Photonic Integrated Circuits

14,000,000 Leading Edge Experts on the ideXlab platform

Scan Science and Technology

Contact Leading Edge Experts & Companies

Scan Science and Technology

Contact Leading Edge Experts & Companies

The Experts below are selected from a list of 14601 Experts worldwide ranked by ideXlab platform

Masaki Kato - One of the best experts on this subject based on the ideXlab platform.

  • terabit s class inp Photonic Integrated Circuits
    Semiconductor Science and Technology, 2012
    Co-Authors: Radhakrishnan L. Nagarajan, Masaki Kato, P Evans, Damien Lambert, Scott W Corzine, Vikrant Lal, Jeffrey T. Rahn, Alan C. Nilsson, M. Fisher, Matthias Kuntz
    Abstract:

    In this paper, we review recent developments in the area of terabit/s?class monolithically Integrated, transmitter and receiver Photonic Integrated Circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

  • Terabit/s class InP Photonic Integrated Circuits
    Semiconductor Science and Technology, 2012
    Co-Authors: Radhakrishnan L. Nagarajan, Masaki Kato, Peter W. Evans, Damien Lambert, Scott W Corzine, Vikrant Lal, Jeffrey T. Rahn, Alan C. Nilsson, M. Fisher, Matthias Kuntz
    Abstract:

    In this paper, we review recent developments in the area of terabit/s?class monolithically Integrated, transmitter and receiver Photonic Integrated Circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

  • Coherent large-scale InP Photonic Integrated Circuits
    37th European Conference and Exposition on Optical Communications, 2011
    Co-Authors: F.a. Kish, Masaki Kato, R. Nagarajan, Peter W. Evans, Damien Lambert, Mehrdad Ziari, Scott W Corzine, Alan C. Nilsson, Jeff Rahn, Andrew G. Dentai
    Abstract:

    The current state-of-the-art for coherent large-scale InP multi-channel Photonic Integrated Circuits (PICs) is presented. These large-scale PICs integrate >400 functions onto a single monolithic InP chip and enable total bandwidths of >1 Tb/s per chip.

  • current status of large scale inp Photonic Integrated Circuits
    IEEE Journal of Selected Topics in Quantum Electronics, 2011
    Co-Authors: F Kish, Masaki Kato, Jacco Pleumeekers, S. Murthy, Mehrdad Ziari, Vikrant Lal, Alan C. Nilsson, R. Nagarajan, D Welch, P Evans
    Abstract:

    In this paper, the current state of the art for large-scale InP Photonic Integrated Circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly Integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.

  • Polarization multiplexed (D)QPSK InP receiver Photonic Integrated Circuits
    Optical Fiber Communication Conference National Fiber Optic Engineers Conference 2011, 2011
    Co-Authors: Radhakrishnan L. Nagarajan, Andrew G. Dentai, Masaki Kato, Jacco Pleumeekers, Damien Lambert, Vikrant Lal, Jeffrey T. Rahn, Huan-shang Tsai, Gilad Goldfarb, Matthias Kuntz
    Abstract:

    In this paper we review recent developments in the area of receiver Photonic Integrated Circuits for the implementation of polarization multiplexed (differentially coded), quadrature phase shift keying (DQPSK) transmission formats.

John E. Bowers - One of the best experts on this subject based on the ideXlab platform.

  • High-Performance Photonic Integrated Circuits on Silicon
    IEEE Journal of Selected Topics in Quantum Electronics, 2019
    Co-Authors: Roger Helkey, Adel A. M. Saleh, James F. Buckwalter, John E. Bowers
    Abstract:

    Heterogeneous integration of III–V semiconductor Photonics combined with silicon foundry technology enables low-cost, high-performance Photonic Integrated Circuits. Highly reliable lasers using epitaxial deposition of quantum dot lasers, with >100 years at 35 C have been demonstrated at University of California, Santa Barbara (UCSB) and can be manufactured at wafer scale. Reduction in the linewidth enhancement factor allows isolator-free operation. This technology enables cost-effective Photonic Integrated Circuits for applications such as microwave Photonics and data communications. Optical frequency synthesis with ∼1.5 Hz accuracy is demonstrated using heterogeneous integration. Silicon Photonics applications that will benefit from future heterogeneous integration are also demonstrated, including high dynamic range microwave Photonic links and optical switching technology that scales to hyperscale datacenters with hundreds of thousands of servers.

  • Quantum Dot Photonic Integrated Circuits on Silicon
    Conference on Lasers and Electro-Optics, 2018
    Co-Authors: John E. Bowers, Arthur C. Gossard, Daehwan Jung, Justin Norman, Yating Wan
    Abstract:

    Quantum dot lasers, amplifiers, modulators and photodetectors epitaxially grown on Si are promising for Photonic Integrated Circuits. Laser performance is improving rapidly with continuous-wave threshold currents below 1 mA, injection efficiency of 87% and output power of 185 mW at 20 °C. Reliability tests show an extrapolated mean-time-to-failure of more than a million hours. This represents a significant stride toward efficient, scalable, and reliable III-V lasers on Si substrates for Photonic Integrated Circuits that are compatible with CMOS foundries.

  • Evolution of Photonic Integrated Circuits
    2017 75th Annual Device Research Conference (DRC), 2017
    Co-Authors: John E. Bowers
    Abstract:

    Photonic Integrated Circuits (PICs) are evolving rapidly for applications from interconnects to sensors. We present the evolution of four different platforms for Photonic integration: pure III-V/InP, pure SOI (monolithic silicon Photonics), III-V heterogeneously Integrated on SOI (heterogeneous integration), and III-V epitaxially grown on silicon. Presently, thousands of optical devices are Integrated into PICs to achieve multiterabit per second transceivers, LIDARs, and chemical sensors.

  • Recent advances in silicon Photonic Integrated Circuits
    Next-Generation Optical Communication: Components Sub-Systems and Systems V, 2016
    Co-Authors: John E. Bowers, Tin Komljenovic, Michael L. Davenport, Jared Hulme, Alan Y. Liu, Christos T. Santis, Alexander Spott, Sudharsanan Srinivasan, Eric J. Stanton, Chong Zhang
    Abstract:

    We review recent breakthroughs in silicon Photonics technology and components and describe progress in silicon Photonic Integrated Circuits. Heterogeneous silicon Photonics has recently demonstrated performance that significantly outperforms native III-V components. The impact active silicon Photonic Integrated Circuits could have on interconnects, telecommunications, sensors and silicon electronics is reviewed.

  • Heterogeneous Silicon Photonic Integrated Circuits
    Journal of Lightwave Technology, 2016
    Co-Authors: Tin Komljenovic, Michael L. Davenport, Jared Hulme, Alan Y. Liu, Christos T. Santis, Alexander Spott, Sudharsanan Srinivasan, Eric J. Stanton, Chong Zhang, John E. Bowers
    Abstract:

    We review recent breakthroughs in the silicon Photonic technology and components, and describe progress in silicon Photonic Integrated Circuits. Heterogeneous silicon Photonics has recently demonstrated performance that significantly outperforms native III/V components. The impact active silicon Photonic Integrated Circuits could have on interconnects, telecommunications, sensors, and silicon electronics is reviewed.

P Evans - One of the best experts on this subject based on the ideXlab platform.

  • terabit s class inp Photonic Integrated Circuits
    Semiconductor Science and Technology, 2012
    Co-Authors: Radhakrishnan L. Nagarajan, Masaki Kato, P Evans, Damien Lambert, Scott W Corzine, Vikrant Lal, Jeffrey T. Rahn, Alan C. Nilsson, M. Fisher, Matthias Kuntz
    Abstract:

    In this paper, we review recent developments in the area of terabit/s?class monolithically Integrated, transmitter and receiver Photonic Integrated Circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

  • current status of large scale inp Photonic Integrated Circuits
    IEEE Journal of Selected Topics in Quantum Electronics, 2011
    Co-Authors: F Kish, Masaki Kato, Jacco Pleumeekers, S. Murthy, Mehrdad Ziari, Vikrant Lal, Alan C. Nilsson, R. Nagarajan, D Welch, P Evans
    Abstract:

    In this paper, the current state of the art for large-scale InP Photonic Integrated Circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly Integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.

  • large scale Photonic Integrated Circuits
    IEEE Journal of Selected Topics in Quantum Electronics, 2005
    Co-Authors: R. Nagarajan, Chester Joyner, J S Bostak, Vincent G Dominic, Andrew G. Dentai, Tim Butrie, R P Schneider, Masaki Kato, P Evans, Megan Kauffman
    Abstract:

    100-Gb/s dense wavelength division multiplexed (DWDM) transmitter and receiver Photonic Integrated Circuits (PICs) are demonstrated. The transmitter is realized through the integration of over 50 discrete functions onto a single monolithic InP chip. The resultant DWDM PICs are capable of simultaneously transmitting and receiving ten wavelengths at 10 Gb/s on a DWDM wavelength grid. Optical system performance results across a representative DWDM long-haul link are presented for a next-generation optical transport system using these large-scale PICs. The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption.

Damien Lambert - One of the best experts on this subject based on the ideXlab platform.

  • terabit s class inp Photonic Integrated Circuits
    Semiconductor Science and Technology, 2012
    Co-Authors: Radhakrishnan L. Nagarajan, Masaki Kato, P Evans, Damien Lambert, Scott W Corzine, Vikrant Lal, Jeffrey T. Rahn, Alan C. Nilsson, M. Fisher, Matthias Kuntz
    Abstract:

    In this paper, we review recent developments in the area of terabit/s?class monolithically Integrated, transmitter and receiver Photonic Integrated Circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

  • Terabit/s class InP Photonic Integrated Circuits
    Semiconductor Science and Technology, 2012
    Co-Authors: Radhakrishnan L. Nagarajan, Masaki Kato, Peter W. Evans, Damien Lambert, Scott W Corzine, Vikrant Lal, Jeffrey T. Rahn, Alan C. Nilsson, M. Fisher, Matthias Kuntz
    Abstract:

    In this paper, we review recent developments in the area of terabit/s?class monolithically Integrated, transmitter and receiver Photonic Integrated Circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

  • Coherent large-scale InP Photonic Integrated Circuits
    37th European Conference and Exposition on Optical Communications, 2011
    Co-Authors: F.a. Kish, Masaki Kato, R. Nagarajan, Peter W. Evans, Damien Lambert, Mehrdad Ziari, Scott W Corzine, Alan C. Nilsson, Jeff Rahn, Andrew G. Dentai
    Abstract:

    The current state-of-the-art for coherent large-scale InP multi-channel Photonic Integrated Circuits (PICs) is presented. These large-scale PICs integrate >400 functions onto a single monolithic InP chip and enable total bandwidths of >1 Tb/s per chip.

  • Polarization multiplexed (D)QPSK InP receiver Photonic Integrated Circuits
    Optical Fiber Communication Conference National Fiber Optic Engineers Conference 2011, 2011
    Co-Authors: Radhakrishnan L. Nagarajan, Andrew G. Dentai, Masaki Kato, Jacco Pleumeekers, Damien Lambert, Vikrant Lal, Jeffrey T. Rahn, Huan-shang Tsai, Gilad Goldfarb, Matthias Kuntz
    Abstract:

    In this paper we review recent developments in the area of receiver Photonic Integrated Circuits for the implementation of polarization multiplexed (differentially coded), quadrature phase shift keying (DQPSK) transmission formats.

  • InP-based Photonic Integrated Circuits: Technology and manufacturing
    2009 IEEE International Conference on Indium Phosphide & Related Materials, 2009
    Co-Authors: R. Schneider, Andrew G. Dentai, Jacco Pleumeekers, R. Muthiah, Sheila Hurtt, Damien Lambert, C.h. Joyner, V. Lal, Scott Corzine, S. Murthy
    Abstract:

    Large-scale InP-based Photonic Integrated Circuits were first introduced in 2004, representing over an order-of-magnitude increase in integration complexity for commercial InP devices. In this talk we will review recent developments and manufacturing of these novel components.

Radhakrishnan L. Nagarajan - One of the best experts on this subject based on the ideXlab platform.

  • terabit s class inp Photonic Integrated Circuits
    Semiconductor Science and Technology, 2012
    Co-Authors: Radhakrishnan L. Nagarajan, Masaki Kato, P Evans, Damien Lambert, Scott W Corzine, Vikrant Lal, Jeffrey T. Rahn, Alan C. Nilsson, M. Fisher, Matthias Kuntz
    Abstract:

    In this paper, we review recent developments in the area of terabit/s?class monolithically Integrated, transmitter and receiver Photonic Integrated Circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

  • Terabit/s class InP Photonic Integrated Circuits
    Semiconductor Science and Technology, 2012
    Co-Authors: Radhakrishnan L. Nagarajan, Masaki Kato, Peter W. Evans, Damien Lambert, Scott W Corzine, Vikrant Lal, Jeffrey T. Rahn, Alan C. Nilsson, M. Fisher, Matthias Kuntz
    Abstract:

    In this paper, we review recent developments in the area of terabit/s?class monolithically Integrated, transmitter and receiver Photonic Integrated Circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

  • Polarization multiplexed (D)QPSK InP receiver Photonic Integrated Circuits
    Optical Fiber Communication Conference National Fiber Optic Engineers Conference 2011, 2011
    Co-Authors: Radhakrishnan L. Nagarajan, Andrew G. Dentai, Masaki Kato, Jacco Pleumeekers, Damien Lambert, Vikrant Lal, Jeffrey T. Rahn, Huan-shang Tsai, Gilad Goldfarb, Matthias Kuntz
    Abstract:

    In this paper we review recent developments in the area of receiver Photonic Integrated Circuits for the implementation of polarization multiplexed (differentially coded), quadrature phase shift keying (DQPSK) transmission formats.

  • Large-Scale Photonic Integrated Circuits
    2007 IEEE 19th International Conference on Indium Phosphide & Related Materials, 2007
    Co-Authors: Radhakrishnan L. Nagarajan, Andrew G. Dentai, Masaki Kato, Jacco Pleumeekers, Atul Mathur, Peter W. Evans, A. Chen, Sheila Hurtt, Mark J. Missey, Damien Lambert
    Abstract:

    We review our work in the area of large scale InP Photonic Integrated Circuits (PIC). We will review dense wavelength division multiplexed (DWDM) transmitter and receiver PICs with up to 40 channels, and operating at data rates up to 40 Gbit/s.

  • Large-Scale DWDM Photonic Integrated Circuits
    Optical Amplifiers and Their Applications, 2005
    Co-Authors: Mehrdad Ziari, J S Bostak, Andrew G. Dentai, Tim Butrie, R P Schneider, Masaki Kato, Radhakrishnan L. Nagarajan, Charles H. Joyner, J. Back, T. Desikan
    Abstract:

    A review of high density, dense wavelength division multiplexed Photonic Integrated Circuits is presented. These Integrated Circuits have 10 channels or more with aggregate data rates up to 400Gbit/s.

Related terms

Photonic Integrated Circuits - 15 days free trial to Access Experts & Abstracts