The Experts below are selected from a list of 46425 Experts worldwide ranked by ideXlab platform

Dang H. Nguyen - One of the best experts on this subject based on the ideXlab platform.

Chia Yong Poo - One of the best experts on this subject based on the ideXlab platform.

  • stacked semiconductor package having Discrete Components
    2011
    Co-Authors: Chua Swee Kwang, Chia Yong Poo
    Abstract:

    A stacked semiconductor package includes a substrate and a plurality of semiconductor dice stacked on the substrate. Each semiconductor die includes a recess, and a Discrete Component contained in the recess encapsulated in a die attach polymer. The stacked semiconductor package also includes interconnects electrically connecting the semiconductor dice and Discrete Components, and an encapsulant encapsulating the dice and the interconnects.

  • semiconductor package having Discrete Components and system containing the package
    2010
    Co-Authors: Chua Swee Kwang, Chia Yong Poo
    Abstract:

    A semiconductor package includes a substrate having contacts, and a Discrete Component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a die attach polymer attaching the die to the substrate. The die includes a recess, and the Discrete Component is contained in the recess encapsulated in the die attach polymer. A method for fabricating the package includes the steps of: attaching the Discrete Component to the substrate, placing the die attach polymer on the Discrete Component and the substrate, pressing the die into the die attach polymer to encapsulate the Discrete Component in the recess and attach the die to the substrate, and then placing the die in electrical communication with the Discrete Component. An electronic system includes the semiconductor package mounted to a system substrate.

  • method for fabricating semiconductor packages with Discrete Components
    2010
    Co-Authors: Chua Swee Kwang, Chia Yong Poo
    Abstract:

    A semiconductor package includes a substrate having contacts, and a Discrete Component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a die attach polymer attaching the die to the substrate. The die includes a recess, and the Discrete Component is contained in the recess encapsulated in the die attach polymer. A method for fabricating the package includes the steps of: attaching the Discrete Component to the substrate, placing the die attach polymer on the Discrete Component and the substrate, pressing the die into the die attach polymer to encapsulate the Discrete Component in the recess and attach the die to the substrate, and then placing the die in electrical communication with the Discrete Component. An electronic system includes the semiconductor package mounted to a system substrate.

  • semiconductor packages and method for fabricating semiconductor packages with Discrete Components
    2008
    Co-Authors: Chua Swee Kwang, Chia Yong Poo
    Abstract:

    A semiconductor package includes a substrate having contacts, and a Discrete Component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a die attach polymer attaching the die to the substrate. The die includes a recess, and the Discrete Component is contained in the recess encapsulated in the die attach polymer. A method for fabricating the package includes the steps of: attaching the Discrete Component to the substrate, placing the die attach polymer on the Discrete Component and the substrate, pressing the die into the die attach polymer to encapsulate the Discrete Component in the recess and attach the die to the substrate, and then placing the die in electrical communication with the Discrete Component. An electronic system includes the semiconductor package mounted to a system substrate.

  • semiconductor package having die with recess and Discrete Component embedded within the recess
    2007
    Co-Authors: Chua Swee Kwang, Chia Yong Poo
    Abstract:

    A semiconductor package includes a substrate having contacts, and a Discrete Component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a die attach polymer attaching the die to the substrate. The die includes a recess, and the Discrete Component is contained in the recess encapsulated in the die attach polymer. A method for fabricating the package includes the steps of: attaching the Discrete Component to the substrate, placing the die attach polymer on the Discrete Component and the substrate, pressing the die into the die attach polymer to encapsulate the Discrete Component in the recess and attach the die to the substrate, and then placing the die in electrical communication with the Discrete Component. An electronic system includes the semiconductor package mounted to a system substrate.

S. P. Ghoshal - One of the best experts on this subject based on the ideXlab platform.

  • Optimal selection of Components value for analog active filter design using simplex particle swarm optimization
    International Journal of Machine Learning and Cybernetics, 2015
    Co-Authors: R. Kar, D. Mandal, S. P. Ghoshal
    Abstract:

    The simplex particle swarm optimization (Simplex-PSO) is a swarm intelligent based evolutionary computation method. Simplex-PSO is the hybridization of Nedler–Mead simplex method and particle swarm optimization (PSO) without the velocity term. The Simplex-PSO has fast optimizing capability and high computational precision for high-dimensionality functions. In this paper, Simplex-PSO is employed for selection of optimal Discrete Component values such as resistors and capacitors for fourth order Butterworth low pass analog active filter and second order State Variable low pass analog active filter, respectively. Simplex-PSO performs the dual task of efficiently selecting the Component values as well as minimizing the total design errors of low pass analog active filters. The Component values of the filters are selected in such a way so that they become E12/E24/E96 series compatible. The simulation results prove that Simplex-PSO efficiently minimizes the total design error to a greater extent in comparison with previously reported optimization techniques.

  • Particle Swarm Optimization with Aging Leader and Challengers for Optimal Design of Analog Active Filters
    Circuits Systems and Signal Processing, 2015
    Co-Authors: Bishnu Prasad De, D. Mandal, S. P. Ghoshal
    Abstract:

    Due to the manufacturing limitations, the task of optimal analog active filter design by hand is very difficult. Evolutionary computation may be a competent implement for automatic selection of optimal Discrete Component values such as resistors and capacitors for analog active filter design. This paper presents an efficient approach for optimal analog filter design considering different topologies and manufacturing series by selecting their Component values. The evolutionary optimization technique used is particle swarm optimization (PSO) with Aging Leader and Challenger (ALC-PSO). ALC-PSO performs the dual-task of efficiently selecting the Component values as well as minimizing the total design errors of low pass active filters. The Component values of the filters are selected in such a way so that they become E12/E24/E96 series compatible. The simulation results prove that ALC-PSO efficiently minimizes the total design error with respect to previously used optimization techniques.

A Taroni - One of the best experts on this subject based on the ideXlab platform.

  • uncalibrated integrable wide range single supply portable interface for resistance and parasitic capacitance determination
    Sensors and Actuators B-chemical, 2008
    Co-Authors: Andrea De Marcellis, A Depari, Giuseppe Ferri, A Flammini, D Marioli, Vincenzo Stornelli, A Taroni
    Abstract:

    Abstract In this paper an uncalibrated fully integrable interface for wide-range resistance determination is presented. The proposed circuit, which implements a resistance-to-time conversion, is able to reveal more than six decades of resistance values (from 100 KΩ to more than 100 GΩ), typical of some resistive gas sensors, as well as to determine the sensor parallel capacitive Component (in the order of few pF). The proposed front-end has been designed both to work with a single-supply voltage (3.3 V), so it is suitable in low-cost portable applications, and to simplify the integration in a standard CMOS technology together with the digital Components needed for the time measurement. Post-layout simulations on the designed integrated solution (in a standard CMOS technology) and experimental results, using a Discrete-Component prototype, both on passive Components and on real sensors (MoW-based metal oxide sensors) have shown high linearity and reduced percentage error with respect to the theoretical expectations.

Catherine Dehollain - One of the best experts on this subject based on the ideXlab platform.

  • A Discrete-Component Impulse-Radio Ultra-Wide Band (IR-UWB) receiver with I/Q demodulation
    2011 7th Conference on Ph.D. Research in Microelectronics and Electronics, 2011
    Co-Authors: James Colli-vignarelli, Alexander Feldman, Stephan Robert, Catherine Dehollain
    Abstract:

    We describe an Impulse-Radio Ultra-Wide Band (IR-UWB) receiver with I/Q demodulation made of commercial off-the-shelf Discrete Components. It is designed to be used in a UWB testbed for measurement and algorithm validation purposes. The central frequency of the UWB signals is 4.25 GHz with a bandwidth of 500 MHz. We have achieved a data-rate of 10 Mb/s. We experimentally validate the use of the I/Q demodulation in UWB localization. This paper can also be used as a starting point for implementing a custom IR-UWB I/Q receiver.