, this technology is scalable for large-area sensor arrays and electronic circuits, adaptable for a variety of materials and interconnects designs, and compatible with MEMS-based capacitive sensor technology.

  • Design and fabrication of stretchable multilayer self-aligned interconnects for flexible electronics and large-area sensor arrays using excimer laser Photoablation
    IEEE Electron Device Letters, 2009
    Co-Authors: Kevin L Lin, Kanti Jain
    Abstract:

    Stretchable interconnects are fabricated on polymer substrates using metal patterns both as functional interconnect layers and as in situ masks for excimer laser Photoablation. Single-layer and multilayer interconnects of various designs (rectilinear and ldquomeanderingrdquo) have been fabricated, and certain ldquomeanderingrdquo interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. This approach eliminates masks and microfabrication processing steps as compared to traditional fabrication approaches. Furthermore, this technology is scalable for large-area sensor arrays and electronic circuits, adaptable for a variety of materials and interconnects designs, and compatible with MEMS-based capacitive sensor technology.

  • excimer laser projection Photoablation patterning of metal thin films for fabrication of microelectronic devices and displays
    IEEE Photonics Technology Letters, 2008
    Co-Authors: Junghun Chae, Kanti Jain
    Abstract:

    A nonlithographic process is demonstrated for patterning Al, Cr, Cu, Ni, Ti, and W thin films, which are widely used in microelectronic and display fabrication. A projection Photoablation process using 248-nm-deep ultraviolet radiation from a KrF excimer laser was used to pattern a polyimide film coated on a SiN layer deposited on glass. The Photoablation-patterned polyimide film was used as a sacrificial layer in a lift-off patterning process for the metal films, which resulted in clean metal patterns with fine line-edge definition being fabricated after lift-off. This process provides a simpler and more economical patterning technique compared to conventional lithography methods, eliminating the developing and etching steps.

Junghun Chae - One of the best experts on this subject based on the ideXlab platform.

  • Design and Fabrication of Large-Area, Redundant, Stretchable Interconnect Meshes Using Excimer Laser Photoablation and In Situ Masking
    IEEE Transactions on Advanced Packaging, 2010
    Co-Authors: Junghun Chae, Kanti Jain
    Abstract:

    Stretchable interconnects play an important role towards the realization of the realm of systems that include large-area sensor skins and wearable electronics. These interconnects must be reliable and robust for viability, and must be flexible, stretchable, and conformable to nonplanar surfaces for diverse applicability. This research describes the design, modeling, fabrication, and testing of stretchable interconnects on polymer substrates using metal patterns both as functional interconnect layers and as in situ masks for excimer laser Photoablation. The fluences for Photoablation of polymers are generally much lower than the threshold fluence for removal or damage of metals; thus, metal thin films that are designed as structural layers in the sensor skin can be used as in situ masks for polymers if the proper fluence is used. Self-aligned single-layer and multilayer interconnects of various designs (rectilinear and “meandering”) have been fabricated, and certain “meandering” interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. Furthermore, redundant interconnect meshes have been modeled and fabricated that increase the viability of the interconnect mesh while stretching up to 30% uniaxially and a prototype redundant interconnect mesh has been fabricated using seamless-scanning large-area fabrication techniques.

  • large area high speed patterning of carbon nanotubes using material assisted excimer laser Photoablation
    Materials Letters, 2009
    Co-Authors: Junghun Chae, Kanti Jain
    Abstract:

    Large-area patterning of carbon nanotubes (CNTs) using a nonlithographic process is demonstrated. Projection imaging with deep ultraviolet radiation from 248 nm KrF excimer laser and material-assisted Photoablation were used to pattern the CNTs. A matrix of CNTs dissolved in a DMF solution was deposited on a silicon wafer by spin coating, followed by coating of photodefinable polyimide on the CNTs. The CNTs and the polyimide layer were simultaneously patterned by the excimer laser projection Photoablation process. Even though CNTs cannot be directly photoablated by low-fluence excimer laser radiation, simultaneous patterning of the illuminated CNT-polyimide combination region occurred due to the physical force of dissociated fragments of polyimide layer. We have demonstrated clean, large-area patterning of CNTs on 100 mm diameter Si wafers. Additionally, this patterning process is economical and provides higher throughput compared with conventional methods.

  • excimer laser projection Photoablation patterning of metal thin films for fabrication of microelectronic devices and displays
    IEEE Photonics Technology Letters, 2008
    Co-Authors: Junghun Chae, Kanti Jain
    Abstract:

    A nonlithographic process is demonstrated for patterning Al, Cr, Cu, Ni, Ti, and W thin films, which are widely used in microelectronic and display fabrication. A projection Photoablation process using 248-nm-deep ultraviolet radiation from a KrF excimer laser was used to pattern a polyimide film coated on a SiN layer deposited on glass. The Photoablation-patterned polyimide film was used as a sacrificial layer in a lift-off patterning process for the metal films, which resulted in clean metal patterns with fine line-edge definition being fabricated after lift-off. This process provides a simpler and more economical patterning technique compared to conventional lithography methods, eliminating the developing and etching steps.

  • patterning of single walled carbon nanotubes using a low fluence excimer laser Photoablation process
    Applied Physics Letters, 2008
    Co-Authors: Junghun Chae, John A Rogers, Kanti Jain
    Abstract:

    Carbon nanotube films were patterned by an excimer laser projection Photoablation process at low incident energy conditions. The carbon nanotubes were deposited on a quartz substrate and then a conventional photoresist was coated on it as a Photoablation assistor. The photoresist and the carbon nanotubes were simultaneously patterned by the projection Photoablation process, and then the photoresist was removed. It was possible to make clean patterns of carbon nanotubes even though the incident fluence on the carbon nanotubes was significantly lower than the threshold energy otherwise needed for their direct ablation.

  • Patterning of single walled carbon nanotubes using a low-fluence excimer laser Photoablation process
    Applied Physics Letters, 2008
    Co-Authors: Junghun Chae, Xinning Ho, John A Rogers, Kanti Jain
    Abstract:

    Carbon nanotubes (CNTs) have been researched as a possible important new component in various devices because they have a promising potential in applications such as microelectronic devices, sensors, actuators and optoelectronic devices. For the use of CNTs in such applications, especially in mass fabrication, a pattering process for CNT layers that is compatible with CMOS (Complementary Metal Oxide Semiconductor) processes is necessary. There have been some reports in the literature on the patterning of CNTs, but either the reported methods were not compatible with CMOS processes or the capability for precise control of the pattern geometry was not good. In this paper we describe a new patterning method that can be used in the fabrication of devices and other applications which use carbon nanotubes as a component material. This method also can be used in the patterning of other highly porous materials. Further, the process is compatible with conventional microelectronic fabrication processes and it is high-speed. Single walled carbon nanotube (SWNT) films were patterned by an excimer laser projection Photoablation process at low incident energy conditions. The CNTs were deposited on a quartz substrate, and then a conventional photoresist was coated on it as a Photoablation assistor. The photoresist and the CNTs were patterned simultaneously by the Photoablation process, and then the photoresist was removed. Due to the physical force of the ablation-dissociated photoresist fragments, the CNTs were patterned cleanly even though the incident fluence on them was significantly lower than the threshold energy otherwise needed for their direct ablation.

Luca Villa - One of the best experts on this subject based on the ideXlab platform.

  • which patients with upper tract urothelial carcinoma can be safely treated with conservative treatment by flexible ureteroscopy with holmium yag laser Photoablation long term results from a high volume institution
    The Journal of Urology, 2017
    Co-Authors: Steeve Doizi, Jonathan Cloutier, Umberto Capitanio, Luca Villa, M. Haddad, Alberto Briganti, Bhaskar K Somani, Andrea Salonia, Francesco Montorsi
    Abstract:

    Purpose We tested the effects of tumor size, distribution and grade on progression-free survival in patients with upper tract urothelial carcinoma treated with flexible ureteroscopy with Ho:YAG laser Photoablation. Materials and Methods Included in analysis were data on 92 consecutive patients with upper tract urothelial carcinoma treated with Ho:YAG laser Photoablation from 2003 to 2015 at a single tertiary care referral center. Stringent followup was offered according to EAU (European Association of Urology) guidelines. Progression during followup was defined by tumor upgrading, distant metastases and/or a relapsing tumor that could not be completely removed with a conservative approach. Kaplan-Meier curves were used to assess the rate of disease progression according to tumor size (1 or less cm vs greater than 1 cm), tumor distribution (unifocal vs multifocal) and tumor grade (low vs high). Cox regression analysis was done to test the impact of clinical and pathological characteristics on the rate of progression-free survival. Results At a median followup of 52 months (IQR 27.8–76.4) the progression-free survival rate was 68% vs 72% in patients with a tumor size of 1 or less vs greater than 1 cm (p = 0.9), 72% vs 69% in patients with unifocal vs multifocal lesions (p = 0.6) and 75% vs 52% in patients with a low vs a high grade tumor (p = 0.03). On multivariable Cox regression analysis tumor grade at first treatment was the only independent predictor of disease progression (HR 5.16, 95% CI 1.19–22.26, p = 0.03). Conclusions High tumor grade independently decreased progression-free survival in patients with upper tract urothelial carcinoma treated with Ho:YAG laser Photoablation. Tumor size greater than 1 cm and multifocality did not increase the risk of disease progression in patients treated conservatively with Ho:YAG laser Photoablation.

Cristian Metrangolo - One of the best experts on this subject based on the ideXlab platform.

Sergio Zaccaria Scalinci - One of the best experts on this subject based on the ideXlab platform.